Amakuru - TSMC yafunze Silicon Carbide ya santimetero 12 kuri New Frontier, ishyirwa mu bikorwa ry’ingamba mu bikoresho by’ingenzi byo gucunga ubushyuhe bya AI Era

Ibikubiye muri iyi nyandiko

1. Impinduka mu ikoranabuhanga: Izamuka rya Silicon Carbide n'imbogamizi zayo

2. Impinduka mu Ngamba za TSMC: Kuva muri GaN no Gutega kuri SiC

3. Irushanwa ry'ibikoresho: Kudasimburwa kwa SiC

4. Imiterere y'Ikoreshwa: Impinduramatwara mu Gucunga Ubushyuhe muri AI Chips na Next-Gen Electronics

5. Imbogamizi z'ejo hazaza: Imbogamizi za tekiniki n'irushanwa ry'inganda

Nk’uko TechNews ibivuga, inganda z’ibikoresho bya semiconductor ku isi zinjiye mu gihe gishingiye ku bwenge bw’ubukorano (AI) na mudasobwa ikora neza (HPC), aho imicungire y’ubushyuhe yagaragaye nk’imbogamizi ikomeye igira ingaruka ku miterere y’ibikoresho bya chips n’iterambere mu mikorere. Mu gihe imiterere ihanitse yo gupakira nka 3D stacking na 2.5D ikomeje kongera ubucucike bw’ibikoresho bya chips n’ikoreshwa ry’ingufu, ibikoresho gakondo bya ceramic ntibishobora kongera ibyifuzo by’ubushyuhe. TSMC, uruganda rukora ibikoresho bya wafer ku isi, rurimo gusubiza iki kibazo mu buryo bukomeye: rukurikiza byuzuye ibikoresho bya silicon carbide (SiC) bya santimetero 12 mu gihe buhoro buhoro ruva mu bucuruzi bwa gallium nitride (GaN). Iki gikorwa ntikigaragaza gusa ko habayeho gusubiramo ingamba z’ibikoresho bya TSMC, ahubwo kinagaragaza uburyo imicungire y’ubushyuhe yahindutse kuva ku "ikoranabuhanga rishyigikira" ikagera ku "inyungu y’ingenzi mu irushanwa."

Karubide ya Silicone: Irenze Ingufu z'Ikoranabuhanga

Karubide ya silicon izwiho ubushobozi bwayo bunini bwo gukoresha bandgap semiconductor, ubusanzwe yakoreshwaga mu bikoresho by'ikoranabuhanga bikoresha ingufu zihagije nka inverters z'amashanyarazi, moteri z'inganda, n'ibikorwa remezo by'ingufu zisubira. Ariko, ubushobozi bwa SiC burenze ibi. Ifite ubushobozi budasanzwe bwo gutwara ubushyuhe bwa 500 W/mK—iruta cyane ibintu bisanzwe bya keramike nka aluminium oxyde (Al₂O₃) cyangwa safiro—SiC ubu yiteguye gukemura ibibazo by'ubushyuhe bikomeje kwiyongera mu mikoreshereze y'ubushyuhe bwinshi.

Ingufu zo kwihutisha ubushyuhe (AI Accelerators)

Ubwiyongere bw'ibikoresho bikoresha ikoranabuhanga rya AI, ibyuma bitunganya amakuru, n'indorerwamo za AR byarushijeho kwiyongera ku mbogamizi z'ahantu ndetse n'ibibazo byo gucunga ubushyuhe. Urugero, mu bikoresho byambarwa, ibice bya microchip biri hafi y'amaso bisaba kugenzura neza ubushyuhe kugira ngo bigenzure umutekano n'ituze. Ikoresheje uburambe bwayo bw'imyaka myinshi mu gukora wafer ya santimetero 12, TSMC irimo guteza imbere substrates za SiC zo mu gace kanini kugira ngo zisimbuze ibikoresho bisanzwe bya ceramic. Iyi ngamba ituma habaho guhuza neza imiyoboro isanzwe y'umusaruro, kuringaniza umusaruro n'inyungu z'ikiguzi bitabaye ngombwa ko ivugurura burundu mu nganda.

Imbogamizi za tekiniki n'udushyaEse?

Nubwo ibikoresho bya SiC byo gucunga ubushyuhe bidasaba amahame akaze y’ubusembwa bw’amashanyarazi asabwa n’ibikoresho by’amashanyarazi, ubuziranenge bwa kristale buracyari ingenzi cyane. Ibintu byo hanze nk'umwanda cyangwa stress bishobora kubangamira uburyo bwo kohereza phonon, kwangiza imikorere y’ubushyuhe, no gutera ubushyuhe bwinshi, amaherezo bigira ingaruka ku mbaraga za mekanike no ku buryo ubuso butoshye. Ku bikoresho bya santimetero 12, warpage na deformation ni ibintu by'ingenzi cyane, kuko bigira ingaruka ku buryo butaziguye ku guhuza chips no ku musaruro uhanitse wo gupakira. Bityo, intego y’inganda yavuye ku gukuraho ubusembwa bw’amashanyarazi igera ku kwemeza ko ubucucike bungana, porosity nke, no kungana kw’ubuso bwinshi—ibisabwa kugira ngo SiC ikore ibintu byinshi bishyushye.

