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Sisitemu yo Kwerekeza ku Mafunguro ya Wafer yo Gupima Imiterere ya Crystal

Sisitemu yo Kwerekeza ku Mafunguro y'Indabyo mu Gupima Ishusho ya Kristalo
  • Sisitemu yo Kwerekeza ku Mafunguro ya Wafer yo Gupima Imiterere ya Crystal
  • Sisitemu yo Kwerekeza ku Mafunguro ya Wafer yo Gupima Imiterere ya Crystal
  • Sisitemu yo Kwerekeza ku Mafunguro ya Wafer yo Gupima Imiterere ya Crystal
  • Sisitemu yo Kwerekeza ku Mafunguro ya Wafer yo Gupima Imiterere ya Crystal

Ibisobanuro bigufi:

Igikoresho cyo kugenzura wafer ni igikoresho gikoresha neza cyane gikoresha amahame ya X-ray diffraction kugira ngo cyoroshye uburyo bwo gukora semiconductor na siyansi y'ibikoresho binyuze mu kugena icyerekezo cya crystallographic. Ibice byacyo by'ingenzi birimo isoko ya X-ray (urugero, Cu-Kα, 0.154 nm wavelength), goniometer ikora neza (igipimo cy'inguni ≤0.001°), n'ibikoresho bipima (CCD cyangwa scintillation counters). Mu kuzunguruka ingero no gusesengura imiterere ya diffraction, kibara indices za crystallographic (urugero, 100, 111) n'intera ya lattice hamwe n'ubuziranenge bwa arcsegonda ± 30. Sisitemu ishyigikira imikorere yikora, gushyiraho vacuum, no kuzunguruka kwa multi-axis, bihuye na wafer za santimetero 2-8 kugira ngo hapimwe vuba impande za wafer, reference planes, na epitaxial layer alignment. Ikoreshwa ry'ingenzi rikubiyemo cutting-oriented silicon carbide, safiro wafers, na turbine blade high-temperature validation, yongera mu buryo butaziguye imiterere y'amashanyarazi ya chips n'umusaruro.


Ibiranga

Intangiriro y'Ibikoresho

Ibikoresho byo kwerekezaho Wafer ni ibikoresho bigezweho bishingiye ku mahame ya X-ray diffraction (XRD), bikoreshwa cyane cyane mu nganda zikora ibikoresho bya semiconductor, ibikoresho by'urumuri, ibya keramike, n'izindi nganda zikora ibikoresho bya crystalline.

Ibi bikoresho bigena icyerekezo cya kristalo kandi bikayobora inzira nyayo yo gukata cyangwa gusiga irangi. Ibiranga by'ingenzi birimo:

  • Ibipimo by'ubuhanga buhanitse:Ishobora gukemura imiterere ya kristalografiya ifite ubushobozi bwo gupima inguni kugeza kuri 0.001°.
  • Ingero nini zihuye:Ishyigikira utubuto tw’umurambararo tugera kuri mm 450 n’uburemere bwa kg 30, ikwiriye ibikoresho nka silicon carbide (SiC), safiro, na silicon (Si).
  • Igishushanyo mbonera cy'uburyo:Imikorere ishobora kwaguka irimo gusesengura imiyoboro ihindagurika, gukora isuzuma ry’ibisesenguzi bya 3D, no gushyira ibikoresho byo gukusanya ibikoresho kugira ngo bitunganywe mu buryo bwinshi.

Ibipimo by'ingenzi bya tekiniki​

Icyiciro cy'ibipimo

Agaciro/Imiterere Isanzwe

Isoko ya X-ray​

Cu-Kα (ahantu ho kwibandaho 0.4 × 1 mm), voltage yihuta ya 30 kV, 0–5 mA umuyoboro w'amashanyarazi ushobora guhinduka

Uruhererekane rw'inguni

θ: -10° kugeza +50°; 2θ: -10° kugeza +100°

Uburinganire

Ubushobozi bwo kuzunguruka: 0.001°, kumenya inenge y'ubuso: ± amasegonda 30 (umugozi wo gutigita)

Umuvuduko wo gushakisha

Isuzuma rya Omega rirangiza icyerekezo cyuzuye cya lattice mu masegonda 5; Isuzuma rya Theta rifata ~ umunota 1

Icyiciro cy'icyitegererezo

V-groove, pneumatic suction, multi-angle rotation, ijyanye na wafers za santimetero 2–8

Imikorere yo Kwaguka​

Isesengura ry'imirongo ikikije uruziga, ikarita ya 3D, igikoresho cyo gukusanya, kumenya inenge y'urumuri (imishinyaguro, GBs)

Ihame ry'imikorere

1. Ishingiro rya X-ray Diffraction​

  • Imirasire ya X ikorana na nuclei atome na electrons muri lattice ya kristu, bigatuma habaho imiterere ya diffraction. Itegeko rya Bragg (nλ = 2d sinθ​​) rigenga isano iri hagati y’inguni za diffraction (θ) n’intera ya lattice (d).
    Ibikoresho bipima ibi bintu, bigasesengurwa kugira ngo byubake imiterere ya kristalografiya.

