Semiconductor Laser Lift-Off Ibikoresho

Ibisobanuro bigufi:

Ibikoresho bya Semiconductor Laser Lift-Off byerekana igisubizo cyibisekuru bizakurikiraho kugirango ingot igabanuke mu gutunganya ibikoresho bya semiconductor. Bitandukanye nuburyo gakondo bwa wafering bushingiye ku gusya kwa mashini, kubona insinga za diyama, cyangwa gutegekanya imiti-mashini, iyi platform ishingiye kuri laser itanga uburyo budahuza, butangiza ibyangiza uburyo bwo gutandukanya ibice bya ultra-thin biva mubice byinshi bya semiconductor.

Gukoresha ibikoresho byoroheje kandi bifite agaciro kanini nka gallium nitride (GaN), karbide ya silicon (SiC), safiro, na gallium arsenide (GaAs), ibikoresho bya Semiconductor Laser Lift-Off ibikoresho bifasha gukata neza amafirime manini aturutse muri kristu. Ubu buhanga bugezweho bugabanya cyane imyanda yibintu, itezimbere ibyinjira, kandi byongera ubunyangamugayo bwa substrate - ibyo byose nibyingenzi mubikoresho bizakurikiraho mubikoresho bya elegitoroniki, sisitemu ya RF, fotonike, na micro-yerekana.

Ohereza imeri kuri twe

Ibiranga

Igishushanyo kirambuye

Incamake y'ibicuruzwa bya Laser Lift-Off ibikoresho

Hamwe no gushimangira kugenzura byikora, gushiraho ibiti, hamwe na laser-material imikoranire yisesengura, ibikoresho bya Semiconductor Laser Lift-Off ibikoresho byashizweho kugirango byinjizwe mu buryo budasubirwaho mu bikorwa byo guhimba igice cya semiconductor mugihe dushyigikira R&D ihinduka kandi ikanagerwaho cyane.

Ikoranabuhanga & Gukoresha Ihame rya Laser Lift-Off ibikoresho

Inzira ikorwa na Semiconductor Laser Lift-Off ibikoresho bitangirana no kurasa abaterankunga ingot kuruhande rumwe ukoresheje ultraviolet laser beam. Uru rumuri rwibanze cyane kubwimbitse bwimbere, mubisanzwe bikurikiranye na injeniyeri, aho kwinjiza ingufu cyane kubera optique, ubushyuhe, cyangwa imiti itandukanye.

Kuri ubu buryo bwo kwinjiza ingufu, ubushyuhe bwaho buganisha kuri micro-guturika byihuse, kwaguka kwa gaze, cyangwa kubora kwurwego rudasanzwe (urugero, firime yibibazo cyangwa oxyde yo gutamba). Ihungabana ryagenzuwe neza ritera urwego rwo hejuru rwa kristaline - hamwe nubunini bwa micrometero icumi - gutandukana na base ingot neza.

Ibikoresho bya Semiconductor Laser Lift-Off Ibikoresho byifashisha icyerekezo-cyogusikana imitwe, kugenzura z-axis igenzurwa, hamwe nigihe nyacyo cyo kwerekana kugirango impiswi zose zitange ingufu muburyo bwindege. Ibikoresho birashobora kandi gushyirwaho hamwe nuburyo buturika cyangwa ubushobozi bwa pulse nyinshi kugirango byongere ubwitonzi kandi bigabanye imihangayiko isigaye. Icyangombwa, kubera ko urumuri rwa lazeri rutigera ruhuza ibikoresho kumubiri, ibyago byo gukurikiranwa na microcracking, kunama, cyangwa gukata hejuru biragabanuka cyane.

Ibi bituma laser yo gukuramo uburyo bwo kunanura uburyo bwo guhindura umukino, cyane cyane mubisabwa aho usanga ultra-flat, ultra-thin wafers isabwa na sub-micron TTV (Total Thickness Variation).

Parameter ya Semiconductor Laser Lift-Off Ibikoresho

Uburebure	IR / SHG / THG / FHG
Ubugari bwa Pulse	Nanosekond, Picosekond, Femtosekond
Sisitemu nziza	Sisitemu ihamye cyangwa sisitemu ya Galvano-optique
Icyiciro cya XY	500 mm × 500 mm
Urwego rwo gutunganya	Mm 160
Umuvuduko wo kugenda	Max 1000 mm / amasegonda
Gusubiramo	± 1 mm cyangwa munsi yayo
Umwanya wuzuye neza:	± 5 mm cyangwa munsi yayo
Ingano ya Wafer	Santimetero 2-6 cyangwa kugenwa
Kugenzura	Windows 10,11 na PLC
Amashanyarazi	AC 200 V ± 20 V, Icyiciro kimwe, 50/60 kHz
Ibipimo byo hanze	2400 mm (W) × 1700 mm (D) × 2000 mm (H)
Ibiro	1.000 kg

