Uburebure bwa 6 -8

Ibisobanuro bigufi:

Uburebure bwa santimetero 6 kugeza kuri 8 LN-kuri-Si compte substrate ni ibikoresho bikora cyane bihuza firime imwe ya kirisiti ya lithium niobate (LN) yoroheje na firime ya silicon (Si), hamwe nubunini buri hagati ya 0.3 mm na 50 mm. Yashizweho kugirango igezweho ya semiconductor hamwe nibikoresho bya optoelectronic. Ukoresheje uburyo bugezweho bwo guhuza cyangwa gukura kwa epitaxial, iyi substrate itanga ubuziranenge bwa kristaline ya firime ya LN yoroheje mugihe ikoresha ubunini bwa wafer (6-santimetero 8-santimetero 8) ya silicon kugirango yongere umusaruro kandi ikore neza.
Ugereranije nibikoresho bisanzwe bya LN, santimetero 6 kugeza kuri 8-LN-kuri-Si compte substrate itanga ubushyuhe buhebuje bwo guhuza ubushyuhe hamwe nubukanishi bukomeye, bigatuma bukwirakwira murwego runini rwa wafer. Byongeye kandi, ubundi buryo bwibanze nkibikoresho bya SiC cyangwa safiro birashobora gutoranywa kugirango byuzuze ibisabwa byihariye, harimo ibikoresho bya RF-byihuta cyane, ibikoresho bya fotonike, hamwe na sensor ya MEMS.

Ohereza imeri kuri twe

Ibicuruzwa birambuye

Ibicuruzwa

Ibipimo bya tekiniki

0.3-50μm LN / LT kuri Insulator
Igice cyo hejuru
Diameter	6-8
Icyerekezo	X, Z, Y-42 n'ibindi
Ibikoresho	LT, LN
Umubyimba	0.3-50 mm
Substrate （Yashizweho）
Ibikoresho	Si, SiC, Safiro, Spinel, Quartz

Ibintu by'ingenzi

Ubuso bwa santimetero 6 kugeza kuri 8 LN-kuri-Si igizwe na substrate itandukanijwe numutungo wihariye wibikoresho hamwe nibipimo bihinduka, bigafasha gukoreshwa mugace ka semiconductor na optoelectronic inganda:

1.Ihuza rinini rya Wafer: Ingano ya wafer ya santimetero 6 kugeza kuri 8 itanga ubwuzuzanye hamwe n'imirongo ihimbano ya semiconductor isanzwe (urugero, inzira ya CMOS), kugabanya ibiciro byumusaruro no gutuma umusaruro rusange.

2.Ubuziranenge bwa Crystalline: Uburyo bwiza bwa epitaxial cyangwa guhuza tekinike butuma ubucucike buke buri muri firime ya LN yoroheje, bigatuma biba byiza kuri moderi ikora neza cyane, moderi ya acoustic wave (SAW), nibindi bikoresho byuzuye.

3.Ubunini bushobora guhinduka (0.3-50 μ m): Ibice bya Ultrathin LN (<1 μ m) bikwiranye na chip ya fotonike ihuriweho, mugihe ibice binini (10-50 mm) bifasha ibikoresho bya RF bifite ingufu nyinshi cyangwa sensor ya piezoelectric.

4.Uburyo butandukanye bwo guhitamo: Usibye Si, SiC (hejuru yubushyuhe bwo hejuru bwumuriro) cyangwa safiro (insulation nyinshi) irashobora gutoranywa nkibikoresho fatizo kugirango ihuze ibyifuzo byumuvuduko mwinshi, ubushyuhe bwinshi, cyangwa imbaraga nyinshi zikoreshwa.

5.Ubushuhe bwumuriro nubukanishi: Substrate ya silicon itanga ubufasha bukomeye bwubukanishi, kugabanya kugabanuka cyangwa guturika mugihe cyo gutunganya no kuzamura umusaruro wibikoresho.

Ibiranga umwanya wa santimetero 6 kugeza kuri 8-LN-kuri-Si compte substrate nkibikoresho byatoranijwe byikoranabuhanga rigezweho nka 5G itumanaho, LiDAR, na kwant optique.

