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Imashini yo gukata diyama ifite insinga nyinshi ikoreshwa mu bikoresho bya SiC Sapphire Ultra-Hard Brittle

Imashini yo gukata diyama ifite insinga nyinshi ikoreshwa mu bikoresho bya SiC Sapphire Ultra-Hard Brittle Ishusho yagaragaye
  • Imashini yo gukata diyama ifite insinga nyinshi ikoreshwa mu bikoresho bya SiC Sapphire Ultra-Hard Brittle
  • Imashini yo gukata diyama ifite insinga nyinshi ikoreshwa mu bikoresho bya SiC Sapphire Ultra-Hard Brittle
  • Imashini yo gukata diyama ifite insinga nyinshi ikoreshwa mu bikoresho bya SiC Sapphire Ultra-Hard Brittle

Ibisobanuro bigufi:

Imashini ikata diyama ifite insinga nyinshi ni uburyo bugezweho bwo gukata bwagenewe gutunganya ibikoresho bikomeye cyane kandi byoroshye kwangirika. Mu gukoresha insinga nyinshi zitwikiriwe na diyama, imashini ishobora gukata insinga nyinshi icyarimwe mu buryo bumwe, bigatuma ikora neza kandi igakora neza.


Ibiranga

Intangiriro ku mashini yo gukata diyama ifite insinga nyinshi

Imashini yo gukata diyama ifite insinga nyinshi ni uburyo bugezweho bwo gukata bwagenewe gutunganya ibikoresho bikomeye cyane kandi byoroshye kwangirika. Mu gukoresha insinga nyinshi zivanze na diyama, imashini ishobora gukata wafer nyinshi icyarimwe mu buryo bumwe, bigatuma igera ku musaruro mwiza kandi ikora neza. Ubu buryo bwabaye igikoresho cy'ingenzi mu nganda nka semiconductors, photovoltaics z'izuba, LEDs, na ceramics zigezweho, cyane cyane ku bikoresho nka SiC, safire, GaN, quartz, na alumina.

Ugereranyije n'uburyo busanzwe bwo gukata insinga imwe, imiterere y'insinga nyinshi itanga ibice byinshi kugeza ku magana kuri buri gice, bigabanya cyane igihe cyo gukora uruziga ariko bigakomeza kuba birebire (Ra < 0.5 μm) n'ubuziranenge bw'ibipimo (± 0.02 mm). Imiterere yayo ihuza uburyo bwo gukaza insinga mu buryo bwikora, uburyo bwo gufata ibyuma, no gukurikirana kuri interineti, bigatuma habaho umusaruro urambye, uhamye kandi wikora mu buryo bwuzuye.

Ibipimo bya tekiniki by'imashini yo gukata diyama ifite insinga nyinshi

Ikintu Ibisobanuro Ikintu Ibisobanuro
Ingano ntarengwa y'akazi (Kare) 220 × 200 × 350 mm Moteri itwara imodoka 17.8 kW × 2
Ingano ntarengwa y'akazi (Izingiye) Φ205 × 350 mm Moteri itwara insinga 11.86 kW × 2
Intera iri hagati y'urudodo Φ250 ± 10 × 370 × 2 axis (mm) Moteri yo guterura ikoreshwa ku meza 2.42 kW × 1
Umurongo w'ingenzi mm 650 Moteri yo kuzunguruka 0.8 kW × 1
Umuvuduko wo gukoresha insinga 1500 m/umunota Moteri yo gutunganya 0.45 kW × 2
Umurambararo w'insinga Φ0.12–0.25 mm Moteri y'umuvuduko 4.15 kW × 2
Umuvuduko wo guterura 225 mm/umunota Moteri y'urutare 7.5 kW × 1
Guhinduranya ameza ntarengwa ± 12° Ubushobozi bwo gucukura ibigega by'amazi Litiro 300
Inguni yo kuzunguruka ± 3° Urugendo rw'ibikoresho bikonjesha Litiro 200/umunota
Inshuro zo koga ~Inshuro 30/iminota Ubuziranenge bw'ubushyuhe ± 2 °C
Igipimo cy'ibiryo 0.01–9.99 mm/umunota Ingufu z'amashanyarazi 335+210 (mm²)
Igipimo cy'ingufu zo kohereza insinga 0.01–300 mm/umunota Umwotsi ufunze 0.4–0.6 MPa
Ingano y'imashini 3550 × 2200 × 3000 mm Uburemere ibiro 13,500

Uburyo bwo gukora imashini yo gukata diyama ifite insinga nyinshi

  1. Uburyo bwo Gukata Insinga Nyinshi
    Insinga nyinshi za diyama zigenda ku muvuduko uhuye kugeza kuri 1500 m/min. Pulleys ziyobowe neza n'uburyo bwo kugenzura umuvuduko ufunze (15–130 N) bituma insinga ziguma zihamye, bigabanya amahirwe yo gucika cyangwa kwangirika.

  2. Gutanga no Gushyira mu mwanya ukwiye
    Aho servo iherereye hagera ku buziranenge bwa ± 0.005 mm. Uburyo bworoshye bwo guhuza hakoreshejwe laser cyangwa uburyo bwo kureba butuma imiterere igorana.