Inganda zikoreshwa mu bikoresho bya Laser Lift-Off ibikoresho

Semiconductor Laser Lift-Off Ibikoresho birahindura byihuse uburyo ibikoresho byateguwe murwego rwinshi rwa semiconductor:

Ibikoresho bya Vertical GaN Ibikoresho bya Laser Lift-Off ibikoresho

Kuzamura firime ya ultra-thin GaN-kuri-GaN ivuye muri ingots nyinshi ituma imyubakire ihagaze neza kandi igakoresha insimburangingo zihenze.

SiC Wafer Yoroheje kubikoresho bya Schottky na MOSFET

Kugabanya umubyimba wibikoresho mugihe urinda substrate planarite - nibyiza kubyihuta byihuta bya electronics.

LED ishingiye kuri safiro no kwerekana ibikoresho bya Laser Lift-Off ibikoresho

Gushoboza gutandukanya neza ibice byibikoresho biva muri safiro kugirango bishyigikire umusaruro, micro-LED yakozwe neza.

III-V Ibikoresho Byububiko bwa Laser Lift-Off ibikoresho

Korohereza itsinda rya GaAs, InP, na AlGaN murwego rwo guhuza optoelectronic.

Gitoya-Wafer IC hamwe na Sensor Ibihimbano

Ikora ibice byoroheje bikora kuri sensor sensor, umuvuduko wa moteri, cyangwa fotodiode, aho ubwinshi ari imikorere idahwitse.

Ibyuma bya elegitoroniki byoroshye kandi bisobanutse

Gutegura ultra-thin substrates ikwiranye no kwerekana byoroshye, imiyoboro yambarwa, hamwe na Windows yubwenge iboneye.

Muri buri gice, ibikoresho bya Semiconductor Laser Lift-Off Ibikoresho bigira uruhare runini mugushoboza miniaturizasiya, gukoresha ibikoresho, no koroshya inzira.

Ibibazo bikunze kubazwa (FAQ) bya Laser Lift-Off ibikoresho

Q1: Nubunini buke nshobora kugeraho nkoresheje ibikoresho bya Semiconductor Laser Lift-Off ibikoresho?
A1:Mubisanzwe hagati ya microne 10-30 bitewe nibikoresho. Inzira ishoboye ibisubizo byoroshye hamwe nuburyo bwahinduwe.

Q2: Ibi birashobora gukoreshwa mugukata waferi nyinshi kuva ingot imwe?
A2:Yego. Abakiriya benshi bakoresha tekinike yo kuzamura laser kugirango bakore urukurikirane rwibintu byinshi bito biva muri ingot imwe.

Q3: Ni ibihe bintu biranga umutekano bikubiye mubikorwa bya lazeri nyinshi?
A3:Icyiciro cya 1 cyo gufunga, sisitemu yo guhuza, gukingira ibiti, no gufunga byikora byose nibisanzwe.

Q4: Nigute iyi sisitemu igereranya ninsinga ya diyama ukurikije igiciro?
A4:Mugihe capex yambere ishobora kuba hejuru, kuzamura laser bigabanya cyane ibiciro bikoreshwa, ibyangiritse byangiritse, hamwe nintambwe yatunganijwe - kugabanya igiciro cyose cya nyirubwite (TCO) igihe kirekire.

Q5: Ese inzira irashobora gupimwa kugeza kuri santimetero 6 cyangwa 8?
A5:Rwose. Ihuriro rishyigikira insimburangingo zigera kuri 12-hamwe nogukwirakwiza ibiti hamwe nuburyo bunini bwo kugenda.

Ibyerekeye Twebwe

XKH kabuhariwe mu iterambere ry’ikoranabuhanga rikomeye, gukora, no kugurisha ibirahuri bidasanzwe bya optique hamwe nibikoresho bishya bya kristu. Ibicuruzwa byacu bitanga ibikoresho bya elegitoroniki, ibikoresho bya elegitoroniki, n'abasirikare. Dutanga ibice bya optique ya optique, igifuniko cya terefone igendanwa, Ceramics, LT, Silicon Carbide SIC, Quartz, hamwe na semiconductor kristal wafers. Hamwe n'ubuhanga buhanga hamwe nibikoresho bigezweho, turi indashyikirwa mugutunganya ibicuruzwa bitari bisanzwe, tugamije kuba ibikoresho bya optoelectronic ibikoresho byubuhanga buhanitse.