Umuyoboro wa Silicon / Silicon Carbide (SiC) Wafer w’Ibyiciro Bine Uhuza Polishing Automation (Umuyoboro Uhuza Polishing Post-Polish)
Ishusho irambuye
Incamake
Uyu murongo w’imashini zitunganya polishing zifite ibyiciro bine ni igisubizo cy’ikoranabuhanga kandi gihujwe cyagenewenyuma yo gukosora / nyuma yo gukosoraibikorwa byasilikoninakarubide ya silikoni (SiC)uduce twa wafer. Twubakiwe hirya no hinoibikoresho bya ceramic (amasahani ya ceramic), iyi sisitemu ihuza imirimo myinshi yo mu gice cya kabiri cy’umuyoboro mu murongo umwe uhujwe—ifasha abakora ibintu bishya kugabanya uburyo bwo kuyikoresha n'intoki, gutuma igihe cyo kuyikoresha kirushaho gukomera, kandi igakomeza kurwanya ubwandu.
Mu nganda za semiconductor,isuku nziza nyuma ya CMPizwi cyane nk'intambwe y'ingenzi yo kugabanya inenge mbere y'uko igikorwa gikurikira gitangira, hamwe n'uburyo bugezweho (harimoisuku nini cyane) bikunze kuganirwaho mu kunoza imikorere yo gukuraho uduce duto.
By'umwihariko kuri SiC, nigukomera cyane no kudakora neza kw'imitibituma gusiga irangi bigorana (bikunze kujyana no gukuraho ibikoresho bike kandi bikaba byakwangiza ubuso cyangwa munsi y’ubutaka), ibyo bigatuma ikoranabuhanga rihoraho ryo gukora isuku no kugenzura isuku/gufata ibikoresho rigira agaciro cyane.
Ibyiza by'ingenzi
Umurongo umwe uhujwe ushyigikira:
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Gutandukanya no gukusanya amafunguro y'umugati(nyuma yo gusiga irangi)
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Uburyo bwo kubika / kubika ibikoresho bya Ceramic
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Gusukura ibikoresho bya ceramic
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Gushyiramo wafer (gushyiraho) ku bikoresho bya ceramic
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Imikorere ihuriweho, ikorwa ku murongo umwe kuriUduce twa santimetero 1.5–2.5
Ibisobanuro bya tekiniki (Kuva ku rupapuro rw'amakuru rwatanzwe)
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Ibipimo by'ibikoresho (L×W×H):13643 × 5030 × 2300 mm
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Ingufu z'amashanyarazi:AC 380 V, 50 Hz
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Imbaraga zose:119 kW
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Isuku yo Gushyiraho:0.5 μm < 50 buri kimwe; 5 μm < 1 buri kimwe
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Ubugari bwo Gushyiraho:≤ 2 μm
Ireferensi y'ibyavuye mu bushakashatsi (Kuva ku rupapuro rw'amakuru rwatanzwe)
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Ibipimo by'ibikoresho (L×W×H):13643 × 5030 × 2300 mm
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Ingufu z'amashanyarazi:AC 380 V, 50 Hz
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Imbaraga zose:119 kW
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Isuku yo Gushyiraho:0.5 μm < 50 buri kimwe; 5 μm < 1 buri kimwe
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Ubugari bwo Gushyiraho:≤ 2 μm
Uburyo busanzwe bwo gutembera k'umurongo
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Infeed / interface iturutse mu gace ko hejuru gatunganya
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Gutandukanya no gukusanya amafunguro ya wafer
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Uburyo bwo kubika/gushyiramo ibikoresho bya Ceramic (gukuraho igihe cyo gufata ibikoresho)
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Gusukura ibikoresho bya ceramic
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Gushyiramo wafer ku bikoresho byayo (bifite isuku n'uburyo bwo kugenzura ko igorofa rihagaze)
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Ikoreshwa mu nzira cyangwa mu bijyanye n'ibikoresho biri inyuma y'uruzinduko
Ibibazo Bikunze Kubazwa
Q1: Ni ibihe bibazo uyu murongo ukemura mbere na mbere?
A: Yoroshya ibikorwa byo gukusanya wafer nyuma yo kuyitunganya binyuze mu gushyira hamwe uburyo bwo gutandukanya/gukusanya wafer, gufunga ceramic carrier, gusukura carrier, no gushyira wafer mu murongo umwe uhujwe w’imikorere—bigabanya aho gukora intoki no gutuma umusaruro uhora uhindagurika.
Q2: Ni ibihe bikoresho bya wafer n'ingano bishyigikiwe?
A:Silikoni na SiC,santimetero 6–8wafers (nk'uko byagaragajwe).
Q3: Kuki isuku nyuma ya CMP yibandwaho mu nganda?
A: Inyandiko zikoreshwa mu nganda zigaragaza ko icyifuzo cyo gusukura neza nyuma ya CMP cyariyongereye ku buryo cyagabanyije ubucucike bw'ibisebe mbere y'intambwe ikurikiraho; uburyo bushingiye kuri megasonic bukunze kwigwaho kugira ngo bunoze gukuraho uduce duto.
Ku bijyanye natwe
XKH yihariye mu iterambere, gukora, no kugurisha ikirahure cyihariye cya optique n'ibikoresho bishya bya kristu. Ibicuruzwa byacu bitanga ibikoresho by'ikoranabuhanga bya optique, ibikoresho by'ikoranabuhanga bikoreshwa n'abantu, n'ibya gisirikare. Dutanga ibikoresho bya optique bya Safira, ibifuniko bya lens za telefoni zigendanwa, Ceramics, LT, Silicon Carbide SIC, Quartz, na semiconductor crystal wafers. Dufite ubuhanga n'ibikoresho bigezweho, turakora neza mu gutunganya ibicuruzwa bitari iby'ubuziranenge, tugamije kuba ikigo gikomeye mu ikoranabuhanga rigezweho mu bikoresho bya optoelectronic.












