Ibikoresho bya semiconductor
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Umuyoboro wa Silicon / Silicon Carbide (SiC) Wafer w’Ibyiciro Bine Uhuza Polishing Automation (Umuyoboro Uhuza Polishing Post-Polish)
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Uburyo bwo gusiga imbuto za SiC – Guhuza – Gusimbuza Sintering
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Sisitemu yo gukoresha imikoro ya laser ifite ubuhanga buhanitse
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Insinga nyinshi za diyama zo gukata neza ibikoresho bikomeye kandi bitoroshye
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Imashini Itunganya Laser Iyobowe na Micro Waterjet
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Imashini ya Diyama yo mu bwoko bwa Swing-Type Multi-Wire Saw ikoresha umuvuduko mwinshi kandi ikora neza cyane
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Ishusho ya Diyama ifite insinga nyinshi TJ3000 ifite 12″ Inverted Downward Swing
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Ibikoresho byo gukata insinga bya Safira/Ceramics/Marble mu buryo bwo gukata insinga nyinshi/butambitse
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Ibice by'itumanaho bya laser yihuta cyane n'ibikoresho bya terminale
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Imashini yo gukata insinga nyinshi ya diyama yihuta cyane kandi ikora neza cyane
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Ibikoresho byo gusiga neza cyane ku ruhande rumwe
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Imashini yo gusya ifite impande ebyiri ikoresha SiC Sapphire Si wafer