Mu iterambere ry’inganda za semiconductor riri gutera imbere, kristu imwe irasenyutseuduce twa silikonibigira uruhare runini. Bikora nk'ibikoresho by'ibanze mu gukora ibikoresho bitandukanye by'ikoranabuhanga. Kuva ku miyoboro igoranye kandi ihamye kugeza ku mikorosiporo yihuta cyane na sensor zikora ibintu byinshi, zikozwe mu cyuma kimwe gishyushyeuduce twa silikonini ingenzi. Itandukaniro mu mikorere yabyo n'ibipimo byabyo bigira ingaruka zitaziguye ku bwiza n'imikorere y'ibicuruzwa bya nyuma. Dore ibipimo rusange n'ibipimo bya wafers za silikoni zikozwe muri kristalo imwe:

Ingano: Ingano ya wafers za silikoni imwe ya semiconductor ipimwa n'umurambararo wazo, kandi ziza mu buryo butandukanye. Ubwinshi busanzwe burimo santimetero 50.8, santimetero 76.2, santimetero 4 (100mm), santimetero 5 (125mm), santimetero 6 (150mm), santimetero 8 (200mm), santimetero 300, na santimetero 450). Ubwinshi butandukanye bukwiranye n'ibikenewe mu musaruro n'ibikenewe mu mikorere. Urugero, wafers nto zikoreshwa mu bikoresho bito bito, by'ikoranabuhanga riciriritse, mu gihe wafers nini zigaragaza umusaruro mwiza kandi zigura ikiguzi mu nganda nini zikora circuit. Ibisabwa ku buso bishyirwa mu byiciro nka single-side polished (SSP) na double-side polished (DSP). Wafers za polished zo ku ruhande rumwe zikoreshwa ku bikoresho bisaba ubugari ku ruhande rumwe, nka sensor zimwe na zimwe. Wafers za polished zo ku ruhande rumwe zikoreshwa mu bikoresho bisaba ubuziranenge buhanitse n'ibindi bicuruzwa bisaba ubuziranenge buhanitse ku buso bwombi. Ibisabwa ku buso (Irangizwa): SSP ikozwe mu ruhande rumwe / DSP ikozwe mu mpande ebyiri.

Ubwoko/Ikintu gikoreshwa: (1) Semiconductor yo mu bwoko bwa N: Iyo atome zimwe na zimwe z’umwanda zinjijwe muri semiconductor y’imbere, zihindura uburyo zitwara. Urugero, iyo ibintu bya pentavalent nka azote (N), fosifore (P), arsenic (As), cyangwa antimoni (Sb) byongewemo, electron zabo za valence zigira imigozi ya covalent hamwe na electron za valence za atome za silicon zikikije, bigatuma electron y’inyongera idahambiriwe n’umugozi wa covalent. Ibi bituma electron irenga umugozi, bigakora semiconductor yo mu bwoko bwa N, izwi kandi nka semiconductor yo mu bwoko bwa electron. Semiconductor zo mu bwoko bwa N ni ingenzi mu gukora ibikoresho bisaba electron nk’ibikoresho by’ingenzi bitwara umuriro, nk’ibikoresho bimwe na bimwe by’ingufu. (2) Semiconductor yo mu bwoko bwa P: Iyo ibintu by’umwanda bya trivalent nka boron (B), gallium (Ga), cyangwa indium (In) byinjijwe muri semiconductor ya silicon, electron za valence za atome z’umwanda zigira imigozi ya covalent hamwe na atome za silicon zikikije, ariko zibura nibura electron imwe ya valence kandi ntizishobora gukora umugozi wuzuye wa covalent. Ibi bituma habaho ubwinshi bw'umwobo buruta ubwinshi bwa electron, bigatuma habaho semiconductor yo mu bwoko bwa P, izwi kandi nka semiconductor yo mu bwoko bwa hole. Semiconductor zo mu bwoko bwa P zigira uruhare runini mu gukora ibikoresho aho utwobo tuba ari two dutwara charge nyamukuru, nka diode na transistors zimwe na zimwe.

