Wafer ya Silicone ikoze mu byuma ya Ti/Cu (Titanium/Copper)

Ibisobanuro bigufi:

IbyacuUdupira twa silikoni dukozwe mu cyuma twa Ti/Cuifite silicon nziza cyane (cyangwa ikirahure/quartz) gitwikiriwe naurwego rwo gufatana kwa titaniyumunaurwego rw'umuringa ruyoboragukoreshagusohora magnetron bisanzwe.Urukuta rwa Ti rutuma ibintu bikomera cyane kandi rugahorana ubukana, mu gihe urwego rwo hejuru rwa Cu rutanga ubuso buto kandi bungana neza, bukwiriye gukoreshwa mu gukurura amashanyarazi no mu gukora udukoresho duto two hasi.


Ibiranga

Incamake

IbyacuUdupira twa silikoni dukozwe mu cyuma twa Ti/Cuifite silicon nziza cyane (cyangwa ikirahure/quartz) gitwikiriwe naurwego rwo gufatana kwa titaniyumunaurwego rw'umuringa ruyoboragukoreshagusohora magnetron bisanzwe.Urukuta rwa Ti rutuma ibintu bikomera cyane kandi rugahorana ubukana, mu gihe urwego rwo hejuru rwa Cu rutanga ubuso buto kandi bungana neza, bukwiriye gukoreshwa mu gukurura amashanyarazi no mu gukora udukoresho duto two hasi.

Izi wafers zagenewe ubushakashatsi ndetse n’ikoreshwa mu buryo bw’igerageza, ziboneka mu bunini butandukanye no mu buryo butandukanye bwo guhangana n’ingufu, hamwe n’uburyo bworoshye bwo guhindura ubunini, ubwoko bwa substrate, n’imiterere y’ipfundikizo.

Ibiranga by'ingenzi

  • Gufatana neza no kwizerwa: Uduce twa Ti bonding twongerera filime gufata Si/SiO₂ no kunoza ubushobozi bwo kuyifata neza.

  • Ubuso butwara amashanyarazi menshi: Gutwikira Cu bitanga imikorere myiza y'amashanyarazi ku bikoresho byo mu bwoko bwa contacts n'ibikoresho byo gupima

  • Urutonde rugari rw'uburyo bwo guhindura ibintu: Ingano ya wafer, ubushobozi bwo guhangana n'ingufu, icyerekezo, ubugari bwa substrate, n'ubugari bwa firime biraboneka iyo ubisabye

  • Ibikoresho byiteguye gutegurwa: ijyanye n'imikorere isanzwe ya laboratwari n'iy'ibikoresho (lithography, electroplating build-up, metrology, nibindi)

  • Urutonde rw'ibikoresho birahariUretse Ti/Cu, tunatanga na wafers za Au, Pt, Al, Ni, Ag zitwikiriwe n'icyuma.

Imiterere n'Ishyirwa mu Bikorwa Bisanzwe

  • Agace: Substrate + Ti adhesion + Cu coat urwego

  • Uburyo busanzwe: Gutera kwa Magnetron

  • Uburyo bwo gukora ibintu bitari ngombwa: Gushyuha cyane / Gukoresha Electroplating (ku bijyanye n'ibikenewe mu gupima ubushyuhe bwinshi)

Imiterere ya tekiniki y'ikirahure cya Quartz

Ikintu Amahitamo
Ingano y'umugati 2", 4", 6", 8"; 10 × 10 mm; ingano zihariye zo gukata
Ubwoko bw'ubushobozi bwo gutwara ibintu Ubwoko bwa P / Ubwoko bwa N / Ubushobozi bwo kurwanya indwara (Un)
Icyerekezo <100>, <111>, n'ibindi.
Ubushobozi bwo kwirinda <0.0015 Ω · cm; 1-10 Ω · cm; > 1000–10000 Ω · cm
Ubunini (µm) 2": 200/280/400/500; 4": 450/500/525; 6": 625/650/675; 8": 650/700/725/775; umwihariko
Ibikoresho byo munsi y'ubutaka Silikoni; quartz y'umwimerere, ikirahure cya BF33, nibindi.
Ubunini bwa filime 10 nm / 50 nm / 100 nm / 150 nm / 300 nm / 500 nm / 1 µm (ishobora guhindurwa)
Amahitamo ya filime y'icyuma Ti / Cu; nanone Au, Pt, Al, Ni, Ag irahari

 

Wafer ya Silicone ikoze mu byuma ya Ti/Cu (Titanium/Copper)4

Porogaramu

  • Ibyuma bifasha mu gukorana na Ohmic & contact substratesku bushakashatsi n'iterambere ry'ibikoresho ndetse no gupima amashanyarazi

  • Imbuto zo guteramo amashanyarazi(RDL, imiterere ya MEMS, ubwiyongere bunini bwa Cu)

  • Sol-gel na nanomaterial ikuraku bushakashatsi bwa nano na thin-film

  • Mikorokopi n'ibipimo by'ubuso(Icyitegererezo cya SEM/AFM/SPM cyo gutegura no gupima)

  • Ubuso bw'ibinyabuzima/ibinyabutabirenk'ibyiciro by'uturemangingo, poroteyine/DNA microarrays, na reflecometry substrates

Ibibazo (Ti / Cu Ibyuma Bitwikiriwe na Silicon Wafers)

Q1: Kuki urwego rwa Ti rukoreshwa munsi y'igitambaro cya Cu?
A: Titanium ikora nk'igikoreshourwego rwo gufatana (gufatanya), kunoza uburyo umuringa ufatana n'icyuma gifata ibintu kandi bikongera ubushobozi bwo kugumana ibintu neza, ibyo bigafasha kugabanya gushishwa cyangwa gutandukana mu gihe cyo gufata no gutunganya ibintu.

Q2: Ni iyihe miterere isanzwe y'ubugari bwa Ti/Cu?
A: Ihuriro rusange ririmoTi: mirongo ya nm (urugero, 10–50 nm)naCu: 50–300 nmku mafirime afite imitobe. Uduce twinshi twa Cu (µm-level) akenshi tugerwaho nagushushanya ku ruhu rw'imbuto za Cu zangiritse, bitewe n'ubusabe bwawe.

Q3: Ese ushobora gusiga impande zombi z'umugati?
A: Yego.Igitambaro cy'uruhande rumwe cyangwa ibiriiraboneka iyo ubisabye. Nyamuneka garagaza icyo usabwa mu gihe utumiza.

Ku bijyanye natwe

XKH yihariye mu iterambere, gukora, no kugurisha ikirahure cyihariye cya optique n'ibikoresho bishya bya kristu. Ibicuruzwa byacu bitanga ibikoresho by'ikoranabuhanga bya optique, ibikoresho by'ikoranabuhanga bikoreshwa n'abantu, n'ibya gisirikare. Dutanga ibikoresho bya optique bya Safira, ibifuniko bya lens za telefoni zigendanwa, Ceramics, LT, Silicon Carbide SIC, Quartz, na semiconductor crystal wafers. Dufite ubuhanga n'ibikoresho bigezweho, turakora neza mu gutunganya ibicuruzwa bitari iby'ubuziranenge, tugamije kuba ikigo gikomeye mu ikoranabuhanga rigezweho mu bikoresho bya optoelectronic.

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