Microjet laser ibikoresho byikoranabuhanga wafer gukata ibikoresho bya SiC

Microjet laser yikoranabuhanga ibikoresho wafer gukata ibikoresho bya SiC gutunganya Ishusho Yerekanwe

Ibisobanuro bigufi:

Ibikoresho bya tekinoroji ya Microjet ni ubwoko bwa sisitemu yo gutunganya ibintu neza ihuza ingufu za laser nyinshi hamwe na jet yo mu rwego rwa micron. Muguhuza urumuri rwa lazeri nindege yihuta yamazi (amazi ya deioniyo cyangwa amazi adasanzwe), gutunganya ibikoresho hamwe nibisobanuro bihanitse kandi byangiza ubushyuhe burashobora kugerwaho. Iri koranabuhanga rirakwiriye cyane cyane gutema, gucukura no gutunganya microstructure yo gutunganya ibikoresho bikomeye kandi byoroshye (nka SiC, safiro, ikirahure), kandi bikoreshwa cyane muri semiconductor, kwerekana amashanyarazi, ibikoresho byubuvuzi nibindi bice.

Ohereza imeri kuri twe

Ibicuruzwa birambuye

Ibicuruzwa

Ihame ry'akazi ：

1. Guhuza lazeri: pulsed laser (UV / icyatsi / infrared) yibanze imbere yindege kugirango ibe umuyoboro uhoraho w'ingufu.

3. Gukuraho ibikoresho: Ingufu za lazeri zitera ingaruka ya cavitation mumazi kugirango igere ku gutunganya ubukonje bwibintu (zone yibasiwe nubushyuhe <1μm).

4. Igenzura rifite imbaraga: igihe nyacyo cyo guhindura ibipimo bya laser (imbaraga, inshuro) hamwe nigitutu cyindege kugirango uhuze ibikenewe nibikoresho bitandukanye.

Ibipimo by'ingenzi:

1. Imbaraga za Laser: 10-500W (irashobora guhinduka)

2. Diameter y'indege: 50-300 mm

3.Gukora neza: ± 0.5μm (gukata), ubujyakuzimu n'ubugari bwa 10: 1 (gucukura)

Ibyiza bya tekiniki:

(1) Hafi ya zeru yangiritse
- Gukonjesha indege ikonjesha igenzura ubushyuhe bwibasiwe nubushyuhe (HAZ) kugeza kuri ** <1μm **, ukirinda uduce duto duto twatewe no gutunganya lazeri isanzwe (HAZ ni> 10μm).

(2) Gutunganya cyane-hejuru cyane
- Gukata / gucukura neza kugeza kuri ** ± 0.5μm **, gukomera kuruhande Ra <0.2μm, kugabanya gukenera gukurikiraho.

- Shyigikira uburyo butunganijwe bwa 3D butunganijwe (nkibyobo bya conic, ibibanza bimeze).

(3) Guhuza ibikoresho byinshi
- Ibikoresho bikomeye kandi byoroshye: SiC, safiro, ikirahure, ububumbyi (uburyo gakondo biroroshye kumeneka).

- Shyushya ibikoresho byoroshye: polymers, tissue biologique (nta ngaruka zo gutandukana nubushyuhe).

(4) Kurengera ibidukikije no gukora neza
- Nta mwanda wanduye, amazi ashobora gutunganywa no kuyungurura.

- 30% -50% kwiyongera mumuvuduko wo gutunganya (va gutunganya).

(5) Igenzura ryubwenge
.

Ibisobanuro bya tekiniki ：

Ingano ya Countertop	300 * 300 * 150	400 * 400 * 200
Umurongo ugaragara XY	Moteri y'umurongo. Moteri y'umurongo	Moteri y'umurongo. Moteri y'umurongo
Umurongo w'umurongo Z.	150	200
Umwanya uhagaze neza μm	+/- 5	+/- 5
Gusubiramo umwanya wukuri μm	+/- 2	+/- 2
Kwihuta G.	1	0.29
Kugenzura umubare	3 axis / 3 + 1 axis / 3 + 2 axis	3 axis / 3 + 1 axis / 3 + 2 axis
Ubwoko bwo kugenzura umubare	DPSS Nd: YAG	DPSS Nd: YAG
Uburebure bwa nm	532/1064	532/1064
Imbaraga zagereranijwe W.	50/100/200	50/100/200
Indege y'amazi	40-100	40-100
Akabari ka Nozzle	50-100	50-600
Ibipimo (igikoresho cyimashini) (ubugari * uburebure * uburebure) mm	1445 * 1944 * 2260	1700 * 1500 * 2120
Ingano (kugenzura inama) (W * L * H)	700 * 2500 * 1600	700 * 2500 * 1600
Uburemere (ibikoresho) T.	2.5	3
Uburemere (kugenzura inama) KG	800	800
Ubushobozi bwo gutunganya	Ubuso bwubuso Ra≤1.6um Umuvuduko wo gufungura ≥1.25mm / s Gukata umuzenguruko ≥6mm / s Umuvuduko wo kugabanya umurongo ≥50mm / s	Ubuso bwubuso Ra≤1.2um Umuvuduko wo gufungura ≥1.25mm / s Gukata umuzenguruko ≥6mm / s Umuvuduko wo kugabanya umurongo ≥50mm / s
	Kuri gallium nitride kristal, ultra-rugari ya bande ya semiconductor (diamant / Gallium oxyde), ibikoresho byihariye byo mu kirere, LTCC carbone ceramic substrate, Photovoltaic, scintillator kristal nibindi gutunganya ibikoresho. Icyitonderwa: Ubushobozi bwo gutunganya buratandukanye bitewe nibiranga ibintu

Urubanza rutunganijwe:

Serivisi za XKH:

XKH itanga urwego rwuzuye rwa serivise yubuzima bwuzuye kubikoresho bya tekinoroji ya microjet ya laser, uhereye kubikorwa byambere byo gutezimbere no kugisha inama ibikoresho, kugeza igihe cyo hagati ya sisitemu yihariye (harimo guhuza bidasanzwe inkomoko ya laser, sisitemu yindege hamwe na modoka yimodoka), kugeza kumikorere nyuma yo guhugura no kubungabunga no gukomeza inzira nziza, inzira yose ifite ibikoresho byabakozi ba tekinike babigize umwuga; Dushingiye kumyaka 20 yuburambe bwo gutunganya neza, turashobora gutanga igisubizo kimwe gusa harimo kugenzura ibikoresho, kumenyekanisha umusaruro mwinshi hamwe na nyuma yo kugurisha byihuse (amasaha 24 yubufasha bwa tekiniki + ibikoresho byingenzi byabigenewe) kubikorwa bitandukanye nka semiconductor nubuvuzi, kandi dusezeranya garanti yamezi 12 hamwe no kubungabunga ubuzima no kuzamura serivisi. Menya neza ko ibikoresho byabakiriya bihora bikomeza inganda ziyobora gutunganya no gutuza.