Byuzuye Byikora Byuma Byuma-Gukata Ibikoresho Gukora Ingano 8inch / 12inch Gukata Impeta

Byuzuye Byikora Byuma Byuma-Gukata Ibikoresho Gukora Ingano 8inch / 12inch Impeta ya Wafer Gukata Ishusho Yerekanwe

Ibisobanuro bigufi:

X. Ibi bikoresho bikubiyemo udushya twinshi-axis ya tekinoroji yo kugenzura kandi ikanagaragaza sisitemu yo hejuru cyane (umuvuduko ntarengwa wo kuzunguruka: 60.000 RPM), itanga impande zuzuye zogosha hamwe no gukata neza kugeza kuri 5 mm. Sisitemu yerekana guhuza neza hamwe na semiconductor itandukanye, harimo ariko ntibigarukira kuri:
1.Ibikoresho bya Silicon (Si): Birakwiye gutunganyirizwa inkombe ya 8-12 cm ；
2.Ibice bya semiconductor: Igisekuru cya gatatu ibikoresho bya semiconductor nka GaAs na SiC ；
3.Ibisobanuro byihariye: Ibikoresho bya Piezoelectric wafer harimo LT / LN ；

Igishushanyo mbonera gishyigikira gusimbuza byihuse ibintu byinshi bikoreshwa harimo diyama ya diyama na laser yo guca imitwe, hamwe nubwuzuzanye burenze ibipimo byinganda. Kubisabwa byihariye, turatanga ibisubizo byuzuye bikubiyemo:
· Gutanga ibikoresho byabigenewe
Serivisi zitunganya ibicuruzwa
· Gutunganya ibipimo byiza byo gukemura

Ohereza imeri kuri twe

Ibiranga

Ibipimo bya tekiniki

Parameter	Igice	Ibisobanuro
Ingano yumurimo ntarengwa	mm	ø12 "
Spindle	Iboneza	Umuzingo umwe
	Umuvuduko	3.000-60.000 rpm
	Imbaraga zisohoka	1.8 kWt (2.4 bidashoboka) kuri 30.000 min⁻¹
	Max Blade Dia.	Ø58 mm
X-Axis	Gutema Urwego	310 mm
Y-Axis	Gutema Urwego	310 mm
	Kwiyongera kw'intambwe	0.0001 mm
	Umwanya Uhagaze	≤0.003 mm / 310 mm, ≤0.002 mm / 5 mm (ikosa rimwe)
Z-Axis	Icyemezo cyo Kwimuka	0.00005 mm
Z-Axis	Gusubiramo	0.001 mm
θ-Axis	Kuzenguruka cyane	380 deg
Ubwoko bwa Spindle		Umuzingi umwe, ufite icyuma gikomeye cyo gukata impeta
Gukata Impeta	μm	± 50
Umwanya wa Wafer	μm	± 50
Imikorere imwe-Wafer	min / wafer	8
Imikorere ya Multi-Wafer		Kugera kuri 4 wafer yatunganijwe icyarimwe
Uburemere bwibikoresho	kg	≈3,200
Ibipimo by'ibikoresho (W × D × H)	mm	2.730 × 1.550 × 2,070

Ihame ry'imikorere

Sisitemu igera kumikorere idasanzwe ikoresheje tekinoroji yibanze:

1.Uburyo bwo kugenzura ibyerekezo byubwenge:
· Ikinyabiziga gifite moteri ihanitse cyane (subiramo neza neza: ± 0.5μm)
· Igenzura rya-axis itandatu igenzura ishyigikira igenamigambi ryoroshye
· Igihe nyacyo cyo guhindagurika guhindagura algorithms zemeza kugabanya umutekano

Sisitemu yo Kumenyekanisha Yongerewe:
· Gukomatanya 3D laser uburebure bwa sensor (ubunyangamugayo: 0.1μm)
· Ikirangantego kinini CCD igaragara (5 megapixels)
· Module yo kugenzura ubuziranenge kumurongo

3.Ibikorwa byikora byuzuye:
· Gutwara / gupakurura byikora (Imigaragarire isanzwe ya FOUP)
Sisitemu yo gutondeka ubwenge
· Isuku ifunze-isuku (isuku: Icyiciro cya 10)

Ibisanzwe

Ibi bikoresho bitanga agaciro gakomeye murwego rwo gukora inganda zikoreshwa:

