Wafer Isukura Tekinoroji hamwe na Tekiniki ya Tekinike

Imbonerahamwe

1. Intego nyamukuru nakamaro ko gusukura Wafer

2.Isuzuma ryanduye hamwe nubuhanga buhanitse bwo gusesengura

3.Iterambere ryogusukura hamwe namahame ya tekiniki

4.Ishyirwa mu bikorwa rya tekiniki no kugenzura ibyingenzi

5. Ibizaza hamwe nubuyobozi bushya

6. XKH Ibisubizo Byanyuma-Byanyuma Ibisubizo hamwe na Ecosystem ya Service

Isuku rya Wafer ninzira ikomeye mubikorwa bya semiconductor, kuko niyo yanduye kurwego rwa atome irashobora gutesha agaciro imikorere yibikoresho cyangwa umusaruro. Igikorwa cyo gukora isuku gikubiyemo intambwe nyinshi zo gukuraho umwanda utandukanye, nkibisigara kama, umwanda wibyuma, ibice, na okiside kavukire.

1. Intego zo Gusukura Wafer

• Kuraho umwanda wanduye (urugero, ibisigazwa bya Photoresist, igikumwe).
• Kuraho umwanda wibyuma (urugero, Fe, Cu, Ni).
• Kuraho umwanda wanduye (urugero, ivumbi, ibice bya silicon).
• Kuraho okiside kavukire (urugero, ibice bya SiO₂ byakozwe mugihe cyo guhumeka ikirere).

2. Akamaro ko Gukora Wafer Rigorous

• Iremeza umusaruro mwinshi nibikorwa byimikorere.
• Kugabanya inenge nigipimo cyibisigazwa bya wafer.
• Kunoza ubwiza bwubuso no guhoraho.

Mbere yo gukora isuku cyane, ni ngombwa gusuzuma ubuso bwanduye. Gusobanukirwa ubwoko, ingano yubunini, hamwe nuburyo butondekanya ibyanduye hejuru ya wafer bihindura isuku ya chimie nimbaraga zinjiza.

3. Ubuhanga buhanitse bwo gusesengura isuzuma ryanduye

3.1 Isesengura ryibice byubuso

• Ibice byabugenewe byihariye bikoresha laser ikwirakwiza cyangwa iyerekwa rya mudasobwa kugirango ubare, ingano, hamwe namakarita yubutaka.
• Gukwirakwiza urumuri rwinshi bifitanye isano nubunini buke nka nanometero icumi nubucucike buri munsi ya 0.1 / cm².
• Calibration hamwe nibipimo byemeza ibyuma byizewe. Gusikana mbere na nyuma yisuku byemeza imikorere yo gukuraho, inzira yo gutwara neza.

3.2 Isesengura ryibanze ryibanze

• Ubuhanga-bwibanze bugaragaza ibice bigize ibice.
• X-ray Photoelectron Spectroscopy (XPS / ESCA): Isesengura imiterere yimiti yubutaka ikoresheje imirasire ya wafer ikoresheje X-ray no gupima electron zasohotse.
• Glow Disharge Optical Emission Spectroscopy (GD-OES): Sputters ultra-thin surface layer ikurikiranye mugihe wasesenguye ibintu byasohotse kugirango umenye ibice bigize ubujyakuzimu.
• Imipaka yo gutahura igera kubice kuri miriyoni (ppm), iyobora neza isuku ya chimie.

3.3 Isesengura ryanduye

• Gusikana Electron Microscopy (SEM): Ifata amashusho y’ibisubizo bihanitse kugirango yerekane imiterere yanduye hamwe n’ibipimo byerekana, byerekana uburyo bwo gufatira hamwe (imiti n’imashini).
• Microscopi ya Atomic Force (AFM): Ikarita ya nanoscale topografiya kugirango igereranye uburebure bwibice hamwe nubukanishi.
• Kwibanda kuri Ion Beam (FIB) Gusya + Ikwirakwizwa rya Electron Microscopy (TEM): Itanga ibitekerezo byimbere byanduye.

4. Uburyo bwiza bwo Gusukura

Mugihe isuku yumuti ikuraho neza umwanda, hakenewe ubundi buhanga buhanitse kubice bidafite umubiri, ibisigazwa byibyuma, hamwe na ionic bihumanya:

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4.1 Isuku rya RCA

• Byakozwe na Laboratoire ya RCA, ubu buryo bukoresha uburyo bwo kwiyuhagira bubiri kugirango bukureho umwanda.
• SC-1. Ikora dioxyde de silicon yoroheje.
• SC-2 (Isuku isanzwe-2): Ikuraho umwanda wibyuma ukoresheje HCl, H₂O₂, na H₂O (urugero, igipimo cya 1: 1: 6 kuri ~ 80 ° C). Kureka ubuso butambutse.
• Kuringaniza isuku hamwe no kurinda hejuru.

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4.2 Kwezwa kwa Ozone

• Wibiza wafers mumazi ya ozone-yuzuye amazi ya deionised (O₃ / H₂O).
• Muburyo bwa okiside kandi ikuraho ibinyabuzima bitarinze kwangiza wafer, hasigara hejuru yimiti.

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4.3 Isuku rya Megasonic?

• Koresha ingufu za ultrasonic zifite ingufu nyinshi (mubisanzwe 750-900 kHz) hamwe nibisubizo byogusukura.
• Bibyara cavitation bubbles ikuraho umwanda. Kwinjira muri geometrike igoye mugihe ugabanya ibyangiritse kubintu byoroshye.

4.4

• Byihuta gukonjesha wafers kubushyuhe bwa cryogenic, guhumanya umwanda.
• Gukaraba neza cyangwa gukaraba neza bikuraho ibice byoroheje. Irinda kwanduza no gukwirakwira hejuru.
• Byihuse, byumye hamwe nuburyo bukoreshwa bwimiti.

Umwanzuro:
Nkumuyobozi wambere wuzuye urunigi rwinshi rutanga ibisubizo, XKH itwarwa nudushya twikoranabuhanga kandi abakiriya bakeneye gutanga urusobe rwibidukikije rwa serivise ikubiyemo ibikoresho byo mu rwego rwo hejuru, ibikoresho bya wafer, no gukora isuku neza. Ntabwo dutanga gusa ibikoresho byemewe bya semiconductor ku rwego mpuzamahanga (urugero, imashini zitwa lithographie, sisitemu yo gutondeka) hamwe nibisubizo byabigenewe ariko tunatanga ikoranabuhanga ryambere-ririmo isuku ya RCA, kweza ozone, hamwe nogusukura megasonic-kugirango tumenye isuku kurwego rwa atome kubikorwa bya wafer, bizamura cyane umusaruro wabakiriya no gukora neza. Twifashishije amatsinda yihuta-yihuse hamwe numuyoboro wa serivise wubwenge, turatanga inkunga yuzuye kuva mugushiraho ibikoresho no gutezimbere uburyo bwo kubungabunga ibiteganijwe, guha imbaraga abakiriya gutsinda ibibazo bya tekiniki no gutera imbere murwego rwo hejuru kandi rurambye rwiterambere. Duhitemo kubitsindira-bibiri byubuhanga bwa tekinike nagaciro kubucuruzi.