Ibikoresho byo Kuzamura Ingufu bya Semiconductor Laser Bihindura Uburyo Ingot Thinning

Ibikoresho byo Kuzamura Ingufu bya Semiconductor Laser Bihindura Ingufu zo Kugabanya Ingot Ishusho Igaragara

Ibisobanuro bigufi:

Ibikoresho byo Kuzamura Ingufu za Laser ya Semiconductor ni igisubizo cyihariye cyane cyakorewe mu nganda kugira ngo habeho kugabanya neza kandi bitagoranye ingots za semiconductor hakoreshejwe tekiniki zo kuzamura ziterwa na laser. Ubu buryo bugezweho bugira uruhare runini mu mikorere ya semiconductor wafer igezweho, cyane cyane mu gukora wafers zoroshye cyane zikoreshwa mu byuma bikoresha ingufu nyinshi, LED, na RF. Binyuze mu gutuma ibice byoroheje bitandukana n'ingts nini cyangwa substrates z'abaterankunga, Semiconductor Laser Lift-Off Equipment ihindura uburyo ingots zo kugabanya inguts binyuze mu gukuraho intambwe zo gukata, gusya, no gusya imiti.

Ohereza imeri kuri twe

Ibiranga

Ishusho irambuye

Incamake y'ibicuruzwa bya Semiconductor Laser Lift-Off Equipment

Gugabanya ibikoresho bya semiconductor, nka gallium nitride (GaN), silicon carbide (SiC), na safiro, akenshi bisaba imbaraga nyinshi, gusesagura, kandi bishobora kwangirika cyangwa kwangirika k'ubuso. Mu buryo bunyuranye, Semiconductor Laser Lift-Off Equipment itanga ubundi buryo budasenya kandi bunoze bugabanya igihombo cy'ibikoresho n'ubuso mu gihe byongera umusaruro. Ishyigikira ubwoko bwinshi bw'ibikoresho bya crystalline n'ibivanze kandi ishobora guhuzwa neza mu miterere ya semiconductor ikora imbere cyangwa hagati.

Hamwe n'ubuso bw'uburebure bwa laser bushobora guhindurwa, sisitemu zo kwibandaho zihuye n'imashini, hamwe n'udupira twa wafer dukoreshwa mu gukata, iki gikoresho kibereye cyane gukata ingot, gukora lamella, no gukuraho filime nto cyane ku nyubako z'ibikoresho bihagaze cyangwa kwimura urwego rwa heteroepitaxial.

Igipimo cy'ibikoresho byo kuzamura imirasire ya laser bya semiconductor

Uburebure bw'umuraba	IR/SHG/THG/FHG
Ubugari bw'ingufu	Nanosegonda, Picosegonda, Femtosegonda
Sisitemu y'urumuri	Sisitemu idahinduka y'amatara cyangwa sisitemu ya Galvano-optical
Icyiciro cya XY	mm 500 × mm 500
Urutonde rw'ibicuruzwa	mm 160
Umuvuduko w'urugendo	Ntarengwa 1,000 mm/segonda
Gusubiramo	± 1 μm cyangwa munsi yayo
Ubuziranenge bw'umwanya uhari:	± 5 μm cyangwa munsi yayo
Ingano ya Wafer	Santimetero 2–6 cyangwa byahinduwe
Kugenzura	Windows 10,11 na PLC
Ingufu z'amashanyarazi	AC 200 V ± 20 V, Icyerekezo kimwe, 50/60 kHz
Ibipimo byo hanze	2400 mm (Ubugari) × 1700 mm (Ubugari) × 2000 mm (Ubugari)
Uburemere	ibiro 1,000

Ihame ry'imikorere ry'ibikoresho byo kuzamura imirasire ya laser bya semiconductor

Uburyo bw'ingenzi bw'ibikoresho bya Semiconductor Laser Lift-Off Equipment bushingiye ku gusenya cyangwa gukuraho ubushyuhe bw'izuba ku murongo uri hagati y'ingot y'umutanga n'urwego rwa epitaxial cyangwa target. Laser ya UV ifite ingufu nyinshi (ubusanzwe KrF kuri 248 nm cyangwa laser ya UV ifite imiterere ikomeye hafi ya 355 nm) yibanda ku bikoresho by'umutanga bibonerana cyangwa bibonerana, aho ingufu zinjira mu buryo bwihariye ku burebure bwagenwe.

