150mm 6 cm 0.7mm 0.5mm Safiro Wafer Substrate Umwikorezi C-Indege SSP / DSP

Ibisobanuro bigufi:

Byose byavuzwe haruguru nibisobanuro nyabyo bya kristu ya safiro. Imikorere myiza ya safiro kristu ituma ikoreshwa cyane murwego rwohejuru rwa tekiniki. Hamwe niterambere ryihuse ryinganda za LED, isabwa ryibikoresho bya kirisiti ya safiro nayo iriyongera.

Ohereza imeri kuri twe

Ibicuruzwa birambuye

Ibicuruzwa

Porogaramu

Gusaba waferi ya santimetero 6 zirimo:

2. Gukora lazeri: Wafer ya safiro irashobora kandi gukoreshwa nka substrate ya laser, kugirango ifashe kunoza imikorere ya laser no kongera ubuzima bwa serivisi.

3. Gukora Semiconductor: Wafers ya safiro ikoreshwa cyane mugukora ibikoresho bya elegitoroniki na optoelectronic, harimo synthesis optique, selile izuba, ibikoresho bya elegitoroniki byihuta cyane, nibindi.

Ibisobanuro

Ibikoresho	Isuku ryinshi kristaliste Al2O3, wafiro wafer.
Igipimo	150 mm +/- 0,05 mm, santimetero 6
Umubyimba	1300 +/- 25 um
Icyerekezo	Indege C (0001) kuri M (1-100) indege 0.2 +/- 0.05 dogere
Icyerekezo cyibanze	Indege +/- 1 dogere
Uburebure bwibanze	47.5 mm +/- 1 mm
Gutandukana kwinshi (TTV)	<20 um
Umuheto	<25 um
Intambara	<25 um
Coefficient yo Kwagura Ubushyuhe	6.66 x 10-6 / ° C ibangikanye na C axis, 5 x 10-6 / ° C perpendicular kuri C axis
Imbaraga za Dielectric	4.8 x 105 V / cm
Umuyoboro uhoraho	11.5 (1 MHz) hafi ya C axis, 9.3 (1 MHz) perpendicular kuri C axis
Gutakaza Dielectric Tangent (bita ibintu byo gutandukana)	munsi ya 1 x 10-4
Amashanyarazi	40 W / (mK) kuri 20 ℃
Kuringaniza	uruhande rumwe rusize (SSP) cyangwa uruhande rumwe rusize (DSP) Ra <0.5 nm (na AFM). Uruhande rwinyuma rwa SSP wafer rwari rwiza kuri Ra = 0.8 - 1.2 um.
Kwimura	88% +/- 1% @ 460 nm