Ubudahangarwa: Ubudahangarwa ni ingano y'ingenzi ipima imikorere y'amashanyarazi ya wafers za silikoni imwe ikoze mu buryo bwa crystal. Agaciro kayo kagaragaza imikorere y'ibikoresho. Uko ubudahangarwa buri hasi, ni ko ubudahangarwa bwa wafers za silikoni burushaho kuba bwiza; ku rundi ruhande, uko ubudahangarwa buri hejuru, ni ko ubudahangarwa buba bubi kurushaho. Ubudahangarwa bwa wafers za silikoni buterwa n'imiterere yazo, kandi ubushyuhe nabwo bugira ingaruka zikomeye. Muri rusange, ubushobozi bwo kudahangarwa bwa wafers za silikoni bwiyongera uko ubushyuhe bugenda bushira. Mu mikoreshereze ifatika, ibikoresho bitandukanye bya elegitoroniki bifite ibisabwa bitandukanye byo kudahangarwa kuri wafers za silikoni. Urugero, wafers zikoreshwa mu nganda zikora amashami ahuza imiyoboro zikenera kugenzura neza uburyo zikoreshwa kugira ngo zigire imikorere ihamye kandi yizewe.

Icyerekezo: Icyerekezo cya kristalo cya wafer kigaragaza icyerekezo cya kristalografiya cya lattice ya silicon, ubusanzwe kigaragazwa n'ibipimo bya Miller nka (100), (110), (111), nibindi. Icyerekezo gitandukanye cya crystal gifite imiterere itandukanye, nko kuba umurongo w'ubucucike, gitandukana bitewe n'icyerekezo. Iri tandukaniro rishobora kugira ingaruka ku mikorere ya wafer mu ntambwe zikurikiraho zo gutunganya no ku mikorere ya nyuma y'ibikoresho bya elegitoroniki. Mu gikorwa cyo gukora, guhitamo wafer ya silicon ifite icyerekezo gikwiye hakurikijwe ibisabwa bitandukanye by'ibikoresho bishobora kunoza imikorere y'igikoresho, kunoza imikorere myiza, no kongera ireme ry'ibicuruzwa.

Ifunze/Ifunze: Ifunze ifunze (Ifunze) cyangwa V-notch (Ifunze) ku muzenguruko wa silicon wafer igira uruhare runini mu guhuza icyerekezo cya kristu kandi ni ikimenyetso cy'ingenzi mu gukora no gutunganya wafer. Wafers zifite uburebure butandukanye zihuye n'ibipimo bitandukanye by'uburebure bwa Flat cyangwa Notch. Ifunze zifunze zigabanyijemo ibice by'ibanze bifunze n'iby'inyongera. Ifunze y'ibanze ikoreshwa cyane cyane mu kugena icyerekezo cy'ibanze cya kristu n'icyerekezo cyo gutunganya wafer, mu gihe ifunze y'inyongera ifasha mu guhuza no gutunganya neza, igenzura imikorere myiza n'uburyo wafer ikora neza mu murongo wose w'umusaruro.

Ubunini: Ubunini bwa wafer bukunze kugaragazwa muri mikorometero (μm), aho ubunini busanzwe buri hagati ya 100μm na 1000μm. Wafer z'ubunini butandukanye zikwiriye ubwoko butandukanye bw'ibikoresho bya elegitoroniki. Wafer zoroheje (urugero, 100μm - 300μm) zikunze gukoreshwa mu gukora chips zisaba kugenzura neza ubunini, kugabanya ingano n'uburemere bwa chips no kongera ubucucike bwo guhuza. Wafer z'ubunini (urugero, 500μm - 1000μm) zikoreshwa cyane mu bikoresho bisaba imbaraga nyinshi za mekanike, nk'ibikoresho bya semiconductor by'ingufu, kugira ngo bigerweho neza mu gihe cyo gukora.

Ubukana bw'ubuso: Ubukana bw'ubuso ni kimwe mu bipimo by'ingenzi mu gusuzuma ubwiza bwa wafer, kuko bigira ingaruka ku buryo butaziguye ku buryo wafer ifatana n'ibikoresho byayo bya firime yoroheje, ndetse n'imikorere y'amashanyarazi y'igikoresho. Akenshi igaragazwa nk'ubukana bw'igipimo cy'ibanze (RMS) (muri nm). Ubukana bw'ubuso bwo hasi busobanura ko ubuso bwa wafer buba bworoshye, bifasha kugabanya ibintu nko gukwirakwira kwa electron no kunoza imikorere n'ubwizigirwa by'igikoresho. Mu buryo bugezweho bwo gukora semiconductor, ibisabwa ku bukana bw'ubuso birimo kugenda birushaho gukomera, cyane cyane ku nganda zikora amashanyarazi menshi, aho ubukana bw'ubuso bugomba kugenzurwa kugeza kuri nanometero nke cyangwa ndetse no munsi.

