Imashini Yinshi ya Diamond Yabonye Imashini ya SiC Sapphire Ultra-Ikomeye Ibikoresho Byoroshye

Imashini Yinshi ya Diamond Yabonye Imashini ya SiC Sapphire Ultra-Ikomeye Ibikoresho Byoroheje Ishusho

Ibisobanuro bigufi:

Ibiranga

Intangiriro kuri Multi-Wire Diamond Imashini

Imashini ikora diyama nini cyane ni sisitemu igezweho yo gutema igenewe gutunganya ibikoresho bikomeye kandi byoroshye. Mugukoresha insinga nyinshi zisa na diyama zometseho, imashini irashobora icyarimwe gukata wafer nyinshi mukuzunguruka kamwe, ikagera kumurongo mwinshi kandi neza. Iri koranabuhanga ryabaye igikoresho cyingenzi mu nganda nka semiconductor, izuba ryifoto yizuba, LED, hamwe nubutaka bwateye imbere, cyane cyane kubikoresho nka SiC, safiro, GaN, quartz, na alumina.

Ugereranije no guca umugozi umwe usanzwe, iboneza-insinga nyinshi itanga ibice icumi kugeza kuri magana kuri buri cyiciro, bikagabanya cyane igihe cyizunguruka mugihe ugumye neza (Ra <0.5 μ m) hamwe nuburinganire (± 0.02 mm). Igishushanyo mbonera cyacyo gihuza insinga zikoresha ibyuma, sisitemu yo gukora ibihangano, hamwe no gukurikirana kumurongo, byemeza umusaruro muremure, uhamye, kandi wuzuye.

Ibikoresho bya tekinike ya Multi-Wire Diamond Imashini ibona

Ingingo	Ibisobanuro	Ingingo	Ibisobanuro
Ingano ntarengwa y'akazi (Square)	220 × 200 × 350 mm	Gutwara moteri	17.8 kWt × 2
Ingano ntarengwa y'akazi (Round)	Φ205 × 350 mm	Moteri ya moteri	11.86 kW × 2
Umwanya uzunguruka	Φ250 ± 10 × 370 × 2 axis (mm)	Moteri yo kuzamura moteri	2.42 kW × 1
Icyerekezo nyamukuru	650 mm	Moteri ya swing	0.8 kW × 1
Umuvuduko wo gukoresha insinga	1500 m / min	Gutunganya moteri	0.45 kW × 2
Diameter	Φ0.12–0.25 mm	Moteri yo guhagarika umutima	4.15 kW × 2
Kuzamura umuvuduko	225 mm / min	Moteri yihuta	7.5 kWt × 1
Icyiza. Kuzenguruka kumeza	± 12 °	Ubushobozi bwa tank	300 L.
Inguni	± 3 °	Amazi akonje	200 L / min
Inshuro	~ Inshuro 30 / min	Ubushuhe. Ukuri	± 2 ° C.
Igipimo cyo kugaburira	0.01–9.99 mm / min	Amashanyarazi	335 + 210 (mm²)
Igipimo cyo kugaburira insinga	0.01–300 mm / min	Umwuka ucanye	0.4–0.6 MPa
Ingano yimashini	3550 × 2200 × 3000 mm	Ibiro	13.500 kg

Imashini ikora ya Multi-Wire Diamond Imashini ibona

Icyerekezo Cyinshi cyo Gukata
Insinga nyinshi za diyama zigenda kumuvuduko ugera kuri 1500 m / min. Imiyoboro iyobora neza hamwe no gufunga-gufunga kugenzura (15-130 N) bituma insinga zihagarara, bikagabanya amahirwe yo gutandukana cyangwa kumeneka.
Kugaburira neza & Umwanya
Umwanya uyobowe na Servo ugera kuri ± 0.005 mm neza. Guhitamo laser cyangwa iyerekwa-ifashwa guhuza byongera ibisubizo kumiterere igoye.
Gukonjesha no gukuraho Debris
Umuvuduko ukabije wumuvuduko ukabije ukuraho chip kandi ugakonjesha aho ukorera, ukirinda kwangirika kwubushyuhe. Ibyiciro byinshi byo kuyungurura byongera ubuzima bukonje kandi bigabanya igihe.
Ihuriro ryubwenge
Abashoferi benshi basubiza cyane (<1 ms) bahinduranya ibiryo, impagarara, numuvuduko winsinga. Gucunga neza resept hamwe no gukanda kamwe kamwe guhinduranya ibintu byoroheje umusaruro.

