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Ibikoresho byo Gukata impeta bya Wafer byikora byikora Ingano yo Gukata impeta ya Wafer ya Wafer ya santimetero 8/santimetero 12

Ibikoresho byo Gukata impeta bya Wafer byikora byikora Ingano yo Gukata impeta ya Wafer ya Wafer ya santimetero 8/santimetero 12 Ishusho igaragara
  • Ibikoresho byo Gukata impeta bya Wafer byikora byikora Ingano yo Gukata impeta ya Wafer ya Wafer ya santimetero 8/santimetero 12
  • Ibikoresho byo Gukata impeta bya Wafer byikora byikora Ingano yo Gukata impeta ya Wafer ya Wafer ya santimetero 8/santimetero 12
  • Ibikoresho byo Gukata impeta bya Wafer byikora byikora Ingano yo Gukata impeta ya Wafer ya Wafer ya santimetero 8/santimetero 12

Ibisobanuro bigufi:

XKH yashyizeho uburyo bwo gukata insinga za wafer bukora mu buryo bwikora, bugaragaza igisubizo kigezweho cyagenewe gukora ibikoresho bya semiconductor imbere. Ibi bikoresho birimo ikoranabuhanga rigezweho ryo kugenzura ibintu bitandukanye kandi bifite sisitemu yo gukata ifite ubushobozi bwo hejuru (umuvuduko ntarengwa wo kuzenguruka: 60.000 RPM), itanga uburyo bwo gukata insinga neza hamwe n'uburyo bwo gukata bugera kuri ±5μm. Ubu buryo bugaragaza ko buhuye neza n'ibikoresho bitandukanye bya semiconductor, harimo ariko bitagarukira kuri:
1. Wafer za Silicone (Si): Zikwiriye gutunganywa mu buryo bwa wafer za santimetero 8-12;
2. Ibikoresho bya semiconductor bivanze: Ibikoresho bya semiconductor byo mu gisekuru cya gatatu nka GaAs na SiC；
3. Ibyuma byihariye: Ibyuma bya Piezoelectric birimo LT/LN；

Igishushanyo mbonera cya modular gifasha gusimbuza byihuse ibikoresho byinshi birimo ibyuma bya diyama n'imitwe yo gukata hakoreshejwe laser, hamwe n'ubushobozi bwo guhuza ibintu burenga amahame ngenderwaho y'inganda. Ku bijyanye n'ibisabwa byihariye mu mikorere, dutanga ibisubizo byuzuye birimo:
· Ibikoresho byihariye byo gukata
· Serivisi zo gutunganya ibintu ku giti cyazo
· Ibisubizo byo kunoza uburyo bwo gukora porogaramu


  • :

    • Ibiranga

    Ibipimo bya tekiniki

    Igipimo Ishami Ibisobanuro
    Ingano ntarengwa y'ibikoresho byo gukora mm ø12"
    Ipine    Imiterere Umugozi umwe
    Umuvuduko 3,000–60,000 rpm
    Ingufu zo gusohora 1.8 kW (2.4 nta yandi mananiza) ku munota wa 30.000 min⁻¹
    Max Blade Dia. Ø58 mm
    X-Axis Inzira yo Gukata mm 310
    Y-Axis   Inzira yo Gukata mm 310
    Intambwe yo kwiyongera mm 0.0001
    Uburyo bwo gushyiramo amakuru neza ≤0.003 mm/310 mm, ≤0.002 mm/5 mm (ikosa rimwe)
    Umurongo wa Z  Umwanzuro w'Ingendo 0.00005 mm
    Gusubiramo mm 0.001
    θ-Axis Izunguruka rinini dogere 380
    Ubwoko bw'urudodo   Ipine imwe, ifite icyuma gikomeye cyo gukata impeta
    Uburyo bwo Gukata Impeta μm ± 50
    Uburyo bwo gushyiramo wafer neza μm ± 50
    Uburyo bwo gukora neza mu ifuru imwe umunota/agafu 8
    Ikoreshwa ry'amafi menshi mu buryo bwiza   Uduce duto tw'isukari tugera kuri 4 dutunganyirizwa icyarimwe
    Uburemere bw'ibikoresho kg ≈3,200
    Ibipimo by'ibikoresho (Ubugari × Ubwinshi × Ubwinshi) mm 2,730 × 1,550 × 2,070

    Ihame ry'imikorere

    Sisitemu igera ku musaruro udasanzwe wo kugabanya ibintu binyuze muri izi koranabuhanga z'ingenzi:

    1. Sisitemu yo kugenzura ingendo y'ubwenge:
    · Moteri ifite umurongo ugororotse cyane (uburyo bwo kongera gushyiramo neza: ± 0.5μm)
    · Igenzura ry’imirongo itandatu rihuza igenamigambi rikomeye ry’inzira
    · Algorithm zo gukumira vibration mu gihe nyacyo zituma habaho guhagarara neza

    2. Sisitemu yo Gutahura Ibidukikije:
    · Ikoranabuhanga rya laser ya 3D (ubuziranenge: 0.1μm)
    · Ishusho ya CCD ifite ubushobozi bwo hejuru (megapixels 5)
    · Module yo kugenzura ubuziranenge kuri interineti

    3. Uburyo bwikora:
    · Gupakira/gupakurura byikora (bihuye n'uburyo busanzwe bwa FOUP)
    · Sisitemu yo gutondekanya y'ubwenge
    · Isuku ifunze neza (isuku: Icyiciro cya 10)