Umwanya wo gusaba	Ibikoresho	Ibyiza bya tekiniki
Gukora IC	8/12 "Wafers ya Silicon	Gutezimbere guhuza imyandikire
Ibikoresho by'ingufu	SiC / GaN Wafers	Irinde inenge
MEMS Sensors	SOI Wafers	Iremeza ibikoresho byizewe
Ibikoresho bya RF	GaAs Wafers	Itezimbere imikorere-yumurongo mwinshi
Gupakira neza	Wafers yongeye gushyirwaho	Yongera umusaruro wo gupakira

Ibiranga

1.Ibice bine bya sitasiyo yo gutunganya neza ；
2.Ihinduka rya TAIKO impeta yo gukuraho no gukuraho ；
3.Ubusumbane bukabije nibikoreshwa byingenzi ；
4.Multi-axis ikomatanya ikorana buhanga ituma impande zose zicibwa ；
5.Ibikorwa byikora byuzuye bigabanya cyane amafaranga yumurimo ；
6.Ibishushanyo mbonera byakoreshwaga bifasha gutunganya neza imiterere yihariye ；

Imikorere

1. Sisitemu yo gutahura impeta ；
2.Isuku ikoreshwa neza cleaning
3.Ubushishozi bwa UV bwo gutangiza ；
4.Ibikorwa byo gufata amajwi ；
5.Uruganda rwo gutangiza uruganda ；

Kwiyemeza serivisi

XKH itanga serivisi zuzuye zubuzima bwuzuye zagenewe kuzamura ibikoresho nibikorwa neza murugendo rwawe rwo gukora.
1. Serivise yihariye
· Ibikoresho byabugenewe byabugenewe: Itsinda ryacu ryubwubatsi rikorana cyane nabakiriya kugirango bahindure ibipimo bya sisitemu (kugabanya umuvuduko, guhitamo icyuma, nibindi) bishingiye kubintu byihariye (Si / SiC / GaAs) nibisabwa mubikorwa.
· Inkunga y'Iterambere ry'Iterambere: Dutanga icyitegererezo hamwe na raporo zisesenguye zirambuye zirimo gupima ubugari no gushushanya inenge.
· Ibikoresha hamwe-Gutezimbere: Kubikoresho bishya (urugero, Ga₂O₃), dufatanya nabayobozi bayobora ibicuruzwa bikoreshwa mugutezimbere porogaramu yihariye / laser optique.

2. Inkunga ya tekinike yabigize umwuga
· Inkunga yihariye kurubuga: Shinga injeniyeri zemewe kubice bikomeye byo kuzamuka (mubyumweru 2-4), bikubiyemo:
Ibikoresho byo guhinduranya & gutunganya neza-gutunganya neza
Amahugurwa yubushobozi bwa Operator
ISO Icyiciro cya 5 cyoguhuza ubuyobozi
· Gufata neza Ibiteganijwe: Buri gihembwe igenzura ryubuzima hamwe nisesengura ryinyeganyeza hamwe na servo isuzuma moteri kugirango wirinde igihe cyateganijwe.
· Gukurikirana kure: Gukora ibikoresho-nyabyo mugihe gikurikiranwa binyuze kuri platform ya IoT (JCFront Connect®) hamwe no kumenyesha ibintu bidasanzwe.

3. Serivisi zongerewe agaciro
· Gutunganya ubumenyi bushingiye: Kugera 300+ byemewe gukata ibikoresho bitandukanye (bigezweho buri gihembwe).
· Guhuza Ikoranabuhanga rya Roadmap Guhuza: Ibizaza-byerekana ishoramari ryawe hamwe n'inzira zo kuzamura software (urugero, module ishingiye kuri AI ishingiye ku nenge).
· Gutabara byihutirwa: Bijejwe kwisuzumisha amasaha 4 no kwisuzumisha amasaha 48 kurubuga (kwisi yose).

4. Ibikorwa Remezo bya serivisi
· Ingwate yimikorere: Kwiyemeza amasezerano kuri ≥98% ibikoresho byigihe hamwe nibisubizo bya SLA.

Gukomeza Gutezimbere

Dukora ubushakashatsi bwimyaka ibiri kubakiriya no gushyira mubikorwa gahunda ya Kaizen kugirango tunoze imitangire ya serivisi. Itsinda ryacu R&D risobanura ubushishozi murwego rwo kuzamura ibikoresho - 30% byiterambere rya software bikomoka kubitekerezo byabakiriya.