Wafer TTV, Bow, Warp ni iki, kandi bipimwa gute?

?Ububiko

1. Ibitekerezo by'ingenzi n'ibipimo​

2. Ubuhanga bwo gupima​

3.​​Gutunganya amakuru n'amakosa​​

4. Ingaruka ku mikorere​

Mu nganda zikora ibikoresho bya semiconductor, ubunini n'ubugari bw'ubuso bwa wafers ni ibintu by'ingenzi bigira ingaruka ku musaruro w'ibikorwa. Ibipimo by'ingenzi nka Total Thickness Variation (TTV), Bow (arcuate warpage), Warp (global warpage), na Microwarp (nano-topography) bigira ingaruka zitaziguye ku buziranenge no kudahungabana kw'imikorere y'ibanze nko kwibanda kuri photolithography, chemical mechanical polishing (CMP), no gushyira thin-film deposition.

 

Ibitekerezo by'ingenzi n'ibipimo​

TTV (Impinduka y'Ubunini Rusange)​

TTV yerekeza ku kinyuranyo ntarengwa cy'ubugari ku buso bwose bwa wafer mu gace gapimirwamo Ω (ubusanzwe hatabariwemo uturere duto twometseho impande n'uturere turi hafi y'uduce duto cyangwa utugari). Mu mibare, TTV = max(t(x,y)) – min(t(x,y)). Yibanda ku bunini bw'imbere bwa wafer, butandukanye n'ubugari bw'ubuso cyangwa imiterere y'agace gato.
Umuheto

Umuheto usobanura uburyo igice cyo hagati cya wafer kigenda gihinduka ukurikije urwego rw'ifatizo rufite kare nke. Agaciro keza cyangwa kabi kerekana ko imiterere y'isi yose izamuka cyangwa imanuka.

Ifuro

Ishusho ya Warp ipima itandukaniro ntarengwa hagati y’isonga n’ikibaya ku buso bwose ugereranyije n’aho iherereye, isuzuma ubugari bw’ishusho ya wafer muri rusange mu buryo bw’ubwisanzure.

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Microwarp
Microwarp (cyangwa nanotopography) isuzuma imiyoboro mito y’ubuso mu ntera yihariye y’uburebure bw’umuraba (urugero, mm 0.5–20). Nubwo hari ubwinshi buto, izi mpinduka zigira ingaruka zikomeye ku burebure bw’umuraba (DOF) na CMP.
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Urwego rw'Icyitegererezo cy'Ibipimo​
Ibipimo byose bibarwa hakoreshejwe uburyo bwa geometric baseline, ubusanzwe ni plane ifite ibice bike (LSQ plane). Ibipimo by'ubunini bisaba guhuza amakuru y'imbere n'inyuma binyuze mu mpande za wafer, notches, cyangwa ibimenyetso byo guhuza. Isesengura rya microwarp rikubiyemo kuyungurura imiterere y'ahantu kugira ngo havemo ibice byihariye by'uburebure bw'umurambararo.

 

Uburyo bwo gupima

1. Uburyo bwo gupima TTV​

  • Profilometiri y'ubuso bubiri
  • Interferometry ya Fizeau:Ikoresha impande z'urusobe rw'insinga hagati y'aho ikoreshwa n'ubuso bw'insinga. Ikwiriye ubuso bworoshye ariko igengwa n'insinga nini zigonganye.
  • Interferometry y'urumuri rwera (SWLI):Ipima uburebure bwose binyuze mu mabahasha y'urumuri ruto. Ikora neza ku buso bumeze nk'intambwe ariko ikagengwa n'umuvuduko wo gushakisha.
  • Uburyo bwo Gufunga:Kugera ku bushobozi bwo gupima mikoroni ukoresheje imyenge cyangwa amahame yo gukwirakwiza. Ni byiza ku buso bugoye cyangwa bubonerana ariko butinda bitewe no gupima ingingo ku ngingo.
  • Impandeshatu ya Lazeri:Igisubizo cyihuse ariko gishobora gutakaza ubuziranenge bitewe n'impinduka mu kugaragara kw'urusobe rw'amabara.

