4H/6H-P 6inch SiC wafer Zero MPD grade Production Grade Dummy Grade
4H/6H-P Ubwoko bwa SiC Composite Substrates Imbonerahamwe isanzwe y'ibipimo
6 Isntimetero 100 z'umurambararo wa Silicon Carbide (SiC) Substrate Ibisobanuro
| Icyiciro | Nta musaruro wa MPDIcyiciro (Z) Icyiciro) | Umusaruro UsanzweIcyiciro (P) Icyiciro) | Impamyabumenyi y'ikinyoma (D Icyiciro) | ||
| Ingano | 145.5 mm ~ 150.0 mm | ||||
| Ubunini | 350 μm ± 25 μm | ||||
| Icyerekezo cya Wafer | -OffUmurongo: 2.0°-4.0°ugana [1120] ± 0.5° kuri 4H/6H-P, Kuri umurongo:〈111〉± 0.5° kuri 3C-N | ||||
| Ubucucike bw'imiyoboro mito | 0 cm-2 | ||||
| Ubushobozi bwo kwirinda | ubwoko bwa p 4H/6H-P | ≤0.1 Ωꞏcm | ≤0.3 Ωꞏcm | ||
| ubwoko bwa n 3C-N | ≤0.8 mΩꞏcm | ≤1 m Ωꞏcm | |||
| Icyerekezo cy'ibanze cy'ubugari | 4H/6H-P | -{1010} ± 5.0° | |||
| 3C-N | -{110} ± 5.0° | ||||
| Uburebure bw'ibanze bw'ikiraro | mm 32.5 ± mm 2.0 | ||||
| Uburebure bwa kabiri bw'ikiraro | 18.0 mm ± 2.0 mm | ||||
| Icyerekezo cya kabiri cy'icyitegererezo | Silicon ireba hejuru: 90° CW. uvuye kuri Prime flat ± 5.0° | ||||
| Kutagaragaza Edge | mm 3 | mm 6 | |||
| LTV/TTV/Umuheto /Umupfundo | ≤2.5 μ m / ≤5 μ m / ≤15 μ m / ≤30 mm | ≤10 μ m / ≤15 μ m / ≤25 μ m / ≤40 mm | |||
| Ubukana | Igiporuniya Ra≤1 nm | ||||
| CMP Ra≤0.2 nm | Ra≤0.5 nm | ||||
| Imyanya y'inkombe iterwa n'urumuri rwinshi | Nta na kimwe | Uburebure buhuriweho ≤ mm 10, uburebure bumwe ≤ mm 2 | |||
| Amasahani ya Hex ashingiye ku rumuri rwinshi | Agace k'ikusanyirizo ≤0.05% | Agace k'ikusanyirizo ≤0.1% | |||
| Uduce twa Polytype dukoresheje urumuri rwinshi | Nta na kimwe | Agace k'ikusanyirizo ≤3% | |||
| Ibikubiye muri karuboni igaragara | Agace k'ikusanyirizo ≤0.05% | Agace k'ikusanyirizo ≤3% | |||
| Imiterere y'ubuso bwa Silicone iterwa n'urumuri rwinshi | Nta na kimwe | Uburebure buhuriweho ≤1 × umurambararo wa wafer | |||
| Umucyo w'ubushyuhe bwinshi n'ubukana | Nta na kimwe cyemewe gifite ubugari n'ubujyakuzimu bwa ≥0.2mm | 5 byemewe, ≤1 mm buri kimwe | |||
| Kwanduzwa n'ubuso bwa silicon bitewe n'ubukana bwinshi | Nta na kimwe | ||||
| Gupfunyika | Kaseti y'isukari nyinshi cyangwa isanduku imwe y'isukari | ||||
Inyandiko:
※ Imipaka y'ubusembwa ikoreshwa ku buso bwose bwa wafer uretse aho inkombe zishyiramo. # Imivuno igomba kugenzurwa ku buso bwa Si o
Wafer ya 4H/6H-P ifite santimetero 6 ya SiC ifite urwego rwa Zero MPD kandi ikoreshwa cyane mu buryo bwa elegitoroniki. Uburyo bwayo bwiza bwo gutwara ubushyuhe, ingufu nyinshi zo kwangirika, no guhangana n'ibidukikije bikomeye bituma iba nziza ku bikoresho by'ikoranabuhanga bikoresha ingufu, nka switch na inverters bifite ingufu nyinshi. Urwego rwa Zero MPD rutanga inenge nke, ingenzi ku bikoresho byizewe cyane. Wafer zikoreshwa mu gukora ibikoresho binini by'amashanyarazi na porogaramu za RF, aho imikorere n'ubuhanga ari ingenzi cyane. Wafer zikoreshwa mu buryo bwa Dummy, ku rundi ruhande, zikoreshwa mu gupima imikorere, gupima ibikoresho, no gukora ibishushanyo mbonera, bigatuma habaho kugenzura ubuziranenge mu bikorwa bya semiconductor.
Ibyiza by'ibice bya N-type SiC bivanze birimo
- Ubushobozi bwo gutwara ubushyuhe bwinshi: Wafer ya 4H/6H-P SiC ikuraho ubushyuhe neza, bigatuma ikoreshwa mu bushyuhe bwinshi n'imbaraga nyinshi.
- Umuvuduko mwinshi w'amashanyarazi: Ubushobozi bwayo bwo guhangana n'amashanyarazi menshi nta gutsindwa butuma iba nziza cyane mu bikoresho by'ikoranabuhanga bikoresha ingufu nyinshi no mu guhinduranya umuriro mwinshi.
- Ingano ya Zero MPD (Indwara y'imiyoboro mito): Ubucucike buke bw'inenge butuma habaho ubwizerwe n'imikorere myiza, bikaba ari ingenzi cyane ku bikoresho by'ikoranabuhanga bisaba imbaraga nyinshi.
- Ingano y'umusaruro mu nganda nyinshi: Bikwiriye gukorwa ku rwego runini ibikoresho bya semiconductor bikora neza kandi bifite ubuziranenge buhamye.
- Ingano y'isuku yo gupima no gupima: Ituma habaho kunoza imikorere, gupima ibikoresho, no gukora ibishushanyo mbonera bidakoresheje wafers zihendutse zo mu rwego rwo hejuru.
Muri rusange, wafer za 4H/6H-P za santimetero 6 za SiC zifite urwego rwa Zero MPD, urwego rw'umusaruro, n'urwego rw'udushushanyo mbonera bitanga inyungu zikomeye mu iterambere ry'ibikoresho by'ikoranabuhanga bikora neza. Izi wafer ni ingirakamaro cyane mu bikorwa bisaba imikorere y'ubushyuhe bwinshi, ubucucike bw'ingufu nyinshi, no guhindura ingufu neza. Urwego rwa Zero MPD rutanga inenge nke kugira ngo ibikoresho bikore neza kandi bihamye, mu gihe wafer zo mu rwego rw'umusaruro zishyigikira inganda nini zifite igenzura rikomeye ry'ubuziranenge. Wafer zo mu rwego rw'udushushanyo mbonera zitanga igisubizo gihendutse cyo kunoza imikorere no kugenzura ibikoresho, bigatuma ziba ngombwa mu gukora ibikoresho bya semiconductor neza cyane.
Ishusho irambuye
