Umutwe: FOUP mu gukora Chip ni iki?

Ibikubiye muri iyi nyandiko

1. Incamake n'Imirimo y'ingenzi ya FOUP

2. Imiterere n'imiterere bya FOUP

3. Amabwiriza yo gushyira mu byiciro no gushyira mu bikorwa FOUP

4. Imikorere n'akamaro ka FOUP mu gukora ibikoresho bya semiconductors

5.​Imbogamizi za tekiniki n'Iterambere ry'ejo hazaza​

6.XKH's Ibisubizo byihariye n'Inkunga ya Serivisi​

Mu gikorwa cyo gukora ibikoresho bya semiconductor, Front Opening Unified Pod (FOUP) ni igikoresho cy'ingenzi gikoreshwa mu kurinda, gutwara no kubika wafers. Imbere muri yo hashobora kwakira ibice 25 bya wafers za 300mm, kandi ibice byayo by'ingenzi birimo igikoresho gifungurira imbere n'urugi rwabigenewe rwo gufungura no gufunga. FOUP ni igikoresho cy'ingenzi mu buryo bwikora bwo gutwara ibintu muri wafers za santimetero 12. Ubusanzwe itwarwa mu buryo bufunze kandi igafunguka gusa iyo isunitswe ku cyambu cy'ibikoresho, bigatuma wafers zimurirwa mu cyambu cy'ibikoresho cyo gupakira no gupakurura.

Igishushanyo cya FOUP gishingiye ku bidukikije bito. Gifite ahantu inyuma ho gushyira wafer, kandi umupfundikizo wakozwe by'umwihariko kugira ngo uhuze n'agapfundikizo k'ifungura. Roboti zikoresha wafer zikora ahantu hasukuye mu cyiciro cya mbere, zigenzura ko wafer zitanduye mu gihe cyo kohereza. Byongeye kandi, FOUP yimurirwa hagati y'ibikoresho byo gutunganya hakoreshejwe sisitemu yo gucunga ibikoresho yikora (AMHS). Wafer fabs zigezweho zikoresha sisitemu yo gutwara abantu hejuru y'ubutaka, mu gihe fabs nke zishaje zishobora gukoresha imodoka ziyobora zikoresheje ikoranabuhanga (AGVs) zikoresha ikoranabuhanga risanzwe.

FOUP ntituma gusa ihererekanya ry’ibinyampeke rya wafer rikorwa mu buryo bwikora, ahubwo inakora akazi ko kubika. Bitewe n’intambwe nyinshi zikorwa, ibinyampeke bishobora gufata amezi menshi kugira ngo birangize inzira yose y’ibikorwa. Iyo bihujwe n’umusaruro mwinshi wa buri kwezi, bivuze ko ibinyampeke ibihumbi mirongo biri mu nzu imwe bihora biri mu nzira cyangwa bibikwa by’agateganyo igihe icyo ari cyo cyose. Mu gihe cyo kubika, ibinyampeke bya FOUP bisukurwa buri gihe na azote kugira ngo hirindwe ko ibyanduye bigera kuri ibinyampeke, bigatuma habaho uburyo bwiza kandi bwizewe bwo kubitunganya.

1. Imirimo n'akamaro ka FOUP

Inshingano y'ingenzi ya FOUP ni ukurinda wafers gutungurwa no kwanduzwa n'ibintu byo hanze, cyane cyane kwirinda ingaruka ku musaruro mu gihe cyo kwimura. Irinda ubushuhe neza binyuze mu buryo nko gusohora imyuka no kugenzura ikirere (LAC), ikarinda wafers kuguma mu mutekano mu gihe hagitegerejwe intambwe ikurikira yo gukora. Sisitemu yayo ifunze kandi igenzurwa yemerera gusa ibintu n'ibintu bikenewe kwinjira, bigabanyije cyane ingaruka mbi za VOCs, ogisijeni, n'ubushuhe ku wafers.

Kubera ko FOUP yuzuyemo wafer 25 ishobora gupima ibiro 9, gutwara kwayo bigomba kwishingikiriza kuri sisitemu yo gucunga ibikoresho byikora (AMHS). Kugira ngo ibi bishoboke, FOUP yakozwe mu buryo butandukanye bwo guhuza ibyuma, imigozi, n'imyobo, kandi ifite tagi za RFID zoroshye kumenya no gushyira mu byiciro. Ubu buryo bwo gucunga bwikora busaba hafi ya bwose gukora n'intoki, bigabanya cyane amakosa kandi byongera umutekano n'ubunyangamugayo mu gukora.

