Dia50.8mm Safiro Wafer Sapphire Idirishya Ihanitse rya Optical Transmitance DSP / SSP

Ibisobanuro bigufi:

Bitewe na lattike idahuye neza hamwe nimiti ihamye ya chimique na physique, wafer (Al2O3) wafer ni insimburangingo izwi cyane ya nitride ya III-V, superconductor na magnetiki epi-firime.Zikoreshwa cyane muri GaN no gukura kwa epitaxial epitaxial, silicon kuri safiro, isoko rya LED ninganda za optique.

Ohereza imeri kuri twe

Ibicuruzwa birambuye

Ibicuruzwa

Kuki Safiro?

Ibiranga safiro imwe
1. Safiro ifite imiyoboro ihanitse ya optique, bityo ikoreshwa cyane nkibikoresho bya mikorobe ya elegitoroniki ya dielectric, ibintu bitwara ultrasonic, imiyoboro ya lazeri, nibindi bikoresho bya optique, nkibikoresho byidirishya ryibikoresho bya gisirikare bitagira infrarasiyo, ibinyabiziga byo mu kirere, lazeri nyinshi cyane na optique itumanaho.

2. Safiro ifite ubukana bwinshi, imbaraga nyinshi, ubushyuhe bukabije bwakazi, kurwanya abrasion, ibiranga ruswa, bityo rero insimburangingo ya safiro ikoreshwa kenshi mubidukikije bikaze, nko gupima amazi ya boiler (kurwanya ubushyuhe bwo hejuru), gusikana kode y'ibicuruzwa, kwikorera, nibindi bikorwa byuzuye (kwambara birwanya), amakara, gaze, ibyuma byerekana neza na windows ya detector (anti-ruswa).

3. Safiro ifite ibiranga amashanyarazi, gukorera mu mucyo, gutwara neza ubushyuhe, no gukomera cyane, bityo rero irashobora gukoreshwa nkibikoresho byo munsi yumuzunguruko uhuriweho, nka LED na microelectronic circuit, ultra-yihuta yihuta yumuzunguruko.

Ibisobanuro

Diameter	50.8mm +/- 0.1mm cyangwa +/- 0.02mm
Umubyimba	0.43mm ± 0.1mm cyangwa +/- 0.02mm
Icyerekezo	C-indege / A-Indege / M-Indege / R-Indege
Ubwiza bwubuso (gushushanya & gucukura)	60/40, 40/20 cyangwa byiza
Ubuso bwuzuye	λ / 10, λ / 2, λ
Sobanura neza	> 85%,> 90%
Kubangikanya	+/- 3 ', +/- 30' '
Bevel	0.1 ~ 0.3mm × 45 dogere
Igipfukisho	AR, BBAR cyangwa bisabwe nabakiriya (UV, VIS, IR)

Oya	Ibyiza	Intego	Ubworoherane	Ijambo
1	Diameter	50.8mm	± 0.1mm
2	Umubyimba	430 mm	± 15μm
3	Icyerekezo cyubuso bwa C-indege	kuri C-axis kuri M0.2 °	± 0.1 °
4	Uburebure bwibanze	16mm	Mm 11mm
5	Icyerekezo cyibanze	Indege (11-20)	± 0.1 °
6	Uruhande rwinyuma Roughness	0.8 ~ 1.2um
7	Uruhande rw'imbere Roughness	<0.3nm
8	Inkombe	Ubwoko bwa R.
9	Gutandukana kwinshi, TTV	≤ 10μm (LTV≤5μm, 5 * 5)
10	SORI	≤10μm
11	Umuheto	-10 μm ≤ BOW ≤ 0
12	Ikimenyetso	N / A.		udafite
	Amapaki	25 wafer muri cassette imwe
	Gukurikirana ubushobozi	Wafers igomba gukurikiranwa kubijyanye numero ya cassette

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