    Porogaramu zisanzwe

    Ibi bikoresho bitanga agaciro gakomeye mu bikorwa byo gukora ibikoresho bya semiconductor:

    Ahantu ho Gusaba Ibikoresho byo gutunganya Ibyiza bya tekiniki
    Inganda za IC Udupaki twa silikoni twa 8/12" Yongera uburyo lithography ikora
    Ibikoresho by'amashanyarazi SiC/GaN Wafers Birinda inenge zo mu nkengero
    Ibikoresho bya MEMS Wafers za SOI Bituma igikoresho gihamye
    Ibikoresho bya RF GaAs Wafers Iteza imbere imikorere ikunze gukoreshwa inshuro nyinshi
    Gupakira mu buryo bugezweho Amafunguro yahinduwe Yongera umusaruro w'ibipfunyika

    Ibiranga

    1. Imiterere ya sitasiyo enye kugira ngo ikore neza cyane;
    2. Gukuraho no gukuraho impeta ya TAIKO ihamye;
    3. Ikorana neza n'ibikoresho by'ingenzi ；
    4. Ikoranabuhanga ryo gukata impande mu buryo buhuriweho n'imirongo myinshi rituma hakorwa neza cyane;
    5. Imikorere y’akazi ikora ku buryo bwikora igabanya cyane ikiguzi cy’abakozi;
    6. Igishushanyo mbonera cy'ameza yo gukoreraho gifasha gutunganya neza inyubako zihariye;

    Imikorere

    1. Sisitemu yo gutahura impeta n'amadomo;
    2. Gusukura ameza yo gukoreraho byikora;
    3. Sisitemu yo gukuraho imiyoboro ya UV mu buryo bw'ubwenge ；
    4. Kwandika inyandiko y'imikorere;
    5. Guhuza module zikora mu buryo bwikora;

    Ubwitange bwa serivisi

    XKH itanga serivisi zuzuye kandi zuzuye zo gufasha ibikoresho zigamije kongera imikorere myiza y'ibikoresho no gukora neza mu rugendo rwawe rwo gukora.
    1. Serivisi zo guhindura ibintu
    · Imiterere y'ibikoresho byihariye: Itsinda ryacu ry'abahanga rikorana bya hafi n'abakiriya kugira ngo barusheho kunoza ibipimo bya sisitemu (umuvuduko wo kugabanya, guhitamo ibyuma, nibindi) hashingiwe ku miterere yihariye y'ibikoresho (Si/SiC/GaAs) n'ibisabwa mu mikorere.
    · Inkunga mu iterambere ry'ibikorwa: Dutanga ingero zo gutunganya hamwe na raporo zirambuye z'isesengura harimo gupima ubukana bw'inkombe no gupima inenge.
    · Guteza imbere hamwe ibikoresho bikoreshwa: Ku bikoresho bishya (urugero, Ga₂O₃), dufatanya n'inganda zikora ibikoresho bikoreshwa mu gukora ibikoresho byihariye/ibyuma bikoresha laser.

    2. Ubufasha mu bya tekiniki by'umwuga
    · Ubufasha bwihariye bwo gukorera aho hantu: Shyiraho injeniyeri zemewe mu byiciro by'ingenzi byo kongeramo (ubusanzwe ibyumweru 2-4), bikubiyemo:
    Gusuzuma no gutunganya neza ibikoresho
    Amahugurwa ku bushobozi bw'abakoresha
    Ubuyobozi bwo guhuza icyumba cyo kunyweramo isuku cya ISO Class 5
    · Gutegura igihe cy'impanuka: Isuzuma ry'ubuzima rya buri gihembwe hamwe n'isesengura ry'imitingito n'isuzuma ry'imikorere y'imodoka kugira ngo hirindwe igihe cyo kuruhuka kitateganijwe.
    · Gukurikirana kure: Gukurikirana imikorere y'ibikoresho mu buryo bwihuse binyuze kuri platform yacu ya IoT (JCFront Connect®) hamwe n'amatangazo yikora ku buryo butari bwo.

    3. Serivisi zo kongerera agaciro
    · Ishingiro ry'Ubumenyi bw'Ibikorwa: Reba uburyo bwo guteka burenze 300 bwemewe ku bikoresho bitandukanye (buvugururwa buri gihembwe).
    · Guhuza Ikoranabuhanga: Guteza imbere ishoramari ryawe mu gihe kizaza ukoresheje inzira zo kuvugurura ibikoresho/software (urugero, module yo kumenya inenge ishingiye ku buhanga bwa AI).
    · Gutabara mu gihe cy'impanuka: Gusuzuma indwara mu buryo bw'amasaha 4 no gutabara mu gihe cy'amasaha 48 (kwita ku rwego rw'isi).

    4. Ibikorwaremezo bya serivisi
    · Ingwate ku mikorere: Kwiyemeza ku masezerano ku gihe cyo gukora ibikoresho ≥98% hamwe n'igihe cyo gusubiza gishyigikiwe na SLA.

    Iterambere rihoraho

    Dukora ubushakashatsi ku kunyurwa kw'abakiriya kabiri mu mwaka kandi tugashyira mu bikorwa ingamba za Kaizen kugira ngo twongere gutanga serivisi. Itsinda ryacu ry’ubushakashatsi n’iterambere rihindura ibitekerezo ku kuvugurura ibikoresho - 30% by'ivugurura rya firmware rituruka ku bitekerezo by'abakiriya.

    Ibikoresho byo Gukata impeta bya Wafer byikora byikora 7
    Ibikoresho byo Gukata impeta bya Wafer byikora byikora 8
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