Silicon Carbide Ceramic Chuck kuri SiC safiro Si GAAs Wafer

Ibisobanuro bigufi:

Silicon Carbide Ceramic Chuck ni urubuga rwo hejuru rwagenewe kugenzura semiconductor, gukora wafer, no gukoresha bonding. Rwubatswe mu bikoresho bya keramike bigezweho—harimo sintered SiC (SSiC), reaction-bonded SiC (RSiC), silicon nitride, na aluminium nitride—rutanga ubukana bwinshi, ubushyuhe buke, rudashira neza, kandi rumara igihe kirekire.


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Incamake ya Silicon Carbide (SiC) Ceramic Chuck

ItsindaSilicon Carbide Ceramic Chuckni urubuga rufite imikorere myiza rwagenewe kugenzura semiconductor, gukora wafer, no gukoresha bonding. Rwubakiwe mu bikoresho bya keramike bigezweho—harimoSiC ya sintered (SSiC), SiC ifitanye isano n'ibisubizo (RSiC), nitride ya silikoni, nanitride ya aluminiyumu—bitangagukomera cyane, ubushyuhe buke, kudashira neza, no kumara igihe kirekire.

Ikoresheje ubuhanga buhanitse no gutunganya ibintu mu buryo bugezweho, iki gikoresho gitanga serivisi nzizaubugari bwa sub-micron, ubuso bwiza nk'indorerwamo, no kudahungabana mu buryo bw'igihe kirekire, bigatuma iba igisubizo cyiza ku bikorwa by'ingenzi bya semiconductor.

Ibyiza by'ingenzi

  • Ubuhanga bwo hejuru
    Ubugari bugenzurwa imbere0.3–0.5 μm, kugenzura ko wafer ihamye kandi ko inzira ihoraho ikora neza.

  • Gusukura indorerwamo
    Yageze ku ntegoRa 0.02 μmUbuso butoshye, bigabanya gushwanyagurika no kwanduzwa n'ibicuruzwa—bikwiriye cyane ahantu hasukuye cyane.

  • Ifite uburemere bworoshye cyane
    Ikomeye ariko yoroheje kurusha quartz cyangwa substrates z'icyuma, irushaho kunoza uburyo bwo kugenzura imikorere, uburyo bwo gusubiza ibintu mu buryo, no gushyira ibintu mu buryo buboneye.

  • Ubukana bwinshi
    Uburyo bwa Exceptional Young's butuma habaho ubusugire mu gihe cy'imizigo iremereye no mu gihe cy'umuvuduko mwinshi.

  • Kwaguka guke k'ubushyuhe
    CTE ihuza neza na silicon wafers, igabanya ubushyuhe kandi ikongera ubwizigirwa bw'imikorere.

  • Ubudahangarwa budasanzwe bwo kwambara
    Ubukomere bukabije butuma ipfunyika kandi ikagira ubuziranenge ndetse no mu gihe ikoreshwa igihe kirekire kandi ikunze gukoreshwa kenshi.

Uburyo bwo gukora

  • Gutegura ibikoresho fatizo
    Ifu ya SiC ifite ubuziranenge bwinshi ifite ingano y'uduce twagenzuwe n'imyanda iri hasi cyane.

  • Gutunganya no Gutunganya
    Ubuhanga nkagushyushya nta muvuduko (SSiC) or guhuza uburyo bwo gusubiza ibintu mu buryo (RSiC)bitanga ibintu byinshi kandi bingana nk'iby'ibumba.

  • Gukora imashini neza
    Gusya CNC, gukata laser, no gutunganya neza cyane bitanga ubushobozi bwo kwihanganira ± 0.01 mm no gupima ≤3 μm.

  • Ubuvuzi bw'ubuso
    Gusya no gusiga irangi mu byiciro byinshi kugeza kuri Ra 0.02 μm; hari irangi ryihariye rikoreshwa mu kurwanya ingese cyangwa mu buryo bwihariye bwo gukururana.

  • Igenzura n'Igenzura ry'Ubuziranenge
    Interferometers n'ibipimo by'ubukana bigenzura ko bikurikije amabwiriza ya semiconductor-grade.

Ibisobanuro bya tekiniki

Igipimo Agaciro Ishami
Ubugari ≤0.5 μm
Ingano z'amafi 6'', 8'', 12'' (iboneka ku buryo bwihariye)
Ubwoko bw'ubuso Ubwoko bw'ifishi / Ubwoko bw'impeta
Uburebure bw'agapira 0.05–0.2 mm
Umurambararo muto wa pini ϕ0.2 mm
Intera nto y'udupira 3 mm
Ubugari bw'impeta y'agapfundikizo 0.7 mm
Ubuso bugoye Ra 0.02 μm
Kwihanganira ubunini ± 0.01 mm
Ubwihangane bw'umurambararo ± 0.01 mm
Kwihanganirana mu buryo bunyuranye ≤3 μm

 

Porogaramu z'ingenzi

  • Ibikoresho byo kugenzura wafer ya semiconductor

  • Uburyo bwo gukora no kohereza amafunguro ya Wafer

  • Ibikoresho byo gupfunyika no gupakira bya wafer

  • Gukora ibikoresho bya elegitoroniki bigezweho

  • Ibikoresho by'ikoranabuhanga bisaba ubuso burambuye kandi busukuye cyane

Ibibazo n'Ibisubizo - Silicon Carbide Ceramic Chuck

Q1: Ni gute uduce twa SiC ceramic tugereranywa n'uduce twa quartz cyangwa utw'icyuma?
A1: Udupira twa SiC ni tworoshye, dukomeye, kandi dufite CTE hafi ya wafer za silicon, bigabanya ubushyuhe. Nanone kandi, dutanga ubushobozi bwo kudashira neza kandi tukamara igihe kirekire.

Q2: Ni ubuhe buryo bworoshye bushobora kugerwaho?
A2: Igenzurwa muri0.3–0.5 μm, ihura n'ibisabwa bikomeye byo gukora semiconductor.

Q3: Ese ubuso buzashishura?
A3: Oya—indorerwamo irabagirana kugira ngoRa 0.02 μm, kwemeza ko nta gushwanyaguza no kugabanya ikorwa ry'udukoko.

Q4: Ni ingano zihe za wafer zishyigikiwe?
A4: Ingano zisanzwe za6'', 8'', na 12'', hamwe n'uburyo bwo guhindura ibintu buhari.

Q5: Ubudahangarwa bw'ubushyuhe buhagaze gute?
A5: Ibumba rya SiC ritanga umusaruro mwiza cyane mu bushyuhe bwo hejuru kandi ridafite impinduka nyinshi mu gihe cy'ubushyuhe.

Ku bijyanye natwe

XKH yihariye mu iterambere, gukora, no kugurisha ikirahure cyihariye cya optique n'ibikoresho bishya bya kristu. Ibicuruzwa byacu bitanga ibikoresho by'ikoranabuhanga bya optique, ibikoresho by'ikoranabuhanga bikoreshwa n'abantu, n'ibya gisirikare. Dutanga ibikoresho bya optique bya Safira, ibifuniko bya lens za telefoni zigendanwa, Ceramics, LT, Silicon Carbide SIC, Quartz, na semiconductor crystal wafers. Dufite ubuhanga n'ibikoresho bigezweho, turakora neza mu gutunganya ibicuruzwa bitari iby'ubuziranenge, tugamije kuba ikigo gikomeye mu ikoranabuhanga rigezweho mu bikoresho bya optoelectronic.

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