Uku gukurura ingufu mu gace runaka bituma habaho urwego rwa gaze rufite umuvuduko mwinshi cyangwa urwego rwo kwagura ubushyuhe ku gice cyo hejuru, ibyo bigatangiza urwego rwo hejuru rwa wafer cyangwa urwego rw'igikoresho uhereye ku gice cyo hasi cya ingot. Iyi gahunda itunganywa neza hakoreshejwe uburyo bwo guhindura ibipimo nk'ubugari bwa pulse, fluence ya laser, umuvuduko wo gushakisha, n'ubujyakuzimu bw'umurongo wa z. Umusaruro ni agace gato cyane—akenshi kari hagati ya µm 10 na 50—gatandukanywa neza n'agace k'ibanze kadafite ubushyuhe bwa mekanike.

Ubu buryo bwo gukuraho imirasire hakoreshejwe laser mu gukata ingot burinda gutakaza no kwangirika k'ubuso bifitanye isano no gukata insinga za diyama cyangwa gukoresha ibyuma bikozwe mu buryo bwa mechanical. Bunabungabunga ubuziranenge bwa kristale kandi bugabanya ibisabwa mu gusiga irangi, bigatuma ibikoresho bya Semiconductor Laser Lift-Off Equipment biba igikoresho gihindura umukino wo gukora wafer mu gisekuru gitaha.

Ibikoresho byo Kuzamura Ingufu bya Semiconductor Laser Bihindura Ingot Thinning 2

Imikoreshereze y'ibikoresho byo gukuraho imirasire ya laser bya semiconductor

Ibikoresho byo Kuzamura Ingufu bya Laser bya Semiconductor bifite akamaro kanini mu kugabanya imashini mu bikoresho bitandukanye bigezweho n'ubwoko bw'ibikoresho, harimo:

GaN na GaAs Ingot Thinning ku bikoresho by'amashanyarazi
Ifasha mu gukora wafer nto kugira ngo transistors na diode bikore neza kandi bidakoresha ingufu nyinshi.

Gusubiramo SiC Substrate no Gutandukanya Lamella
Yemerera gukuraho wafer-scale kuva kuri substrates nyinshi za SiC kugira ngo ibikoresho bihagaze kandi wafer ikoreshwe.

Gukata Wafer ya LED
Yorohereza gukura kw'ibice bya GaN bivuye mu tubuye duto twa safiro kugira ngo bikore substrates za LED nto cyane.

Gukora ibikoresho bya RF na Microwave
Ishyigikira imiterere ya transistor ifite electron-mobility nyinshi cyane (HEMT) ikenewe muri sisitemu ya 5G na radar.

Guhindura urwego rwa Epitaxial
Ikura neza ibice bya epitaxial mu bimera bya crystalline kugira ngo yongere ikoreshwe cyangwa ihuzwe mu miterere ya hetero.

Uturemangingo tw'izuba duto cyane hamwe n'ingufu z'izuba
Ikoreshwa mu gutandukanya ibice bito bigabanya ingufu kugira ngo habeho uturemangingo tw’izuba tworoshye cyangwa dukora neza cyane.

Muri buri rwego, ibikoresho byo gukuraho imirasire ya laser bitanga ububasha budasanzwe ku bunini, ubwiza bw'ubuso, n'ubuziranenge bw'urwego.

Ibyiza byo Kugabanya Ingot hakoreshejwe Laser

Igihombo cy'ibikoresho bya Zero-Kerf
Ugereranyije n'uburyo gakondo bwo gukata wafer, inzira ya laser ituma hafi 100% by'ibikoresho bikoreshwa.