Ese?Uruhare rwa SiC mu gupakira ibintu mu buryo buhanitse

Uruvange rwa SiC rw’ubushyuhe bwinshi, gukomera kwa mekanike, no kudashyuha cyane rubigaragaza nk'ikintu cyahinduye byinshi mu gupakira 2.5D na 3D:

Guhuza 2.5D:Udupira dushyirwa kuri silicon cyangwa organic interposer dufite inzira ngufi kandi zikora neza. Ibibazo byo gukwirakwiza ubushyuhe hano ahanini ni urwego rwo hejuru.
Guhuza 3D:Uduce duto dushyizwe mu buryo bugororotse binyuze mu buryo bwa through-silicon vias (TSVs) cyangwa hybrid bonding bigira ubucucike bwinshi bwo guhuza ariko bihura n'umuvuduko w'ubushyuhe. SiC ntabwo ikora gusa nk'ibikoresho bishyushya bidakora ahubwo inakorana n'ibisubizo bigezweho nka diyama cyangwa icyuma gikoze mu mazi kugira ngo habeho sisitemu zo "gukonjesha bivanze".

Ese?Gusohoka mu buryo bw'ingamba muri GaN

TSMC yatangaje ko iteganya guhagarika ibikorwa bya GaN bitarenze 2027, yimurira umutungo kuri SiC. Iki cyemezo kigaragaza impinduka mu buryo bw’ingamba: nubwo GaN ikora neza mu gukoresha inshuro nyinshi, ubushobozi bwose bwa SiC mu gucunga ubushyuhe n’ubushobozi bwo kwaguka bihuye neza n’icyerekezo cy’igihe kirekire cya TSMC. Impinduka mu gukoresha wafers za santimetero 12 zisezeranya kugabanya ikiguzi no kunoza uburyo bwo gukora ibintu, nubwo hari ibibazo mu gukata, gusya no gushyira mu byiciro.

Hirya y'imodoka: Imbibi Nshya za SiC

Mu mateka, SiC yakoreshwaga nk'ibikoresho by'amashanyarazi by'imodoka. Ubu, TSMC irimo kuvugurura uburyo ikoreshwa:

SiC yo mu bwoko bwa N ikoresha amashanyarazi:Ikora nk'ibikoresho byo gukwirakwiza ubushyuhe mu byuma bikoresha ikoranabuhanga rya AI (AI accelerators) na poroseseri zifite imikorere myiza.
SiC irinda ubushyuhe:Ikora nk'ibikoresho byo gushyiramo ibikoresho mu miterere ya chiplet, ihuza uburyo amashanyarazi ashyirwa mu buryo butandukanye n'uburyo ubushyuhe butwara.

Ubu buvumbuzi bushyira SiC nk'igikoresho cy'ibanze cyo gucunga ubushyuhe muri AI na chips zo mu bigo by'amakuru.

Ese?Imiterere y'Ibikoresho

Nubwo diyama (1.000–2.200 W/mK) na graphene (3.000–5.000 W/mK) bitanga ubushobozi bwo gutwara ubushyuhe bwinshi, ikiguzi cyabyo gihanitse n'imbogamizi zo kwaguka bibangamira ikoreshwa ryabyo rusange. Ubundi buryo nko guhuza icyuma gikoze mu mazi cyangwa microfluidic cooling face hamwe n'imbogamizi ku giciro. "Ikintu cyiza" cya SiC—guhuza imikorere, imbaraga za mekanike, n'ubushobozi bwo gukora—bituma iba igisubizo gifatika cyane.

Ese?

Uburyo bwo guhatana bwa TSMC

Ubuhanga bwa TSMC mu gupima amashanyarazi ya santimetero 12 buyitandukanya n’izindi, bigatuma ikwirakwizwa ryihuse rya platform za SiC. Binyuze mu gukoresha ibikorwa remezo bihari n’ikoranabuhanga rigezweho ryo gupakira nka CoWoS, TSMC igamije guhindura inyungu z’ibikoresho mu bisubizo by’ubushyuhe ku rwego rwa sisitemu. Muri icyo gihe, inganda nini nka Intel zishyira imbere gutanga ingufu z’amashanyarazi inyuma no gushushanya hamwe ingufu z’ubushyuhe, bishimangira impinduka ku isi yose igana ku guhanga udushya dushingiye ku bushyuhe.

Igihe cyo kohereza: 28 Nzeri 2025

TSMC ifunze Silicon Carbide ya santimetero 12 kuri New Frontier, ishyirwa mu bikorwa ry’ibikoresho by’ingenzi byo gucunga ubushyuhe bya AI Era