Inyungu Zibanze Zimashini Zibona Diamond

Umusaruro mwinshi
Irashobora gukata wafer 50–200 kuri kwiruka, hamwe no gutakaza kerf <100 μ m, kuzamura imikoreshereze yibikoresho kugeza 40%. Ibicuruzwa ni 5-10 × bya sisitemu gakondo imwe.
Kugenzura neza
Umuyoboro mwinshi muri ± 0.5 N utanga ibisubizo bihoraho kubikoresho bitandukanye. Igenzura-nyaryo kuri 10 "Imigaragarire ya HMI ishyigikira kubika resept no gukora kure.
Byoroshye, byubaka
Bihujwe na diameter ya wire kuva 0,12–0.45 mm kuburyo butandukanye bwo guca. Gukoresha robotic kubushake bituma imirongo ikora neza.
Inganda-Yizewe
Ibikoresho biremereye cyane / amakadiri yahimbwe agabanya guhindura ibintu (<0.01 mm). Kuyobora pulleys hamwe na ceramic cyangwa karbide itanga amasaha arenga 8000 yubuzima bwa serivisi.

Sisitemu ya Multi-Wire Diamond Sawing ya SiC Sapphire Ultra-Ikomeye Ibikoresho Byoroheje 2

Imirima yo gusaba ya Multi-Wire Diamond Imashini ibona

Amashanyarazi: Gukata SiC kuri moderi ya power power, GaN substrates kubikoresho bya 5G.
Amashusho: Umuvuduko mwinshi wa silicon wafer ukata ± 10 μm uburinganire.
LED & Optics.
Ceramics: Gutunganya alumina, AlN, nibikoresho bisa nibirere hamwe nibice byo gucunga ubushyuhe.

Sisitemu Yinshi ya Diamond Sawing ya SiC Sapphire Ultra-Ikomeye Ibikoresho Byoroshye 3

Sisitemu ya Multi-Wire Diamond Sisitemu ya SiC Sapphire Ultra-Ikomeye Ibikoresho Byoroheje 5

Sisitemu ya Multi-Wire Diamond Sawing ya SiC Sapphire Ultra-Ikomeye Ibikoresho Byoroheje 6

Ibibazo - Imashini yo kubona Diamond-Multi-Wire

Q1: Ni izihe nyungu zo kubona insinga nyinshi ugereranije nimashini imwe?
Igisubizo: Sisitemu nyinshi zirashobora gukata icyarimwe kugeza kuri magana icyarimwe icyarimwe, bikazamura imikorere kuri 5-10 ×. Gukoresha ibikoresho nabyo biri hejuru hamwe no gutakaza kerf munsi ya 100 mm, bigatuma biba byiza kubyara umusaruro.

Q2: Ni ubuhe bwoko bw'ibikoresho bushobora gutunganywa?
Igisubizo: Imashini yagenewe ibikoresho bikomeye kandi byoroshye, harimo karubide ya silicon (SiC), safiro, nitride ya gallium (GaN), quartz, alumina (Al₂O₃), na nitride ya aluminium (AlN).

Q3: Ni ubuhe buryo bugerwaho kandi bufite ireme?
Igisubizo: Ubusumbane bwubuso bushobora kugera kuri Ra <0.5 μ m, hamwe nuburinganire bwa ± 0.02 mm. Gukata ku mpande birashobora kugenzurwa kuri <20 μ m, byujuje igice cya semiconductor hamwe na optoelectronic inganda.

Q4: Igikorwa cyo gutema gitera gucika cyangwa kwangiza?
Igisubizo: Hamwe nogukonjesha umuvuduko ukabije hamwe no gufunga-guhagarika impagarara, ibyago byo guturika mikorobe no kwangirika kwaragabanutse, bigatuma ubunyangamugayo bwiza bwa wafer.

Mbere: SICOI (Carbide ya Silicon kuri Insulator) Wafers SiC Filime KURI Silicon

Ibikurikira: Imashini Zibiri Zisya Imashini ya SiC Sapphire Si wafer