2. Ikoranabuhanga rya Omega Scanning​​

  • Ikirisitu izenguruka buri gihe ku murongo uhamye mu gihe imirasire ya X-rays iwumurikira.
  • Udukoresho dupima imiterere y'urumuri dukusanya ibimenyetso byo gukwirakwiza imiterere y'urumuri mu buryo butandukanye bwa kristalografiya, bigatuma hamenyekana icyerekezo cyuzuye cy'urumuri mu masegonda 5.

3. Isesengura ry'Umurongo Utembera

  • Inguni ya kristu ifite inguni zitandukanye za X-ray kugira ngo ipime ubugari bw'umurambararo (FWHM), isuzuma inenge za lattice n'uburemere.

4. Igenzura ryikora

  • Imiyoboro ya PLC na ecran yo mu bwoko bwa "touchscreen" ifasha gukata inguni zateguwe mbere, gutanga ibitekerezo mu gihe nyacyo, no guhuza imashini zo gukata kugira ngo zigenzure neza.

Igikoresho cyo Kwerekana Wafer 7

Ibyiza n'Ibiranga​

1. Ubuhanga n'imikorere myiza​

  • Uburinganire bw'inguni ± 0.001°, ubushobozi bwo kubona inenge
  • Umuvuduko wa Omega scan ni 200× wihuta kurusha Theta scan isanzwe.

2. Ubwiyongere n'ubushobozi bwo kwaguka​

  • Ishobora kwaguka mu bikorwa byihariye (urugero, SiC wafers, turbine blades).
  • Ihuzwa na sisitemu za MES kugira ngo ikurikirane umusaruro mu buryo bwihuse.

3. Guhuza ibintu neza no guhagarara neza

  • Ikira ingero zidafite imiterere idasanzwe (urugero: utubuto twa safiro twacitse).
  • Igishushanyo mbonera gikonjeshwa n'umwuka kigabanya ibyo umuntu akeneye mu kubungabunga.

4. Umurimo w'ubwenge

  • Gusuzuma inshuro imwe no gutunganya imirimo myinshi.
  • Gupima byikora hamwe na kristu zigaragaza uko ibintu bimeze kugira ngo bigabanye amakosa y'abantu.

Igikoresho cyo Kwerekana Wafer 5-5

Porogaramu

1. Gukora ibikoresho bya semiconductor​

  • Icyerekezo cyo gukata wafer: Igena icyerekezo cya wafer ya Si, SiC, GaN kugira ngo ikore neza mu gukata.
  • Ikarita y'ubusembwa: Igaragaza iminkanyari cyangwa ihindagurika ry'ubuso kugira ngo yongere umusaruro w'udupira.

2. Ibikoresho by'urumuri

  • Amakristu atari ay'umurongo (urugero, LBO, BBO) ku bikoresho bya laser.
  • Ikimenyetso cyerekana ubuso bwa sapphire wafer ku bikoresho bya LED.

3. Ibumba n'ibikomoka ku bimera​

  • Isesengura icyerekezo cy'ibinyampeke muri Si3N4 na ZrO2 kugira ngo ikoreshwe mu bushyuhe bwinshi.

4. Ubushakashatsi n'Igenzura ry'Ubuziranenge

  • Kaminuza/Laboratwari zo guteza imbere ibikoresho bishya (urugero, alloys nyinshi).
  • QC y'inganda kugira ngo habeho uburinganire mu itsinda.

Serivisi za XKH

XKH itanga ubufasha busesuye mu bijyanye n'ikoranabuhanga ku bikoresho byo kugenzura wafer, harimo gushyiraho, gutunganya imiterere y'ibipimo, gusesengura imiyoboro yo gusimbuka, no gukora isuzuma ry'ubuso bw'ibitagenda neza mu buryo bwa 3D. Ibisubizo byihariye (urugero, ikoranabuhanga ryo gusimbuza ingot) bitangwa kugira ngo byongere imikorere myiza y'ibikoresho bya semiconductor na optique ku kigero kirenga 30%. Itsinda ryihariye rikora amahugurwa aho bakorera, mu gihe ubufasha burimo amasaha 24/7 mu masaha ya nyuma no gusimbuza ibice by'ibikoresho byihuse bitanga icyizere cy'uko ibikoresho bizakorwa neza.

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