Ibikubiye muri iyi nyandiko
1. Imbogamizi yo gutwika ubushyuhe muri AI Chips n'Iterambere ry'ibikoresho bya Silicon Carbide
2. Imiterere n'Ibyiza bya Tekiniki bya Silikoni Carbide Substrates
3. Gahunda z'Ingamba n'Iterambere ry'Ubufatanye na NVIDIA na TSMC
4. Inzira yo gushyira mu bikorwa n'imbogamizi z'ingenzi za tekiniki
5.Ibyiza by'Isoko n'Ukwagura Ubushobozi
6. Ingaruka ku ruhererekane rw'ibicuruzwa n'imikorere y'ibigo bifitanye isano
7.Ikoreshwa ryagutse n'ingano rusange y'isoko rya Silicon Carbide
8. Ibisubizo bya XKH byihariye n'inkunga ku bicuruzwa
Imbogamizi yo gutwika ubushyuhe bw'udupira twa AI tuzaza irimo gutsindwa n'ibikoresho bya silicon carbide (SiC).
Nk’uko byatangajwe n’itangazamakuru ryo mu mahanga, NVIDIA irateganya gusimbuza ibikoresho bya substrate biri hagati mu buryo bwo gupakira bwa CoWoS mu buryo bugezweho bwo gutunganya ibikoresho byayo bya silicon carbide. TSMC yatumiye inganda zikomeye guteza imbere ikoranabuhanga ryo gukora ibikoresho bya SiC intermediate.
Impamvu nyamukuru ni uko kunoza imikorere ya chips za AI zigezweho byahuye n'imbogamizi zifatika. Uko imbaraga za GPU ziyongera, gushyira chips nyinshi muri silicon interposes bitanga icyifuzo gikomeye cyane cyo gukwirakwiza ubushyuhe. Ubushyuhe bukorerwa muri chips buri hafi kugera aho bugarukira, kandi silicon interposes zisanzwe ntizishobora gukemura iki kibazo neza.
Ibikoresho bya NVIDIA Processors Bihindura Ibikoresho Bikoresha Ubushyuhe! Ubusabe bwa Silicon Carbide Bugiye Guturika! Silicon Carbide ni semiconductor ifite uburebure bunini, kandi imiterere yayo yihariye iyiha inyungu zikomeye mu bidukikije bifite imbaraga nyinshi n'ubushyuhe bwinshi. Muri pakingi igezweho ya GPU, itanga inyungu ebyiri z'ingenzi:
1. Ubushobozi bwo gukwirakwiza ubushyuhe: Gusimbuza silicon interposes na SiC interposes bishobora kugabanya ubushyuhe ku kigero cya hafi 70%.
2. Imiterere y'Ingufu Ikora neza: SiC ituma habaho modules nto kandi zigenzura amashanyarazi, zigabanya cyane inzira zo gutanga amashanyarazi, zigabanya igihombo cya circuit, kandi zigatanga ibisubizo byihuse kandi bihamye by'amashanyarazi ku mitwaro ya AI.
Iri hinduka rigamije gukemura ibibazo byo gutwika ubushyuhe biterwa no kongera imbaraga za GPU buri gihe, ritanga igisubizo cyiza kurushaho ku bikoresho bya mudasobwa bifite imikorere myiza.
Uburyo bwo gutwara ubushyuhe bwa silicon carbide buri hejuru y’ubwa silicon inshuro 2-3, binongera imikorere myiza mu gucunga ubushyuhe no gukemura ibibazo byo gukwirakwiza ubushyuhe mu tumashini dukoresha ingufu nyinshi. Imikorere yatwo myiza y’ubushyuhe ishobora kugabanya ubushyuhe bw’utumashini dukoresha GPU ho dogere selisiyusi 20-30, bikongera cyane ubuziranenge mu mikorere ya mudasobwa nyinshi.
Inzira yo gushyira mu bikorwa n'imbogamizi
Dukurikije amasoko y’uruhererekane rw’ibikoresho, NVIDIA izashyira mu bikorwa iri hinduka ry’ibikoresho mu ntambwe ebyiri:
•2025-2026: Rubin GPU yo mu gisekuru cya mbere izakomeza gukoresha silicon interposer. TSMC yasabye inganda zikomeye guteza imbere ikoranabuhanga ryo gukora SiC interposer.
•2027: Imashini zikoresha SiC zizashyirwa ku mugaragaro mu buryo bugezweho bwo gupakira.
Ariko, iyi gahunda ihura n'imbogamizi nyinshi, cyane cyane mu nganda. Ubukana bwa silicon carbide bugereranywa n'ubwa diyama, busaba ikoranabuhanga ryo gukata cyane. Iyo ikoranabuhanga ryo gukata ridahagije, ubuso bwa SiC bushobora kuba bumeze nk'ubugondo, bigatuma butakoreshwa mu gupakira ibintu bigezweho. Inganda zikora ibikoresho nka DISCO yo mu Buyapani ziri gukora ibishoboka byose kugira ngo zitegure ibikoresho bishya byo gukata laser kugira ngo zikemure iki kibazo.
Ibyiza by'ejo hazaza
Ubu, ikoranabuhanga rya SiC interposer rizakoreshwa bwa mbere muri chips zigezweho za AI. TSMC irateganya gutangiza CoWoS ya 7x reticle mu 2027 kugira ngo ihuze poroseseri nyinshi na memory, yongera ubuso bwa interposer bugere kuri mm² 14,400, ibi bizatuma abantu benshi bakenera substrates.