 

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  • Ihuza ry'Ihererekanyamakuru/Isuzuma​
  • Utumashini dutatu tw’ubushobozi bw’umutwe: Aho utwo tumashini dushyirwa ku mpande zombi dupima ubugari nka T = L – d₁ – d₂ (L = intera y’ibanze). Ni vuba ariko biranga imiterere y’ibikoresho.
  • Ellipsometry/Spectroscopic Reflectometry: Isesengura imikoranire y'urumuri n'ibintu bifatika kugira ngo irebe ubunini bwa filime nto ariko idakwiye gukoreshwa kuri TTV nyinshi.

 

2. Igipimo cy'umuheto n'ubudodo​

  • Imashini zipima ubushobozi bwa "Multi-Probe Capacitance Arrays": Fata amakuru y'uburebure bw'ikibuga cyose ku rwego rwo hejuru kugira ngo wongere uvugururwe vuba muri 3D.
  • Ishusho y'urumuri rufite imiterere: Gushushanya imiterere ya 3D yihuta cyane hakoreshejwe uburyo bwo gushushanya.
  • Interferometry yo hasi ya NA: Gupima ubuso bufite ubushobozi bwo hejuru ariko bushobora kwitabwaho n'imitingito.

 

3. Igipimo cya mikoroonde

  • Isesengura ry'Ingano z'Aho Iherereye:
  1. Shaka imiterere y'ubuso ifite ubushobozi bwo hejuru.
  2. Ubucucike bwa spectral y'imbaraga zo kubara (PSD) binyuze kuri 2D FFT.
  3. Shyira ibyuma bipima umuvuduko w'urumuri (urugero, mm 0.5–20) kugira ngo utandukanye uburebure bw'urumuri rw'amashanyarazi.
  4. Kubara agaciro ka RMS cyangwa PV ukoresheje amakuru yayunguruwe.
  • Ukwigana kwa Vacuum Chuck​:Ingaruka zo gufunga mu buryo bufatika mu gihe cyo gushushanya.

 

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Gutunganya amakuru n'amasoko y'amakosa

Uburyo bwo gutunganya akazi​

  • Televiziyo ya TV:Shyira umurongo ku buso bw'imbere n'inyuma, ubare itandukaniro ry'ubugari, kandi ukuremo amakosa ya gahunda (urugero: guhindagurika k'ubushyuhe).
  • ?Umuheto/Umuheto​:Shyira urwego rwa LSQ ku makuru y'uburebure; Umuheto = ibisigazwa by'ingingo yo hagati, Umugongo = ibisigazwa by'isonga-ujya-mu kibaya.
  • ?Microwarp​:Gushungura imirongo y'ahantu, kubara imibare (RMS / PV).

Inkomoko y'amakosa y'ingenzi

  • Ibintu bidukikije:Kuzunguruka (ni ingenzi kuri interferometry), umuyaga uhindagurika, ubushyuhe buhindagurika.
  • Ibidashoboka ku byuma bipima:Urusaku rw'icyiciro (interferometry), amakosa yo gupima uburebure bw'umurambararo (confocal), ibisubizo bishingiye ku bikoresho (capacitance).
  • Uburyo bwo gufata wafer:Kutagena neza impande, kudakora neza mu kudoda.

 

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Ingaruka ku Isuzuma ry'Ibikorwa

  • Lithography​:Microwarp yo mu gace igabanya DOF, bigatera impinduka za CD n'amakosa yo gushyira kuri overlay.
  • CMP​:Ubusumbane bwa mbere bwa TTV butuma habaho igitutu kidakwirakwira kimwe.
  • Isesengura ry'Imihangayiko:Ihindagurika ry'umuheto/umuraba rigaragaza imyitwarire y'ubushyuhe/imitsi.
  • Gupakira​:TTV ikabije itera icyuho mu miyoboro ihuza.

 

https://www.xkh-semitech.com/dia300x1-0mmt-thickness-sapphire-wafer-c-plane-sspdsp-product/

Wafer ya Sapphire ya XKH

 


Igihe cyo kohereza: 28 Nzeri 2025