Umutwe: FOUP niki mugukora Chip?

Imbonerahamwe

1. Incamake n'imikorere yibanze ya FOUP

2. Imiterere n'ibishushanyo biranga FOUP

3.Gushyira mu bikorwa n'amabwiriza yo gusaba FOUP

4.Imikorere n'akamaro ka FOUP mugukora Semiconductor

5. Inzitizi za tekiniki hamwe niterambere ryigihe kizaza

6.XKH Igisubizo cyihariye hamwe ninkunga ya serivisi

Mubikorwa bya semiconductor, inzira yo gufungura imbere (FOUP) nikintu gikomeye gikoreshwa mukurinda, gutwara, no kubika wafer. Imbere yacyo irashobora kwakira ibice 25 bya 300mm ya wafers, kandi ibice byingenzi birimo ibikoresho bifungura imbere hamwe n'ikadiri yabugenewe yo gufungura no gufunga. FOUP niyitwara ryibanze muri sisitemu yo gutwara abantu muri 12inch wafer fabs. Ubusanzwe itwarwa muburyo bufunze kandi ifungura gusa iyo isunitswe ku cyambu cyikoreza ibikoresho, bigatuma wafer yimurirwa ku cyambu cyo gupakira / gupakurura ibikoresho.

Igishushanyo cya FOUP cyahujwe nibisabwa na micro-ibidukikije. Iranga ibibanza inyuma kugirango winjizemo wafer, kandi umupfundikizo wakozwe muburyo bwo guhuza clamp yo gufungura. Imashini zikoresha imashini zikorera mu cyiciro cya mbere cy’ikirere gisukuye, zemeza ko wafer itanduye mugihe cyoherejwe. Byongeye kandi, FOUP yimurwa hagati yibikoresho bitunganijwe hifashishijwe sisitemu yo gukoresha ibikoresho byikora (AMHS). Ibikoresho bya kijyambere bya wafer ahanini bikoresha sisitemu ya gari ya moshi hejuru yo gutwara abantu, mugihe fab nkeya zishaje zishobora gukoresha ibinyabiziga bishingiye ku butaka (AGVs).

FOUP ntabwo ituma gusa wafer yimurwa ahubwo ikora umurimo wo kubika. Bitewe nintambwe nyinshi zo gukora, wafer irashobora gufata amezi kugirango irangize inzira yose. Ufatanije nubunini bwo hejuru buri kwezi, ibi bivuze ko ibihumbi icumi bya wafer muri fab bihora mubitambuka cyangwa kubika by'agateganyo mugihe runaka. Mugihe cyo guhunika, FOUPs isukurwa rimwe na rimwe na azote kugirango birinde umwanda guhura na wafers, bigatuma umusaruro usukuye kandi wizewe.

1. Imikorere n'akamaro ka FOUP

Igikorwa cyibanze cya FOUP ni ukurinda wafer guhungabana hanze no kwanduza, cyane cyane kwirinda ingaruka kumusaruro mugihe cyo kwimura. Irinda neza ubuhehere binyuze muburyo nko gutunganya gaze no kugenzura ikirere (LAC), kwemeza ko wafer ikomeza kuba mumutekano mugihe hagitegerejwe intambwe ikurikira. Sisitemu yayo ifunze kandi igenzurwa yemerera gusa ibintu bikenewe hamwe nibintu byinjira, bikagabanya cyane ingaruka mbi za VOC, ogisijeni, nubushuhe kuri wafer.

Kubera ko FOUP yuzuye yuzuye wafer 25 ishobora gupima ibiro 9, ubwikorezi bwayo bugomba gushingira kuri Automatic Material Handling System (AMHS). Kugirango byorohereze ibi, FOUP yateguwe hamwe nuburyo butandukanye bwo guhuza amasahani, amapine, nu mwobo, kandi ifite ibikoresho bya elegitoroniki bya RFID kugirango byoroshye kumenyekana no gutondekanya. Uku gukoresha mu buryo bwikora bisaba ko nta ntoki zikorwa, kugabanya cyane igipimo cyamakosa no kuzamura umutekano nukuri kubikorwa byakozwe.