Umuhangayiko muke n'ihindagurika rito
Kutaguza icyuma mu buryo butarimo gukorana bikuraho guhindagura kwa mashini, bigabanya imiterere y'umuheto wa wafer n'imikurire mito.

Kubungabunga Ubuziranenge bw'Ubuso
Nta gusimbuza cyangwa gusiga irangi nyuma yo kugabanya ubukana bw'ibara mu bihe byinshi, kuko gukuraho irangi hakoreshejwe laser bigumana ubuziranenge bw'ibara ryo hejuru.

Ingufu nyinshi n'uburyo bwikora byiteguye
Ishobora gutunganya amagana y'ibikoresho bya substrate kuri buri simburana hamwe no gupakira/gupakurura mu buryo bwikora.

Ishobora Guhuzwa n'Ibikoresho Bitandukanye
Ihuye na GaN, SiC, safiro, GaAs, n'ibikoresho bishya bya III-V.

Kubungabunga ibidukikije mu buryo butekanye
Bigabanya ikoreshwa ry'ibintu bitera uburibwe n'imiti ikaze isanzwe mu bikorwa byo kugabanya uburibwe bishingiye ku rubura.

Kongera gukoresha Substrate
Ibikoresho by'abaterankunga bishobora kongera gukoreshwa mu bihe byinshi byo kuzamura ibikoresho, bigabanya cyane ikiguzi cy'ibikoresho.

Ibibazo Bikunze Kubazwa (FAQ) ku Bikoresho Bishinzwe Kuzamura Imirasire ya Laser Bikoresha Semiconductor

Q1: Ni ubuhe bunini bw'ibikoresho bya Semiconductor Laser Lift-Off Equipment bishobora kugera ku bice bya wafer?
A1:Ubunini busanzwe bw'ibice buri hagati ya µm 10 na µm 100 bitewe n'ibikoresho n'imiterere yabyo.

Q2: Ese ibi bikoresho bishobora gukoreshwa mu gukata uduce dukozwe mu bikoresho bitagaragara nka SiC?
A2:Yego. Mu guhindura uburebure bw'umurambararo wa laser no kunoza ubuhanga bwo guhuza (urugero, imiterere y'uruhererekane rw'ibikoresho), ndetse n'ibikoresho bitagaragara neza bishobora gutunganywa.

Q3: Ni gute substrate y'umuterankunga ihuzwa mbere yo gukuraho laser?
A3:Sisitemu ikoresha module zo guhuza amashusho zishingiye kuri sub-micron hamwe n'ibitekerezo bivuye ku bimenyetso bya fiducial na scan zo kugarura ishusho y'ubuso.

Q4: Ni igihe kingana iki giteganijwe cyo gukora igikorwa kimwe cyo gukuraho imashini hakoreshejwe laser?
A4:Bitewe n'ingano n'ubunini bwa wafer, imyitozo isanzwe imara iminota 2 kugeza ku 10.

Q5: Ese iyi gahunda isaba ahantu ho gukorera isuku?
A5:Nubwo atari itegeko, gushyira hamwe isuku mu cyumba cyo kunyweramo ni byiza kugira ngo isuku y’ubutaka ikomeze kuba nziza kandi ibikoresho birusheho kuboneka neza mu gihe cy’ibikorwa byo mu rwego rwo hejuru.

Ku bijyanye natwe

XKH yihariye mu iterambere, gukora, no kugurisha ikirahure cyihariye cya optique n'ibikoresho bishya bya kristu. Ibicuruzwa byacu bitanga ibikoresho by'ikoranabuhanga bya optique, ibikoresho by'ikoranabuhanga bikoreshwa n'abantu, n'ibya gisirikare. Dutanga ibikoresho bya optique bya Safira, ibifuniko bya lens za telefoni zigendanwa, Ceramics, LT, Silicon Carbide SIC, Quartz, na semiconductor crystal wafers. Dufite ubuhanga n'ibikoresho bigezweho, turakora neza mu gutunganya ibicuruzwa bitari iby'ubuziranenge, tugamije kuba ikigo gikomeye mu ikoranabuhanga rigezweho mu bikoresho bya optoelectronic.