2. Imiterere n'ishyirwa mu byiciro rya FOUP

Ingano zisanzwe za FOUP ni hafi mm 420 z'ubugari, mm 335 z'ubujyakuzimu, na mm 335 z'uburebure. Ibice by'ingenzi by'imiterere yayo birimo: OHT yo hejuru (umutwe w'ibihumyo) yo gutwara ibihumyo hejuru; Urugi rw'imbere rwo kwinjira mu bikoresho; Imikoki yo ku ruhande, akenshi ifite amabara atandukanye kugira ngo itandukane ahantu hakorerwa ibintu bifite urwego rutandukanye rw'ubwandu; Agace k'ikarita ko gushyiramo amakarita y'ubutumwa; n'agapapuro ko hasi ka RFID gatanga ikimenyetso cyihariye cya FOUP, gatuma ibikoresho n'ibihumyo hejuru biyimenya. Ishingiro rifite kandi imyobo ine yo kumenya no gushyiramo ibikoresho no gutandukanya ahantu hakorerwa ibintu.

Hashingiwe ku ikoreshwa, FOUP zigabanyijwemo ubwoko butatu: PRD (yo gukora), ENG (yo gukora wafers z’ubuhanga), na MON (yo gukora wafers z’igenzura). PRD FOUPs zishobora gukoreshwa mu gukora ibicuruzwa, ubwoko bwa ENG bukwiriye ubushakashatsi n’iterambere cyangwa igerageza, naho ubwoko bwa MON bwagenewe gukurikirana ibikorwa ku ntambwe nka CMP na DIFF. Ni ngombwa kumenya ko PRD FOUPs zishobora gukoreshwa haba muri ENG na MON, naho ubwoko bwa ENG bushobora gukoreshwa muri MON, ariko gukora inyuma bitera ingaruka mbi ku bwiza.

Ibyiciro bya FOUPs bishyirwa mu byiciro hakurikijwe urwego rw'ubwandu, bishobora kugabanywamo FE FOUP (uburyo bwo kurangira imbere, budafite icyuma), BE FOUP (uburyo bwo kurangira inyuma, burimo icyuma), n'ibyo byihariye mu buryo bwihariye bw'ibyuma nka NI FOUP, CU FOUP, na CO FOUP. Ibyiciro bya FOUPs mu buryo butandukanye akenshi bitandukanywa n'amabara y'imigozi yo ku ruhande cyangwa ibipande by'inzugi. Ibyiciro bya FOUPs mu buryo bwo kurangira imbere bishobora gukoreshwa mu buryo bwo kurangira inyuma, ariko FOUPs zo kurangira inyuma ntizigomba gukoreshwa mu buryo bwo kurangira imbere, kuko ibi byatera ibyago byo kwandura.

Nk’ikigo cy’ingenzi mu gukora ibikoresho bya semiconductor, FOUP, binyuze mu buryo bworoshye bwo gukora no kugenzura neza ubwandu, igenzura umutekano n’isuku bya wafers mu gihe cyo kuzikora, bigatuma ziba ibikorwa remezo by’ingenzi mu nganda zigezweho za wafers.

Umwanzuro

XKH yiyemeje guha abakiriya ibisubizo bya FOUP (Fore-Opening Unified Pod) byihariye cyane, byubahiriza cyane ibisabwa mu mikorere yawe n'ibipimo by'ibikoresho. Dukoresheje ikoranabuhanga rigezweho ry'ibikoresho n'uburyo bwo gukora neza, twemeza ko buri gicuruzwa cya FOUP gitanga umwuka mwiza, isuku, no kudahungabana mu ikoranabuhanga. Itsinda ryacu rya tekiniki rifite ubuhanga bukomeye mu nganda, ritanga ubufasha busesuye mu mikorere y'ubuzima - kuva ku nama zo guhitamo no kunoza imiterere kugeza ku isuku no kubungabunga - bishimangira ko FOUP na sisitemu yawe yo gucunga ibikoresho yikora (AMHS) ndetse n'ibikoresho byo gutunganya. Dushyira imbere umutekano wa wafers no kongera umusaruro w'umusaruro nk'intego zacu z'ingenzi. Binyuze mu bicuruzwa bishya na serivisi za tekiniki zikubiyemo byose, dutanga garanti ikomeye ku mikorere yawe ya semiconductor, amaherezo twongera umusaruro mwiza n'umusaruro w'umusaruro.