Ihindagurika ry'Ubunini Rusange (TTV): Ihindagurika ry'ubunini bwose rigaragaza itandukaniro riri hagati y'ubunini ntarengwa n'ubunini buke bupimirwa ahantu henshi ku buso bwa wafer, bukunze kugaragara muri μm. TTV nyinshi ishobora gutera ihindagurika mu bikorwa nko gufotora no gushushanya, bigira ingaruka ku mikorere y'igikoresho no ku musaruro wacyo. Kubwibyo, kugenzura TTV mu gihe cyo gukora wafer ni intambwe y'ingenzi mu kwemeza ubuziranenge bw'ibicuruzwa. Ku gukora ibikoresho bya microelectronics neza cyane, TTV isabwa kuba iri hagati ya mikorometero nke.

Umuheto: Umuheto yerekeza ku kunyura hagati y'ubuso bwa wafer n'uburebure bukwiye, busanzwe bupimirwa muri μm. Imiheto ifite ubugari bukabije ishobora gucika cyangwa ikagira stress zitangana mu gihe cyo gutunganya nyuma, bigira ingaruka ku musaruro n'ubwiza bw'umusaruro. Cyane cyane mu bikorwa bisaba ubugari buhanitse, nka fotolithography, ubugari bugomba kugenzurwa mu rugero runaka kugira ngo hamenyekane neza kandi ko imiterere ya fotolithography ihamye.

Ifumbire: Ifumbire yerekana itandukaniro riri hagati y’ubuso bwa wafer n’imiterere ikwiye y’uruziga, nabyo bipimwe muri μm. Kimwe n’umugongo, ifumbire ni ikimenyetso cy’ingenzi cy’ubugari bwa wafer. Ifumbire ikabije ntigira ingaruka gusa ku buryo wafer ishyirwa mu bikoresho bitunganya, ahubwo ishobora no guteza ibibazo mu gihe cyo gupakira chip, nko guhuza chip n’ibikoresho bipakira, ibyo bigatuma igikoresho kidakora neza. Mu nganda zikora semiconductor zigezweho, ibisabwa kuri warp birarushaho gukomera kugira ngo bihuze n’ibisabwa mu nganda zikora chip no gupakira chip.

Imiterere y'inkombe: Imiterere y'inkombe y'ifi ya wafer ni ingenzi cyane mu kuyitunganya no kuyikoresha nyuma yaho. Ubusanzwe igenwa na Edge Exclusion Zone (EEZ), igena intera iri hagati y'inkombe y'ifi ya wafer aho bitagomba gutunganywa. Imiterere y'inkombe yakozwe neza hamwe n'igenzura rya EEZ rihamye bifasha kwirinda inenge z'inkombe, ubwinshi bw'imihangayiko, n'ibindi bibazo mu gihe cyo kuyitunganya, bikongera ubwiza n'umusaruro wa wafer muri rusange. Mu buryo bumwe na bumwe bugezweho bwo gukora, ubwiza bw'inkombe busabwa kugira ngo bube ku rwego rwa sub-micron.

Umubare w'uduce duto: Umubare n'ingano y'uduce duto ku buso bwa wafer bigira ingaruka zikomeye ku mikorere y'ibikoresho bya elegitoroniki. Uduce twinshi cyangwa tunini dushobora gutuma ibikoresho binanirwa gukora, nko gufunga amazi cyangwa gusohora amazi, bigatuma umusaruro ugabanuka. Kubwibyo, umubare w'uduce duto upimwa habanje kubarwa uduce duto kuri buri gice, urugero nk'umubare w'uduce turenze 0.3μm. Gugenzura neza umubare w'uduce duto mu gihe cyo gukora wafer ni igipimo cy'ingenzi cyo kwemeza ubuziranenge bw'ibicuruzwa. Ikoranabuhanga rigezweho ryo gusukura n'ahantu hasukuye bikoreshwa kugira ngo bigabanye kwanduza uduce duto ku buso bwa wafer.

Ibijyanye n'umusaruro

Ifu ya Silicone Wafer imwe ya Crystal Si Substrate Ubwoko bwa N/P Ifu ya Silicon Carbide Wafer idakenewe

FZ CZ Si wafer iri mu bubiko bwa Silicon wafer ya santimetero 12 Prime cyangwa Test