Porogaramu nyamukuru

Ubuso bwa santimetero 6 kugeza kuri 8 LN-kuri-Si comprate substrate ikoreshwa cyane mubikorwa byubuhanga buhanitse kubera amashanyarazi adasanzwe ya optique, piezoelectric, na acoustic:

1.Itumanaho ryitumanaho hamwe na Photonics ihuriweho: Ifasha modulatrice yihuta ya electro-optique modulator, umurongo wogukoresha, hamwe na fotonike ihuriweho hamwe (PICs), bikemura umurongo mugari wibigo byamakuru hamwe numuyoboro wa fibre optique.

2.5G / 6G Ibikoresho bya RF: Coefficient ya piezoelectric ya LN ituma biba byiza kubutaka bwa acoustic (SAW) hamwe na filteri ya acoustic wave (BAW), byongera uburyo bwo gutunganya ibimenyetso muri sitasiyo ya 5G hamwe nibikoresho bigendanwa.

3.MEMS na Sensors: Ingaruka ya piezoelectric ya LN-on-Si yorohereza umuvuduko ukabije wa moteri yihuta, biosensor, na transducers ya ultrasonic ikoreshwa mubuvuzi ninganda.

4.Ikoranabuhanga rya Quantum: Nkibikoresho bidafite umurongo wa optique, firime ya LN yoroheje ikoreshwa mumasoko yumucyo (urugero, ifoto ya foton ifatanye) hamwe na chip ya chip.

5.Laseri na Optics idafite umurongo: Ultrathin LN ituma igisekuru cyiza cya kabiri-gihuza (SHG) hamwe nibikoresho bya optique ya oscillation (OPO) ibikoresho byo gutunganya laser no gusesengura spekitroscopique.

Ubusanzwe bwa santimetero 6 kugeza kuri 8-LN-kuri-Si igizwe na substrate ituma ibyo bikoresho bikorerwa muri feri nini ya wafer, bikagabanya cyane ibiciro byumusaruro.

Guhitamo no gutanga serivisi

Dutanga ubufasha bwuzuye bwa tekiniki hamwe na serivise yihariye ya santimetero 6 kugeza kuri 8-LN-kuri-Si igizwe na substrate kugirango duhuze R&D zitandukanye nibikenerwa mu musaruro:

1.Ibihimbano bya Customer: Ubunini bwa firime ya LN (0.3-50 mkm), icyerekezo cya kristu (X-gukata / Y-gukata), hamwe nibikoresho bya substrate (Si / SiC / safiro) birashobora guhuzwa kugirango imikorere yimikorere igerweho.

2.Icyiciro cya Wafer-Urwego: Gutanga byinshi kuri waferi ya santimetero 6 na santimetero 8, harimo serivisi zinyuma nko gushushanya, gusiga, no gutwikira, kwemeza ko insimburangingo ziteguye guhuza ibikoresho.

3.Ubujyanama bwa Tekinike no Kwipimisha: Ibiranga ibikoresho (urugero, XRD, AFM), kugerageza imikorere ya electro-optique, hamwe no kwigana ibikoresho kugirango byihute kwemeza ibishushanyo.

Inshingano yacu ni ugushiraho santimetero 6 kugeza kuri 8-LN-kuri-Si igizwe nubutaka nkibisubizo byingenzi byibikoresho bya optoelectronic na semiconductor, bitanga inkunga iherezo-iherezo kuva R&D kugeza ku musaruro rusange.

Umwanzuro

Ubuso bwa santimetero 6 kugeza kuri 8 LN-kuri-Si igizwe na substrate, hamwe nubunini bwayo bwa wafer, ubwiza bwibintu bisumba byose, hamwe na byinshi, bigenda bitera imbere mu itumanaho ryiza, 5G RF, hamwe na tekinoroji ya kwant. Haba kubikorwa byinshi cyane cyangwa ibisubizo byabigenewe, dutanga insimburangingo zizewe hamwe na serivisi zuzuzanya kugirango dushoboze guhanga udushya mu ikoranabuhanga.