2. Imiterere no gutondekanya FOUP

Ibipimo bisanzwe bya FOUP ni mm 420 z'ubugari, mm 335 z'uburebure, na mm 335 z'uburebure. Ibyingenzi byingenzi byubaka birimo: hejuru ya OHT (umutwe wibihumyo) yo gutwara hejuru; Urugi rw'imbere kubikoresho bya wafer; Uruhande Uruhande, akenshi rufite amabara kugirango rutandukanye ahantu hamwe nuburyo butandukanye bwanduye; Agace k'ikarita yo gushyira amakarita y'ubutumwa; n'ikimenyetso cyo hasi ya RFID ikora nk'ikiranga kidasanzwe kuri FOUP, yemerera ibikoresho hamwe no kuzamura hejuru kubimenya. Shingiro kandi ifite ibikoresho bine biranga hamwe nu myanya yo guhuza kugirango ihuze nibikoresho no gutandukanya aho inzira ikorerwa.

Ukurikije imikoreshereze, FOUPs ishyizwe mubwoko butatu: PRD (kubyara umusaruro), ENG (kuri waferi yubuhanga), na MON (kuri wafer ya monitor). PRD FOUPs irashobora gukoreshwa mugukora ibicuruzwa, ubwoko bwa ENG burakwiriye R&D cyangwa ubushakashatsi, kandi ubwoko bwa MON bwahariwe kugenzura inzira kubikorwa nka CMP na DIFF. Ni ngombwa kumenya ko PRD FOUPs ishobora gukoreshwa haba muri ENG na MON, naho ubwoko bwa ENG bushobora gukoreshwa MON, ariko ibikorwa byinyuma bitera ingaruka nziza.

Urutonde rwanduye, FOUPs irashobora kugabanywa MU BUNTU BUNTU (inzira yimbere-yanyuma, idafite ibyuma), BE FOUP (inzira yinyuma-yanyuma, irimo ibyuma), hamwe ninzobere mubikorwa byihariye byicyuma nka NI FOUP, CU FOUP, na CO FOUP. FOUPs kubikorwa bitandukanye itandukanijwe nibara ryibara ryuruhande cyangwa imbaho ​​zumuryango. FOUP kuva imbere-iherezo irashobora gukoreshwa mubikorwa byinyuma, ariko FOUPs yinyuma ntigomba gukoreshwa mubikorwa byimbere, kuko ibi byatera ingaruka zanduye.

Nkumutwara wingenzi mubikorwa bya semiconductor, FOUP, binyuze mumashanyarazi menshi kandi ikagenzura cyane kwanduza, irinda umutekano nisuku ya wafer mugihe cyumusaruro, bigatuma ibikorwa remezo byingirakamaro muri fab wa kijyambere.

Umwanzuro

XKH yiyemeje guha abakiriya ibisubizo byihariye bya Front-Gufungura Uni Pod (FOUP) ibisubizo, byubahiriza byimazeyo ibisabwa byihariye nibikorwa byihariye. Twifashishije ikoranabuhanga rigezweho hamwe nuburyo bunoze bwo gukora, turemeza ko ibicuruzwa byose bya FOUP bitanga umuyaga udasanzwe, isuku, hamwe nubukanishi. Itsinda ryacu rya tekinike rifite ubumenyi bwimbitse mu nganda, ritanga ubufasha bwuzuye bwubuzima - kuva kugisha inama guhitamo no kunoza imiterere kugeza gukora isuku no kuyitaho - kureba uburyo bwo guhuza hamwe no gukorana neza hagati ya FOUP na Automatic Material Handling System (AMHS) hamwe nibikoresho byo gutunganya. Duhora dushyira imbere umutekano wa wafer no kuzamura umusaruro wibyakozwe nkintego zacu nyamukuru. Binyuze mu bicuruzwa bishya hamwe na serivisi zose zikubiyemo tekiniki, turatanga garanti ikomeye kubikorwa byawe bya semiconductor, amaherezo bizamura umusaruro numusaruro.