Ibikoresho bya Microjet bya laser bya wafer bikata ibikoresho bya SiC

Gukata ibikoresho bya microjet laser wafer mu buryo bwa SiC, gutunganya ibikoresho byayo. Ishusho yagaragaye.

Ibisobanuro bigufi:

Ibikoresho bya ikoranabuhanga rya laser ya Microjet ni ubwoko bw'uburyo bwo gutunganya neza buhuza laser ifite ingufu nyinshi n'indege y'amazi yo mu rwego rwa micron. Mu guhuza umuyoboro wa laser n'indege y'amazi yihuta cyane (amazi yakuwemo iion cyangwa amazi yihariye), gutunganya ibikoresho hakoreshejwe uburyo bworoshye kandi buciriritse bwo kwangirika kw'ubushyuhe bukabije bishobora gukorwa. Iri koranabuhanga rikwiriye cyane cyane mu guca, gucukura no gutunganya ibikoresho bikomeye kandi byoroshye (nka SiC, safiro, ikirahure), kandi rikoreshwa cyane mu bikoresho bya semiconductor, photoelectric ecran, ibikoresho by'ubuvuzi n'ibindi.

Ohereza imeri kuri twe

Ibiranga

Ihame ry'imikorere:

1. Guhuza laser: laser ifite pulse (UV/green/infrared) iba yibanzwe imbere mu muyoboro w'amazi kugira ngo ikore umuyoboro uhamye wo kohereza ingufu.

2. Ubuyobozi bw'amazi: indege yihuta cyane (umuvuduko w'amazi 50-200m/s) ikonjesha aho itunganyirizwa no gukuraho imyanda kugira ngo hirindwe ubwinshi bw'ubushyuhe n'umwanda.

3. Gukuraho ibikoresho: Ingufu za laser zitera ingaruka zo gufunga amazi mu mazi kugira ngo ibintu bikonje bitunganywe (agace kagizweho ingaruka n'ubushyuhe <1μm).

4. Igenzura rikoresha imbaraga: guhindura ibipimo bya laser mu buryo bwihuse (ingufu, inshuro) n'umuvuduko wa jet kugira ngo bihuze n'ibikenewe mu bikoresho n'imiterere itandukanye.

Ibipimo by'ingenzi:

1. Ingufu za laser: 10-500W (zishobora guhindurwa)

2. Umurambararo wa jet: 50-300μm

3.Uburyo bwo gukoresha imashini neza: ± 0.5μm (gukata), uburebure n'ubugari bw'igipimo cya 10:1 (gucukura)

Ibyiza bya tekiniki:

(1) Hafi ya nta ngaruka z'ubushyuhe zangiritse
- Gukonjesha indege y'amazi bigenzura agace kagizweho n'ubushyuhe (HAZ) kugeza kuri **<1μm**, birinda imiyoboro mito iterwa no gutunganya laser isanzwe (HAZ ubusanzwe ni >10μm).

(2) Imirimo yo gutunganya ibintu neza cyane
- Gukata/gucukura neza kugeza kuri **±0.5μm**, ubukana bw'inkombe Ra<0.2μm, bigabanya gukenera gusigwa nyuma.

- Gushyigikira gutunganya imiterere ya 3D (nk'imyobo ifite ishusho y'urukiramende, imyanya ifite ishusho).

(3) Guhuza ibintu byinshi
- Ibikoresho bikomeye kandi byoroshye kwangirika: SiC, safiro, ikirahure, iseramike (uburyo gakondo bworoshye kumenagura).

- Ibikoresho bishobora kwangirika mu bushyuhe: polymer, ingirabuzimafatizo z’ibinyabuzima (nta ngaruka zo kwangirika k’ubushyuhe).

(4) Kurengera ibidukikije no kubikoresha neza
- Nta ivumbi ryandujwe, amazi ashobora kongera gukoreshwa no kuyungururwa.

