SiC substrate ifite ubugari bwa santimetero 3 na 350 umubyimba wa HPSI ubwoko bwa Prime Grade Dummy Grade
Imitungo
| Igipimo | Icyiciro cy'umusaruro | Icyiciro cy'ubushakashatsi | Impamyabumenyi y'ikinyoma | Ishami |
| Icyiciro | Icyiciro cy'umusaruro | Icyiciro cy'ubushakashatsi | Impamyabumenyi y'ikinyoma | |
| Ingano | 76.2 ± 0.5 | 76.2 ± 0.5 | 76.2 ± 0.5 | mm |
| Ubunini | 500 ± 25 | 500 ± 25 | 500 ± 25 | µm |
| Icyerekezo cya Wafer | Kuri axis: <0001> ± 0.5° | Kuri axis: <0001> ± 2.0° | Kuri axis: <0001> ± 2.0° | impamyabumenyi |
| Ubucucike bw'imiyoboro mito (MPD) | ≤ 1 | ≤ 5 | ≤ 10 | cm−2^-2−2 |
| Ubushobozi bwo guhangana n'amashanyarazi | ≥ 1E10 | ≥ 1E5 | ≥ 1E5 | Ω·cm |
| Dopant | Byakuweho | Byakuweho | Byakuweho | |
| Icyerekezo cy'ibanze cy'ubugari | {1-100} ± 5.0° | {1-100} ± 5.0° | {1-100} ± 5.0° | impamyabumenyi |
| Uburebure bw'ibanze bw'ikiraro | 32.5 ± 3.0 | 32.5 ± 3.0 | 32.5 ± 3.0 | mm |
| Uburebure bwa kabiri bw'ikiraro | 18.0 ± 2.0 | 18.0 ± 2.0 | 18.0 ± 2.0 | mm |
| Icyerekezo cya kabiri cy'icyitegererezo | Ubushyuhe bwa 90° CW uvuye mu nzu y'ibanze ± 5.0° | Ubushyuhe bwa 90° CW uvuye mu nzu y'ibanze ± 5.0° | Ubushyuhe bwa 90° CW uvuye mu nzu y'ibanze ± 5.0° | impamyabumenyi |
| Kutagaragaza Edge | 3 | 3 | 3 | mm |
| LTV/TTV/Umuheto/Umupfundo | 3 / 10 / ± 30 / 40 | 3 / 10 / ± 30 / 40 | 5 / 15 / ± 40 / 45 | µm |
| Ubukana bw'ubuso | Isura: CMP, Isura: Irasekuye | Isura: CMP, Isura: Irasekuye | Isura: CMP, Isura: Irasekuye | |
| Uduce (Urumuri rwinshi) | Nta na kimwe | Nta na kimwe | Nta na kimwe | |
| Amasahani ya Hex (Urumuri rwinshi) | Nta na kimwe | Nta na kimwe | Agace k'ikusanyirizo 10% | % |
| Uduce twa Polytype (Urumuri rwinshi) | Agace k'ikusanyirizo 5% | Agace k'ikusanyirizo 20% | Akarere karundanyijemo 30% | % |
| Imikufi (Urumuri rwinshi) | ≤ imikufi 5, uburebure buhuriweho ≤ 150 | ≤ imikufi 10, uburebure buhuriweho ≤ 200 | ≤ imikufi 10, uburebure buhuriweho ≤ 200 | mm |
| Gukata inkombe | Nta na kimwe ≥ 0.5 mm ubugari/ubujyakuzimu | 2 byemewe ≤ 1 mm ubugari/ubujyakuzimu | 5 byemewe ≤ 5 mm ubugari/ubujyakuzimu | mm |
| Kwanduza ubuso | Nta na kimwe | Nta na kimwe | Nta na kimwe |
Porogaramu
1. Ibyuma by'ikoranabuhanga bikoresha imbaraga nyinshi
Uburyo buhanitse bwo gutwara ubushyuhe n'icyuho kinini cya wafer za SiC bituma ziba nziza ku bikoresho bifite imbaraga nyinshi kandi bikoresha frequency nyinshi:
●MOSFET na IGBT zo guhindura ingufu.
●Sisitemu zigezweho z'amashanyarazi zikoresha amashanyarazi, harimo inverters na chargers.
● Ibikorwa remezo by'ikoranabuhanga hamwe na sisitemu y'ingufu zishobora kongera gukoreshwa.
2. Sisitemu za RF na Microwave
Substrates za SiC zituma habaho RF na mikoroonde bifite frequency yo hejuru kandi nta gihombo kinini cy'amajwi:
●Sisitemu z'itumanaho na satelite.
●Sisitemu za radar zo mu kirere.
●Ibice bigezweho bya interineti ya 5G.
3. Ibyuma by'ikoranabuhanga n'ibipima
Imiterere yihariye ya SiC ishyigikira porogaramu zitandukanye za optoelectronic:
●Imashini zipima imirasire y'izuba (UV detectors) zikoreshwa mu kugenzura ibidukikije no mu gupima inganda.
●Ibyuma bya LED na laser byo gukoresha mu gucana amatara no mu bikoresho by'ubuhanga.
●Ibikoresho bipima ubushyuhe bwinshi ku nganda zikora mu kirere no mu modoka.
4. Ubushakashatsi n'Iterambere
Ubudasa bw'amanota (Umusaruro, Ubushakashatsi, Ubukorikori) butuma habaho igerageza rigezweho no gushushanya ibikoresho mu mashuri makuru no mu nganda.
Ibyiza
●Kwizerwa:Ubushobozi bwiza bwo guhangana n'ingufu no kudahungabana mu byiciro byose.
●Guhindura ibintu:Ibyerekezo n'ubugari byagenwe kugira ngo bihuze n'ibyo umuntu akeneye bitandukanye.
●Ubuziranenge Buhanitse:Imiterere idafunguye ituma habaho itandukaniro rito riterwa n'umwanda.
●Ubushobozi bwo kwagura:Yujuje ibisabwa haba mu gukora ibintu byinshi ndetse no mu bushakashatsi ku igerageza.
Wafer za SiC zifite santimetero 3 ni inzira yawe yo kugera ku bikoresho bifite imikorere myiza n'iterambere rigezweho mu ikoranabuhanga. Ku bibazo n'ibisobanuro birambuye, twandikire uyu munsi.
Incamake
Wafers za santimetero 3 zikozwe muri High Purity Silicon Carbide (SiC) Wafers, ziboneka mu bushakashatsi, ubushakashatsi, na Dummy Grades, ni substrates nziza zagenewe ibikoresho by'ikoranabuhanga bikoresha ingufu nyinshi, sisitemu za RF/microwave, optoelectronics, na R&D igezweho. Izi wafers zifite ubushobozi bwo gufunga buhoro buhoro, zifite ubushobozi bwo kwirinda guhindagurika neza (≥1E10 Ω·cm ku gipimo cyo gukora), ubucucike buke bwa micropipe (≤1 cm−2^-2−2), kandi zifite ubwiza budasanzwe bwo hejuru. Zinogejwe gukoreshwa mu buryo bwo hejuru, harimo guhindura ingufu, itumanaho, kubona UV, na ikoranabuhanga rya LED. Hamwe n'uburyo bwo guhindura imiterere, ubushobozi bwo gutwara ubushyuhe buhanitse, n'ubushobozi bukomeye bwa mekanike, izi wafers za SiC zituma ibikoresho bikorwa neza kandi byizewe kandi bigahanga udushya mu nganda.
Ishusho irambuye







