150mm 6 cm 0.7mm 0.5mm Safiro Wafer Substrate Umwikorezi C-Indege SSP / DSP

Ibisobanuro bigufi:

Byose byavuzwe haruguru nibisobanuro nyabyo bya kristu ya safiro. Imikorere myiza ya safiro kristu ituma ikoreshwa cyane murwego rwohejuru rwa tekiniki. Hamwe niterambere ryihuse ryinganda za LED, isabwa ryibikoresho bya kirisiti ya safiro nayo iriyongera.


Ibicuruzwa birambuye

Ibicuruzwa

Porogaramu

Gusaba waferi ya santimetero 6 zirimo:

.

2. Gukora lazeri: Wafer ya safiro irashobora kandi gukoreshwa nka substrate ya laser, kugirango ifashe kunoza imikorere ya laser no kongera igihe cya serivisi.

3. Gukora Semiconductor: Wafers ya safiro ikoreshwa cyane mugukora ibikoresho bya elegitoroniki na optoelectronic, harimo synthesis optique, selile izuba, ibikoresho bya elegitoroniki byihuta cyane, nibindi.

4.

Ibisobanuro

Ibikoresho Isuku ryinshi kristaliste Al2O3, wafiro wafer.
Igipimo 150 mm +/- 0,05 mm, santimetero 6
Umubyimba 1300 +/- 25 um
Icyerekezo Indege C (0001) kuri M (1-100) indege 0.2 +/- 0.05 dogere
Icyerekezo cyibanze Indege +/- 1 dogere
Uburebure bwibanze 47.5 mm +/- 1 mm
Gutandukana kwinshi (TTV) <20 um
Umuheto <25 um
Intambara <25 um
Coefficient yo Kwagura Ubushyuhe 6.66 x 10-6 / ° C ibangikanye na C axis, 5 x 10-6 / ° C perpendicular kuri C axis
Imbaraga za Dielectric 4.8 x 105 V / cm
Umuyoboro uhoraho 11.5 (1 MHz) hafi ya C axis, 9.3 (1 MHz) perpendicular kuri C axis
Gutakaza Dielectric Tangent (bita ibintu byo gutandukana) munsi ya 1 x 10-4
Amashanyarazi 40 W / (mK) kuri 20 ℃
Kuringaniza uruhande rumwe rusize (SSP) cyangwa uruhande rumwe rusize (DSP) Ra <0.5 nm (na AFM). Uruhande rwinyuma rwa SSP wafer rwari rwiza kuri Ra = 0.8 - 1.2 um.
Kwimura 88% +/- 1% @ 460 nm

Igishushanyo kirambuye

6inch safi wafer4
6inch safi wafer5

  • Mbere:
  • Ibikurikira:

  • Andika ubutumwa bwawe hano hanyuma utwohereze