Ibikoresho byo gukura bya safiro Ingot Czochralski CZ Uburyo bwo kubyara 2inch-12inch Wafers
Ihame ry'akazi
Uburyo bwa CZ bukora binyuze mu ntambwe zikurikira:
1.
2.
3. Gukora ibitugu no gukura kwinshi: Umuvuduko wo gukurura wagabanutse kugera kuri 0.2-1 mm / h, buhoro buhoro wagura diameter ya kirisiti kugeza kuntego (urugero, santimetero 4-12).
4. Gufata no gukonjesha: Kirisiti ikonjeshwa kuri 0.1-0.5 ° C / min kugirango igabanye ubushyuhe buterwa nubushyuhe.
5. Ubwoko bwa Crystal Ihuza:
Icyiciro cya elegitoroniki: Semiconductor substrates (TTV <5 μm)
Icyiciro cyiza: Windows ya laser ya Windows (transmitance> 90% @ 200 nm)
Doped variants: Ruby (Cr³⁺ concentration 0.01–0.5 wt.%), Ubururu bwa safiro
Ibice bigize sisitemu
Sisitemu yo gushonga
Iridium Crucible: Irwanya 2300 ° C, irwanya ruswa, ihujwe no gushonga (kg 100-400).
Itanura rishyushya Induction: Multi-zone yigenga yubushyuhe bwigenga (± 0.5 ° C), amashanyarazi meza.
2. Gukurura no Kuzunguruka Sisitemu
Motor-Precision Servo Moteri: Gukurura ibyemezo 0.01 mm / h, kwibanda kumurongo <0.01 mm.
Ikimenyetso cya Magnetic Fluid Ikimenyetso: Kudakwirakwiza kwanduza bikomeje (> amasaha 72).
3. Sisitemu yo kugenzura ubushyuhe
PID Ifunze-Ifunguye Igenzura: Igihe nyacyo cyo guhindura imbaraga (50-200 kW) kugirango uhagarike umurima wubushyuhe.
Kurinda gazi ya Inert: Ar / N₂ ivanze (99,999% byera) kugirango wirinde okiside.
4. Gukoresha no gukurikirana
Kugenzura Diameter ya CCD: Ibitekerezo nyabyo (byukuri ± 0.01 mm).
Ubushuhe bwa Thermography: Ikurikirana ibintu bikomeye-byimbere ya morphologie.
Kugereranya CZ na KY Uburyo bwo kugereranya
Parameter | Uburyo bwa CZ | Uburyo bwa KY |
Icyiza. Ingano ya Crystal | Santimetero 12 (300 mm) | Mm 400 (ingot imeze nk'amapera) |
Ubucucike bwuzuye | <100 / cm² | <50 / cm² |
Igipimo cyo gukura | 0,5-5 mm / h | 0.1-2 mm / h |
Gukoresha Ingufu | 50-80 kWt / kg | 80-120 kWt / kg |
Porogaramu | LED substrate, GaN epitaxy | Windows nziza, ingoti nini |
Igiciro | Guciriritse (gushora ibikoresho bihanitse) | Hejuru (inzira igoye) |
Ibyingenzi
1. Inganda zikoresha inganda
GaN Epitaxial Substrates: Wafers ya santimetero 2-8 (TTV <10 μ m) kuri Micro-LEDs na diode ya laser.
SOI Wafers: Ubuso bwubuso <0.2 nm kuri chip-3D.
2. Amashanyarazi
UV Laser Windows: Ihangane 200 W / cm² yubucucike bwa optique ya lithographie.
Ibikoresho bitagira ingano: Coefficient ya Absorption <10⁻³ cm⁻¹ yo gushushanya amashusho.
3. Ibikoresho bya elegitoroniki
Igikoresho cya Smartphone Kamera: Mohs gukomera 9, 10 × kunanirwa kurwanya.
Isaha ya Smartwatch Yerekana: Ubunini bwa 0.3–0.5 mm, kohereza> 92%.
4. Ingabo zo mu kirere
Windows ya reaction ya kirimbuzi Windows: Kwihanganira imirasire igera kuri 10¹⁶ n / cm².
Indorerwamo Zirenze-Laser Indorerwamo: Guhindura ubushyuhe <λ / 20 @ 1064 nm.
Serivisi za XKH
1. Guhindura ibikoresho
Igishushanyo mbonera cy'Urugereko: Φ200-400 mm iboneza rya wafer ya santimetero 2-12.
Guhindura Doping: Gushyigikira bidasanzwe-isi (Er / Yb) hamwe ninzibacyuho-icyuma (Ti / Cr) doping kubintu byihariye bya optoelectronic.
2. Inkunga iherezo-iherezo
Gukoresha uburyo bwiza: Byabanje kwemezwa (50+) kubikoresho bya LED, ibikoresho bya RF, hamwe nibice bikomye.
Umuyoboro wa Global Service: 24/7 kwisuzumisha kure no kubungabunga kurubuga hamwe na garanti yamezi 24.
3. Gutunganya Hasi
Ibihimbano bya Wafer: Gukata, gusya, no gusya kuri waferi ya santimetero 12-12 (C / A-indege).
Ibicuruzwa byongerewe agaciro:
Ibikoresho byiza: Windows ya UV / IR (uburebure bwa 0,5-50 mm).
Ibikoresho bya Grade-Grade: Cr³⁺ ruby (Yemejwe na GIA), Ti³⁺ inyenyeri safi.
4. Ubuyobozi bwa tekinike
Impamyabumenyi: Wafers yubahiriza EMI.
Patent: Ipente yibanze muburyo bwa CZ guhanga udushya.
Umwanzuro
Ibikoresho byuburyo bwa CZ bitanga ibipimo binini-bihuza, igipimo cy-inenge nkeya, hamwe niterambere rihamye, bigatuma iba igipimo cyinganda kuri LED, semiconductor, hamwe na porogaramu zo kwirwanaho. X.

