12inch Byuzuye Automatic Precision Dices Yabonye Ibikoresho Wafer Yeguriwe Gukata Sisitemu ya Si / SiC & HBM (Al)
Ibipimo bya tekiniki
Parameter | Ibisobanuro |
Ingano y'akazi | Φ8 ", Φ12" |
Spindle | Dual-axis 1.2 / 1.8 / 2.4 / 3.0, Max 60000 rpm |
Ingano | 2 "~ 3" |
Y1 / Y2 Axis
| Kwiyongera k'intambwe imwe: 0.0001 mm |
Umwanya uhagaze neza: <0.002 mm | |
Urwego rwo gutema: mm 310 | |
X Axis | Kugaburira umuvuduko: 0.1-600 mm / s |
Z1 / Z2 Axis
| Kwiyongera k'intambwe imwe: 0.0001 mm |
Umwanya uhagaze neza: ≤ 0.001 mm | |
x Axis | Umwanya uhagaze neza: ± 15 " |
Sitasiyo
| Umuvuduko wo kuzunguruka: 100–3000 rpm |
Uburyo bwo gukora isuku: Kwoza imodoka & kuzunguruka-byumye | |
Umuvuduko Ukoresha | Icyiciro cya 3 380V 50Hz |
Ibipimo (W × D × H) | 1550 × 1255 × 1880 mm |
Ibiro | 2100 kg |
Ihame ry'akazi
Ibikoresho bigera ku buryo bunoze binyuze mu ikoranabuhanga rikurikira:
1.High-Rigidity Spindle Sisitemu: Umuvuduko wo kuzenguruka ugera kuri 60.000 RPM, ufite ibyuma bya diyama cyangwa imitwe ikata laser kugirango ihuze nibintu bitandukanye.
2.Multi-Axis Igenzura ryimikorere: X / Y / Z-axis ihagaze neza ya ± 1μm, ihujwe nu munzani uhanitse cyane kugirango ushishoze neza.
3.Ubushishozi Bwiza bwo Guhuza: Kwiyemeza gukomeye CCD (5 megapixels) ihita imenya guca umuhanda kandi ikishyura ibintu byangiritse cyangwa bidahuye.
4.Gukuraho & Gukuramo umukungugu: Sisitemu yo gukonjesha amazi meza hamwe no gukuramo ivumbi rya vacuum kugirango ugabanye ingaruka ziterwa nubushyuhe hamwe nuduce twanduye.
Gukata Uburyo
1.Icyuma cya Blade: Birakwiriye kubikoresho bya semiconductor gakondo nka Si na GaAs, hamwe n'ubugari bwa kerf ya 50-100 mm.
2.Ibikoresho bya Laser Dating: Byakoreshejwe kuri waferi ya ultra-thin (<100μm) cyangwa ibikoresho byoroshye (urugero, LT / LN), bigafasha gutandukana nta guhangayika.
Ibisanzwe
Ibikoresho bihuye | Umwanya wo gusaba | Ibisabwa |
Silicon (Si) | IC, ibyuma bya MEMS | Gukata neza-gukata, gukata <10μm |
Silicon Carbide (SiC) | Ibikoresho by'ingufu (MOSFET / diode) | Kugabanya ibyangiritse bike, gucunga neza ubushyuhe |
Gallium Arsenide (GaAs) | Ibikoresho bya RF, ibikoresho bya optoelectronic | Gukumira micro-crack, kugenzura isuku |
LT / LN Substrates | SAW muyunguruzi, modulator nziza | Gukata nta mananiza, kubungabunga ibintu bya piezoelectric |
Ceramic Substrates | Amashanyarazi, ibikoresho bya LED | Gukomera cyane-gutunganya ibikoresho, kuruhande |
QFN / DFN Amakadiri | Gupakira neza | Multi-chip icyarimwe gukata, gukora neza |
WLCSP Wafers | Gupakira urwego | Kwangiriza ubusa kwangirika kwa ultra-thin wafers (50μm) |
Ibyiza
1. Umuvuduko wihuse wa cassette ikadiri yo gusikana hamwe nimpuruza zo gukumira impanuka, kwimurwa byihuse, hamwe nubushobozi bukomeye bwo gukosora.
2. Gukoresha uburyo bubiri bwo guca ibintu, kuzamura imikorere hafi 80% ugereranije na sisitemu imwe.
3. Imipira yumupira itumizwa mu mahanga, umurongo uyobora umurongo, hamwe na Y-axis yo gufunga igipimo gifunze-kugenzura, bigatuma umutekano uramba wigihe kirekire cyo gutunganya neza.
4. Byuzuye byuzuye gupakira / gupakurura, kwimura umwanya, kugabanya guhuza, no kugenzura kerf, kugabanya cyane ibikorwa byakazi (OP).
5.Gantry-yuburyo bwa spindle yubatswe, hamwe byibuze byibuze bibiri-bingana na 24mm, bigafasha guhuza n'imihindagurikire yagutse kubikorwa byo gukata kabiri.
Ibiranga
1.Gupima uburebure-budahuye bwo gupima uburebure.
2.Multi-wafer ikubye kabiri-gukata kumurongo umwe.
3.Ibikorwa bya Calibibasi, kugenzura kerf, hamwe na sisitemu yo gutahura ibyuma.
4.Gushyigikira inzira zitandukanye hamwe noguhitamo byikora guhuza algorithms.
5.Ibikorwa byo kwikosora neza hamwe nigihe-nyacyo cyo kugenzura imyanya myinshi.
6.Ubwa mbere-kugenzura ubushobozi nyuma yo gutangira.
7.Ibikoresho byoguhindura uruganda modules nibindi bikorwa byubushake.
Serivise y'ibikoresho
Dutanga inkunga yuzuye kuva guhitamo ibikoresho kugeza igihe kirekire:
(1) Iterambere ryihariye
· Saba icyuma / laser gikata ibisubizo bishingiye kumiterere yibintu (urugero, ubukana bwa SiC, ubwitonzi bwa GaAs).
· Tanga icyitegererezo cyubusa kugirango ugenzure ubuziranenge bwo gukata (harimo gukata, ubugari bwa kerf, uburinganire bwubutaka, nibindi).
(2) Amahugurwa ya tekiniki
· Amahugurwa yibanze: Gukora ibikoresho, guhindura ibipimo, kubungabunga bisanzwe.
· Amasomo Yambere: Gutezimbere uburyo bwibikoresho bigoye (urugero, gukata stress ya LT substrates).
(3) Nyuma yo kugurisha
· 24/7 Igisubizo: Kwipimisha kure cyangwa ubufasha kurubuga.
· Ibikoresho by'ibikoresho byo gutanga: Ibikoresho byabitswe, ibyuma, nibikoresho bya optique kugirango bisimburwe vuba.
· Kubungabunga Kwirinda: Guhindura buri gihe kugirango ugumane ukuri kandi wongere ubuzima bwa serivisi.

Ibyiza byacu
Experience Inararibonye mu nganda: Gukora 300+ ku isi yose hamwe n’abakora ibikoresho bya elegitoroniki.
Technology Gukata-Ikoranabuhanga rya tekinoroji: Imirongo iboneye hamwe na sisitemu ya servo byemeza ko inganda ziyobora neza.
Network Network Service Network: Igipfukisho muri Aziya, Uburayi, na Amerika ya ruguru kugirango ubone inkunga.
Kubizamini cyangwa kubaza, twandikire!