Morgan Stanley ateganya ko ubushobozi bwo gupakira bwa CoWoS buri kwezi ku isi buzava ku 38.000 wafers 12-inch mu 2024 bukagera ku 83.000 mu 2025 na 112.000 mu 2026. Iri zamuka rizongera cyane ubwinshi bw'ibikoresho bya SiC interposes.
Nubwo substrates za SiC za santimetero 12 zihenze muri iki gihe, ibiciro byitezwe ko bizagenda bigabanuka buhoro buhoro kugeza ku rwego rukwiye uko umusaruro uzamuka cyane n'ikoranabuhanga rigenda rikura, bigatuma habaho uburyo bwo gukoresha ibikoresho binini.
SiC interposers ntizikemura ibibazo byo gukwirakwiza ubushyuhe gusa, ahubwo zinanoza cyane ubucucike bw'ibikoresho byo guhuza. Ubuso bwa SiC substrates bwa santimetero 12 buruta hafi 90% ubunini bwa santimetero 8, bigatuma interposer imwe ishobora guhuza modules nyinshi za Chiplet, ishyigikira neza ibisabwa na NVIDIA byo gupakira CoWoS ya 7x reticle.
TSMC irimo gukorana n'amasosiyete yo mu Buyapani nka DISCO mu guteza imbere ikoranabuhanga ryo gukora SiC interposer. Igihe ibikoresho bishya bizaba bimaze gushyirwaho, gukora SiC interposer bizagenda neza, kandi biteganijwe ko bizatangira vuba mu gupakira ibikoresho bigezweho mu 2027.
Bitewe n’iyi nkuru, imigabane ijyanye na SiC yazamutse cyane ku ya 5 Nzeri, aho igipimo cy’imigabane cyazamutseho 5.76%. Ibigo nka Tianyue Advanced, Luxshare Precision, na Tiantong Co. byageze ku mubare ntarengwa w’ibiciro bya buri munsi, mu gihe Jingsheng Mechanical & Electrical na Yintang Intelligent Control byazamutseho 10%.
Nk’uko ikinyamakuru Daily Economic News kibitangaza, kugira ngo cyongere imikorere, NVIDIA irateganya gusimbuza ibikoresho byo hagati mu buryo bwo gupakira bwa CoWoS hamwe na silicon carbide mu gishushanyo mbonera cyayo gishya cyo guteza imbere poroseseri ya Rubin.
Amakuru rusange agaragaza ko karuboni ya silikoni ifite imiterere myiza cyane. Ugereranyije n'ibikoresho bya silikoni, ibikoresho bya SiC bitanga ibyiza nko kuba bifite ingufu nyinshi, gutakaza ingufu nke, no kudahungabana cyane mu bushyuhe bwinshi. Nk'uko Tianfeng Securities ibitangaza, uruhererekane rw'inganda za SiC rukubiyemo gutegura substrates za SiC na wafers za epitaxial; hagati harimo igishushanyo, gukora, no gupakira/gupima ibikoresho by'amashanyarazi bya SiC n'ibikoresho bya RF.
Munsi y’aho, porogaramu za SiC ni nyinshi, zikora ku nganda zirenga icumi, harimo imodoka nshya zikoresha ingufu, amashanyarazi aturuka kuri fotovoltaiki, inganda zikora, ubwikorezi, sitasiyo z’itumanaho, na radar. Muri izi porogaramu, imodoka zizaba ingenzi kuri SiC. Nk’uko Aijian Securities ibitangaza, bitarenze 2028, urwego rw’imodoka ruzaba rufite 74% by’isoko ry’ibikoresho by’amashanyarazi bya SiC ku isi.
Ku bijyanye n'ingano y'isoko muri rusange, nk'uko Yole Intelligence ibitangaza, ingano y'isoko mpuzamahanga rya SiC substrate ritwara amashanyarazi n'iry'amashanyarazi yari miliyoni 512 na miliyoni 242, uko bikurikirana, mu 2022. Biteganijwe ko mu 2026, ingano y'isoko mpuzamahanga rya SiC izagera kuri miliyari 2.053, aho isoko rya SiC substrate ritwara amashanyarazi n'iry'amashanyarazi ritwara amashanyarazi rigera kuri miliyari 1.62 na miliyoni 433 z'amadolari. Igipimo cy'izamuka ry'ubukungu ku mwaka (CAGRs) ku bikoresho bya SiC bitwara amashanyarazi n'iry'amashanyarazi kuva mu 2022 kugeza mu 2026 biteganijwe ko bizaba kuri 33.37% na 15.66%.
XKH Yihariye mu Iterambere ryihariye no kugurisha ibicuruzwa bya Silicon Carbide (SiC) ku Isi, itanga ingano yuzuye ya santimetero 2 kugeza kuri 12 ku bikoresho bya silicon carbide bitwara amashanyarazi ndetse n’ibice bikingira amashanyarazi. Dushyigikira uburyo bwihariye bwo guhindura ibipimo nko kwerekeza kuri kristale, resistivity (10⁻³–10¹⁰ Ω·cm), n'ubugari (350–2000μm). Ibicuruzwa byacu bikoreshwa cyane mu bintu bigezweho birimo imodoka nshya zikoresha ingufu, inverters za photovoltaic, na moteri z'inganda. Dukoresheje sisitemu ikomeye yo gutanga ibicuruzwa n'itsinda rishinzwe ubufasha bwa tekiniki, dutanga igisubizo cyihuse kandi gitanga serivisi neza, dufasha abakiriya kunoza imikorere y'ibikoresho no kunoza ikiguzi cya sisitemu.
Igihe cyo kohereza ubutumwa: 12 Nzeri 2025