Ibikoresho bya semiconductor
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Imashini Ingangiza ya CNC Ingot (ikoreshwa muri Safira, SiC, nibindi)
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Imashini Ikoresha Laser Ikora Imitako Ikoresheje Ibyuma Itera Kubangamira Imirongo
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Imashini yo gukata ikirahure ya Laser ikoreshwa mu gutunganya ikirahure giteretse
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Sisitemu ya Laser ya Microjet Precision ikoreshwa mu bikoresho bikomeye kandi bitoroshye
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Imashini yo gucukura ya laser ikoresha ikoranabuhanga rya laser rigezweho cyane
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Imashini yo gucukura ikirahure cya Laser
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Sisitemu yo gukata ibikoresho bya santimetero 12 ikoresha uburyo bwa "First Automatic Precision Dicing Saw" ya Sisteme yo gukata ya Si/SiC na HBM (Al)
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Ibikoresho byo Gukata impeta bya Wafer byikora byikora Ingano yo Gukata impeta ya Wafer ya Wafer ya santimetero 8/santimetero 12
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Ibikoresho byo Kugaragaza Ibimenyetso bya Laser Birwanya Ibikoresho by'Impimbano
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Sisitemu yo Kugaragaza Ibimenyetso bya Laser ku Bikoresho bya Safiro, Amasaha, Imitako y'Agaciro
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Igikoresho cyo gukuraho kristale cya SiC Ingot gikura 4inch 6inch 8inch PTV Lely TSSG LPE uburyo bwo gukuraho
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Imashini nto yo gucukura laser yo ku meza ifite ubushobozi bwo gusohora nibura 1000W-6000W ifite ubushobozi bwo gusohora nibura 0.1MM ishobora gukoreshwa mu bikoresho bya ceramic by'icyuma