Ni izihe nyungu Zinyuze mu Kirahure Via (TGV) no Binyuze kuri Silicon Via, TSV (TSV) inzira hejuru ya TGV？

Ibyiza byaBinyuze mu kirahure (TGV)Binyuze muri Silicon Via (TSV) inzira hejuru ya TGV ni:

(1) ibintu byiza cyane biranga amashanyarazi. Ibikoresho by'ibirahure ni ibikoresho bya insulator, guhora dielectric ni hafi 1/3 cyibikoresho bya silikoni, kandi igihombo ni 2-3 byerekana ubunini buri munsi yibya silikoni, bigatuma igihombo cya substrate n'ingaruka za parasitike bigabanuka cyane kandi iremeza ubusugire bw'ikimenyetso cyatanzwe;

(2)ingano nini na ultra-thin ibirahuri substrateni byoroshye kubona. Corning, Asahi na SCHOTT hamwe nabandi bakora ibirahure barashobora gutanga ubunini bwa ultra-nini (> 2m × 2m) hamwe na ultra-thin (<50µm) ikirahuri cyibikoresho hamwe nibirahure bya ultra-thin byoroshye.

3) Igiciro gito. Wungukire muburyo bworoshye bwo kubona ibirahuri binini binini cyane bya ultra-thin panel, kandi ntibisaba ko hashyirwaho ibice byabigenewe, igiciro cyo gukora icyapa cya adaptori ni hafi 1/8 cya plaque ishingiye kuri silicon;

4) Inzira yoroshye. Ntibikenewe ko ushyira urwego rukingira hejuru yubutaka hamwe nurukuta rwimbere rwa TGV, kandi nta kunanura bisabwa muri plaque ultra-thin adapter;

(5) Gukomera gukomeye. Ndetse iyo umubyimba wa plaque ya adapt uri munsi ya 100µm, urupapuro rwintambara ruba ruto;

. , ubushyuhe, ibikoresho bya mashini, muri chip ya RF, sensor ya MEMS yo murwego rwohejuru, sisitemu yo guhuza cyane hamwe nibindi bice bifite inyungu zidasanzwe, ni igisekuru kizaza cya 5G, 6G yihuta cyane ya chip 3D Nimwe mumahitamo ya mbere kuri Gupakira 3D yibisekuruza bizaza 5G na 6G byihuta cyane.

Uburyo bwo kubumba bwa TGV burimo cyane cyane gutobora umucanga, gucukura ultrasonic, gutobora amazi, gutera cyane ion gutera, gufotora ibyiyumvo, gukurura lazeri, gushiramo ubujyakuzimu bwa laser, no kwibanda kumyenge yo gusohora.

Ubushakashatsi buherutse gukorwa hamwe niterambere ryerekana ko ikoranabuhanga rishobora gutegura binyuze mu mwobo na 5: 1 impumyi zihumye zifite ubujyakuzimu n'ubugari bwa 20: 1, kandi zikagira morphologie nziza. Lazeri yatewe cyane, bivamo ubuso buto, nuburyo bwizwe cyane kurubu. Nkuko bigaragara ku gishushanyo cya 1, hari ibice bigaragara hafi yo gucukura lazeri isanzwe, mugihe urukuta ruzengurutse nuruhande rwuruzitiro rwatewe na laser rufite isuku kandi yoroshye.

Inzira yo gutunganyaTGVinterposer irerekanwa mu gishushanyo cya 2. Gahunda rusange ni ugucukura umwobo hejuru yikirahure mbere, hanyuma ukabitsa inzitizi hamwe nimbuto zimbuto kurukuta rwuruhande no hejuru. Inzitizi ya barrière irinda ikwirakwizwa rya Cu kuri substrate yikirahure, mugihe byongera guhuza byombi, byanze bikunze, mubushakashatsi bumwe na bumwe bwerekanye ko inzitizi idakenewe. Noneho Cu ishyirwa muri electroplating, hanyuma igashyirwa hejuru, hanyuma Cu igakurwaho na CMP. Hanyuma, RDL rewiring layer yateguwe na PVD itwikiriye lithographie, hanyuma passivation igaragara nyuma yo gukuramo kole.

. , (f) gushyira RDL rewiring layer, (g) degluing na Cu / Ti etching, (h) gushiraho passivation layer.

Muri make,ikirahure binyuze mu mwobo (TGV)ibyifuzo byo gusaba ni binini, kandi isoko ryimbere mu gihugu riri murwego rwo kuzamuka, kuva mubikoresho kugeza kubishushanyo mbonera hamwe nubushakashatsi niterambere ryiterambere biri hejuru yikigereranyo cyisi yose

Niba hari ihohoterwa, hamagara gusiba