- Kongera umuvuduko wo gutunganya ibintu ku kigero cya 30%-50% (ugereranyije no gukora imashini).

(5) Igenzura ry'ubwenge
- Gushyira hamwe uburyo bwo kureba no kunoza ibipimo bya AI, ubugari bw'ibikoresho bihindagurika n'inenge.

Ibisobanuro bya tekiniki:

Ingano y'aho ukorera	300300150	400400200
Umurongo XY	Moteri y'umurongo. Moteri y'umurongo	Moteri y'umurongo. Moteri y'umurongo
Umurongo w'umurongo Z	150	200
Uburinganire bwo gushyiramo μm	+/-5	+/-5
Uburyo bwo gushyiramo ibintu mu mwanya wa μm busubiwemo	+/-2	+/-2
Kwihutisha G	1	0.29
Igenzura ry'imibare	Umurongo 3 /umurongo 3+1 /umurongo 3+2	Umurongo 3 /umurongo 3+1 /umurongo 3+2
Ubwoko bw'igenzura ry'imibare	DPSS Nd:YAG	DPSS Nd:YAG
Uburebure bw'umuraba nm	532/1064	532/1064
Ingufu zifite amanota W	50/100/200	50/100/200
Indege yo mu mazi	40-100	40-100
Akadomo k'umuvuduko w'amazi	50-100	50-600
Ingano (igikoresho cy'imashini) (ubugari * uburebure * uburebure) mm	144519442260	170015002120
Ingano (akabati ko kugenzura) (Ub * Ub * Ub)	70025001600	70025001600
Uburemere (ibikoresho) T	2.5	3
Uburemere (akabati ko kugenzura) KG	800	800
Ubushobozi bwo gutunganya	Ubushyuhe bw'ubuso Ra≤1.6um Umuvuduko wo gufungura ≥1.25mm/s Gukata uruziga ≥6mm/s Umuvuduko wo gukata umurongo ≥50mm/s	Ubukana bw'ubuso bwa Ra≤1.2um Umuvuduko wo gufungura ≥1.25mm/s Gukata uruziga ≥6mm/s Umuvuduko wo gukata umurongo ≥50mm/s
	Ku bijyanye na kristalo ya gallium nitride, ibikoresho bya semiconductor bya ultra-wide band gap (diamond/Gallium oxide), ibikoresho byihariye by’ikirere, substrate ya ceramic ya karuboni ya LTCC, photovoltaic, crystal ya scintillator n'ibindi bikoresho bitunganywa. Icyitonderwa: Ubushobozi bwo gutunganya ibintu buratandukanye bitewe n'imiterere y'ibikoresho

Ikirahure cyo gutunganya:

Serivisi za XKH:

XKH itanga serivisi zose z’ubuzima bwose ku bikoresho bya microjet laser, kuva ku itegurwa rya mbere ry’ibikorwa no guhitamo ibikoresho, kugeza ku ihuzwa rya sisitemu yihariye mu gihe cyo hagati (harimo guhuza inkomoko ya laser, sisitemu ya jet na module y’ikoranabuhanga), kugeza ku mahugurwa yo gukora no kubungabunga nyuma no kunoza ibikorwa, inzira yose ifite inkunga y’itsinda ry’abahanga mu bya tekiniki; Dushingiye ku bunararibonye bw’imyaka 20 mu gukora neza, dushobora gutanga ibisubizo byihuse birimo kugenzura ibikoresho, gutangiza umusaruro mwinshi no gusubiza vuba nyuma yo kugurisha (amasaha 24 y’inkunga ya tekiniki + ubwishingizi bw’ibice by’ingenzi) ku nganda zitandukanye nka semiconductor na medical, kandi dusezeranya garanti y’amezi 12 na serivisi yo kubungabunga no kuvugurura ubuzima bwose. Menya neza ko ibikoresho by’abakiriya bihora bibungabunga imikorere myiza mu gutunganya no gushimangira.