Q: Ni ubuhe buryo bw'ingenzi bukoreshwa mu gukata no gutunganya SiC wafer?
A:Karubide ya silikoni (SiC) ifite ubukana bwa kabiri nyuma ya diyama kandi ifatwa nk'ikintu gikomeye cyane kandi cyoroshye kwangirika. Uburyo bwo gukata, bukubiyemo gukata kristu zakuze mo uduce duto tw'ibumba, bifata igihe kinini kandi bushobora gushwanyagurika. Nk'intambwe ya mbere muSiCGutunganya kristu imwe, ubwiza bw'ibice bigira ingaruka zikomeye ku gusya, gukosora no kugabanya. Gukata akenshi bitera imiyoboro yo hejuru n'iyo munsi y'ubutaka, bikongera igipimo cyo kuvunika kwa wafer n'ikiguzi cyo kuyikora. Kubwibyo, kugenzura kwangirika kw'ibice byo hejuru mu gihe cyo gukata ni ingenzi mu guteza imbere ikorwa ry'ibikoresho bya SiC.
Uburyo bwo gukata SiC buvugwa ubu burimo gukata ibintu mu buryo butaziguye, gukata ibintu mu buryo butaziguye, gukata hakoreshejwe laser, kohereza ibikoresho mu buryo butaziguye (gutandukanya ibintu mu buryo bukonje), no gukata ibikoresho mu buryo bukoresha amashanyarazi. Muri ubwo buryo, gukata insinga nyinshi hakoreshejwe diyama zidaziguye ni bwo buryo bukoreshwa cyane mu gutunganya kristu imwe ya SiC. Ariko, uko ingano y'insinga igera kuri santimetero 10 kuzamura, gukata insinga gakondo biragabanuka bitewe n'ibikenewe cyane mu bikoresho, ibiciro, n'imikorere micye. Hakenewe byihutirwa ikoranabuhanga ryo gukata ibintu mu buryo buhendutse, butakaza amafaranga menshi, kandi bukora neza cyane.
Q: Ni izihe nyungu zo gukata hakoreshejwe laser kuruta gukata insinga nyinshi bisanzwe?
A: Gukata insinga gakondo bigabanyaingot ya SiCmu cyerekezo runaka mu duce duto tw’ubugari bwa mikoroni amagana. Utwo duce duto dusya hakoreshejwe diyama kugira ngo dukureho ibimenyetso by’inkero n’ibyangiritse munsi y’ubutaka, hagakurikiraho polishing ya shimi (CMP) kugira ngo hagerwe ku buso bw’isi, hanyuma amaherezo tugasukurwa kugira ngo haboneke utubuto twa SiC.
Ariko, bitewe n’ubukana bwinshi bwa SiC no kuba yoroshye, izi ntambwe zishobora gutera kugorama, gucikamo ibice, kwiyongera kw’umusaruro, ikiguzi cyo hejuru cy’umusaruro, ndetse bigatera ubukana bwinshi bw’ubuso n’umwanda (umukungugu, amazi mabi, nibindi). Byongeye kandi, gukata insinga biratinda kandi bitanga umusaruro muke. Igereranya ryerekana ko gukata insinga nyinshi bisanzwe bikoresha ibikoresho bigera kuri 50% gusa, kandi kugeza kuri 75% by’ibikoresho biratakara nyuma yo gukosora no gusya. Amakuru ya mbere y’umusaruro wo mu mahanga yagaragaje ko bishobora gufata iminsi 273 yo gukora amasaha 24 ahoraho kugira ngo hakorwe wafer 10.000 - zitwara igihe kinini cyane.
Mu gihugu imbere, ibigo byinshi bikura kristale ya SiC byibanda ku kongera ubushobozi bw'itanura. Ariko, aho kongera umusaruro gusa, ni ngombwa cyane gutekereza ku buryo bwo kugabanya igihombo - cyane cyane iyo umusaruro w'ikura rya kristale utaragera ku rwego rwiza.
Ibikoresho byo gukata hakoreshejwe laser bishobora kugabanya cyane igihombo cy'ibikoresho no kongera umusaruro. Urugero, gukoresha mm 20 imweingot ya SiCGukata insinga bishobora gutanga wafer zigera kuri 30 z'ubugari bwa μm 350. Gukata laser bishobora gutanga wafer zirenga 50. Niba ubugari bwa wafer bugabanutse bukagera kuri μm 200, wafer zirenga 80 zishobora gukorwa muri ingot imwe. Nubwo gukata insinga bikoreshwa cyane ku wafer ndende za santimetero 1.8 cyangwa 1.8, gukata ingot ya SiC ya santimetero 1.8 bishobora gufata iminsi 10-15 hakoreshejwe uburyo gakondo, busaba ibikoresho bigezweho kandi bigatwara amafaranga menshi kandi bifite imikorere mike. Muri ibi bihe, ibyiza byo gukata laser biragaragara, bigatuma biba ikoranabuhanga rikuru ry'ejo hazaza ku wafer ndende za santimetero 1.8.
Mu gukata hakoreshejwe laser, igihe cyo gukata kuri wafer ya santimetero 8 gishobora kuba munsi y'iminota 20, naho igihombo cy'ibikoresho kuri wafer kikaba kiri munsi ya μm 60.
Muri make, ugereranije no gukata insinga nyinshi, gukata hakoreshejwe laser bitanga umuvuduko mwinshi, umusaruro mwiza, igihombo gito cy'ibikoresho, no gutunganya neza.