  3. Gukonjesha no Gukuraho Imyanda
    Igikoresho gikonjesha gifite umuvuduko mwinshi gihora gikuraho uduce duto kandi gikonjesha aho gikorera, kikarinda kwangirika k'ubushyuhe. Gusukura mu byiciro byinshi byongera igihe cyo gukora gikonjesha kandi bikagabanya igihe cyo kudakora.

  4. Urubuga rw'igenzura ry'ubwenge
    Ibikoresho bya servo bitanga igisubizo cyinshi (<1 ms) bihindura uburyo bwo gutanga amakuru, umuvuduko w'amakuru, n'umuvuduko w'insinga. Gucunga neza uburyo bwo gukora resitora no guhinduranya parameters rimwe gusa binoroshya umusaruro mwinshi.

Ibyiza by'ingenzi by'imashini yo gukata diyama ifite insinga nyinshi

  • Umusaruro mwinshi
    Ishobora gukata wafer 50–200 kuri buri gikoresho, hamwe n'igihombo cya kerf kiri munsi ya 100 μm, bigatuma ikoreshwa ry'ibikoresho rigera kuri 40%. Umuvuduko w'ibikoresho ni 5–10× ugereranije n'uwakoreshejwe mu buryo busanzwe bw'insinga imwe.

  • Kugenzura neza
    Guhagarara neza kw'insinga muri ± 0.5 N bitanga umusaruro uhoraho ku bikoresho bitandukanye byoroshye. Gukurikirana mu buryo bufatika kuri interface ya HMI ya santimetero 10 bifasha kubika amafunguro no kuyakoresha kure.

  • Iyubakwa ry'uburyo bworoshye kandi bugezweho
    Ikorana n'umurambararo w'insinga kuva kuri mm 0.12 kugeza kuri mm 0.45 mu buryo butandukanye bwo gukata. Uburyo bwo gukoresha roboti butuma imirongo ikorwa yikora mu buryo bwikora.

  • Kwizerwa mu rwego rw'inganda
    Amasafuriya akomeye akozwe mu cyuma/akozwe mu cyuma agabanya ububobere (<0.01 mm). Amasafuriya ayobora afite irangi rya keramike cyangwa karubide atanga igihe kirenga amasaha 8000 yo gukora.

Sisitemu yo gukata diyama mu nsinga nyinshi ikoreshwa mu bikoresho bya SiC Sapphire Ultra-Hard Brittle 2

Uburyo bwo gukoresha imashini yo gukata diyama ifite insinga nyinshi

  • Ibikoresho bya semiconductor: Gukata SiC kuri modules z'amashanyarazi za EV, substrates za GaN ku bikoresho bya 5G.

  • Ingufu z'izuba: Gukata silicon wafer yihuta cyane ifite ± 10 μm ingana.

  • LED na Optique: Ibyuma bya safiro byo gukoresha epitaxy na precision optical elements bifite <20 μm edge chipping.

  • Ibumba rigezweho: Gutunganya alumina, AlN, n'ibindi bisa nabyo mu bikoresho byo gucunga ikirere n'ubushyuhe.

Sisitemu yo gukata diyama mu nsinga nyinshi ikoreshwa mu bikoresho bya SiC Sapphire Ultra-Hard Brittle 3

 

Sisitemu yo gukata diyama mu nsinga nyinshi ikoreshwa mu bikoresho bya SiC Sapphire Ultra-Hard Brittle 5

Sisitemu yo gukata diyama mu nsinga nyinshi ikoreshwa mu bikoresho bya SiC Sapphire Ultra-Hard Brittle 6

Ibibazo Bikunze Kubazwa - Imashini Icukura Diyama Ikoresheje Insinga Nyinshi

Q1: Ni izihe nyungu zo gukata insinga nyinshi ugereranije n'imashini zikoresha insinga imwe?
A: Sisitemu z'insinga nyinshi zishobora gukata uduce twinshi tw'insinga mu buryo bunyuranye, bigatuma imikorere irushaho kuba myiza ho 5–10×. Imikoreshereze y'ibikoresho nayo iri hejuru kuko igihombo cya kerf kiri munsi ya μm 100, bigatuma iba nziza cyane mu gukora ibintu byinshi.

Q2: Ni ubuhe bwoko bw'ibikoresho bishobora gutunganywa?
A: Iyi mashini yagenewe ibikoresho bikomeye kandi byoroshye, birimo silicon carbide (SiC), safiro, gallium nitride (GaN), quartz, alumina (Al₂O₃), na aluminium nitride (AlN).

Q3: Ni ubuhe buryo bwo gukora neza no kuba ubuso bufite ubwiza bungana iki?
A: Ubukana bw'ubuso bushobora kugera kuri Ra <0.5 μm, hamwe n'ubuziranenge bwa ± 0.02 mm. Gukata impande bishobora kugenzurwa kugeza kuri <20 μm, byujuje ibisabwa mu nganda za semiconductor na optoelectronic.

Q4: Ese inzira yo gukata itera imicanga cyangwa kwangirika?
A: Hamwe n’icyuma gikonjesha gifite umuvuduko mwinshi n’uburyo bwo kugenzura umuvuduko ufunze, ibyago byo kwangirika no kwangirika kw’imihangayiko biragabanuka, bigatuma habaho ubuziranenge bwiza bwa wafer.

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