Q: Ni izihe mbogamizi zikomeye za tekiniki mu gukata SiC laser?
A: Uburyo bwo gukata hakoreshejwe laser bukubiyemo intambwe ebyiri z'ingenzi: guhindura laser no gutandukanya wafer.
Ishingiro ry'impinduka muri laser ni imiterere y'imirasire no kunoza imiterere y'ibipimo. Ibipimo nk'imbaraga za laser, umurambararo w'aho ibintu biherereye, n'umuvuduko wo gushakisha byose bigira ingaruka ku bwiza bw'ibikoresho no ku ntsinzi yo gutandukanya wafer nyuma. Imiterere y'agace kahinduwe igena ubukana bw'ubuso n'ingorane zo gutandukanya. Ubukana bwinshi bw'ubuso bugorana nyuma yo gusya kandi byongera igihombo cy'ibikoresho.
Nyuma yo guhindura, gutandukanya wafer akenshi bigerwaho binyuze mu mbaraga zo gukata, nko kuvunika kw'ubukonje cyangwa imbaraga za mekanike. Sisitemu zimwe zo mu rugo zikoresha transducers za ultrasonic kugira ngo zitere guhindagurika kugira ngo zitandukane, ariko ibi bishobora gutera ubusembwa bw'impinduka no gucika, bigagabanya umusaruro wa nyuma.
Nubwo izi ntambwe ebyiri zidakomeye, kutumvikana mu bwiza bwa kristalo—biterwa n'uburyo butandukanye bwo gukura, urugero rwo gukoresha imiti igabanya ubushyuhe, n'uburyo ibintu bikwirakwira mu mikorere—bigira ingaruka zikomeye ku kugorwa no gukata, umusaruro, no gutakaza ibikoresho. Gushaka gusa ahantu hafite ibibazo no guhindura ahantu hakoresha laser scanning bishobora kutazamura umusaruro cyane.
Urufunguzo rwo gukoresha ibikoresho byinshi ni uguteza imbere uburyo n'ibikoresho bishya bishobora guhuza n'imiterere itandukanye ya kristale ituruka ku nganda zitandukanye, kunoza ibipimo by'imikorere, no kubaka sisitemu zo gukata laser zifite akamaro kanini.
Q: Ese ikoranabuhanga ryo gukata hakoreshejwe laser rishobora gukoreshwa ku bindi bikoresho bya semiconductor bitari SiC?
A: Ikoranabuhanga ryo gukata laser ryakoreshejwe mu bihe bitandukanye. Mu byuma bikoresha imirasire, ryabanje gukoreshwa mu gukata wafer, kuva icyo gihe ryaragutse rigera no mu gukata kristu nini imwe.
Uretse SiC, gukata hakoreshejwe laser bishobora no gukoreshwa ku bindi bikoresho bikomeye cyangwa byoroshye nko muri diyama, gallium nitride (GaN), na gallium oxide (Ga₂O₃). Ubushakashatsi bwa mbere kuri ibi bikoresho bwagaragaje ko gukata hakoreshejwe laser bishoboka kandi byiza mu gukoresha semiconductor.
Q: Ese hari ibikoresho byo mu rugo bikuze byo gukata laser? Ubushakashatsi bwawe buri mu cyiciro ki?
A: Ibikoresho binini byo gukata SiC laser bifatwa nk'ibikoresho by'ingenzi mu gihe kizaza cyo gukora SiC wafer ya santimetero 8. Muri iki gihe, Ubuyapani ni bwo bwonyine bushobora gutanga ubwo buryo, kandi burahenze kandi bugengwa n'amategeko agenga kohereza mu mahanga.
Biteganyijwe ko mu gihugu hose hakenewe uburyo bwo gukata/kugabanya imitsi hakoreshejwe laser bugera ku 1.000, hashingiwe ku migambi yo gukora SiC n'ubushobozi bw'insinga zisanzweho. Ibigo bikomeye byo mu gihugu byashoye imari nyinshi mu iterambere, ariko nta bikoresho byo mu gihugu bigeze ku isoko kandi bigurishwa biragera ku nganda.
Amatsinda y’ubushakashatsi yagiye ategura ikoranabuhanga rya laser rishinzwe gukuraho imashini kuva mu 2001, none ubu ryakomeje kurikoresha kugeza ku gukata no kugabanya imashini za SiC. Bakoze sisitemu y’icyitegererezo n’uburyo bwo gukata bushobora: Gukata no kugabanya imashini za SiC za santimetero 4-6 Gukata imashini za SiC za santimetero 6-8 Ibipimo by’imikorere: santimetero 6-8 SiC ya semi-insulating: igihe cyo gukata iminota 10-15/wafer; igihombo cy’ibikoresho <30 μm6-8 santimetero SiC ya semi-insulating: igihe cyo gukata iminota 14-20/wafer; igihombo cy’ibikoresho <60 μm
Umusaruro wa wafer uteganijwe wiyongereyeho hejuru ya 50%
Nyuma yo gukata, wafer zujuje ibisabwa ku rwego rw'igihugu mu bijyanye n'imiterere y'ubutaka nyuma yo gusya no gusiga irangi. Ubushakashatsi bwerekana kandi ko ingaruka z'ubushyuhe ziterwa na laser zitagira ingaruka zikomeye ku muvuduko cyangwa imiterere y'ubutaka muri wafer.
Ibikoresho bimwe na bimwe byakoreshejwe mu kugenzura niba bishoboka gukata diyama, GaN, na Ga₂O₃ kristu imwe.
Igihe cyo kohereza: Gicurasi-23-2025