Sisitemu yo gukata ibikoresho bya santimetero 12 ikoresha uburyo bwa "First Automatic Precision Dicing Saw" ya Sisteme yo gukata ya Si/SiC na HBM (Al)

Ibisobanuro bigufi:

Ibikoresho byo gukata neza byikora ni sisitemu yo gukata neza cyane yagenewe inganda za semiconductor na elegitoroniki. Irimo ikoranabuhanga rigezweho ryo kugenzura imikorere n'uburyo bwo kureba neza kugira ngo igere ku rwego rwa micron. Ibi bikoresho bikwiriye mu gukata neza ibikoresho bitandukanye bikomeye kandi byoroshye, harimo:
1. Ibikoresho bya Semiconductor: Silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), substrates za lithium tantalate/lithium niobate (LT/LN), nibindi.
2. Ibikoresho byo gupakira: Ibikoresho bya ceramic, QFN/DFN frames, ibikoresho bya BGA.
3. Ibikoresho bikora: Imashini ziyungurura amazi zikoresha ikoranabuhanga rya SAW, modules zikonjesha zikoresha amashanyarazi, WLCSP wafers.

XKH itanga serivisi zo gupima imikorere y’ibikoresho no guhindura uburyo ibikoresho bikoreshwa kugira ngo ikore neza ibyo abakiriya bakeneye mu musaruro, itanga ibisubizo byiza haba ku bushakashatsi no mu iterambere ndetse no gutunganya ibikoresho mu buryo butandukanye.


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  • Ibiranga

    Ibipimo bya tekiniki

    Igipimo

    Ibisobanuro

    Ingano y'akazi

    Φ8", Φ12"

    Ipine

    Umuyoboro w'imirongo ibiri 1.2/1.8/2.4/3.0, ntarengwa 60000 rpm

    Ingano y'icyuma

    2" ~ 3"

    Y1 / Y2 Axis

     

     

    Intambwe imwe yo kwiyongera: 0.0001 mm

    Ubuziranenge bw'aho umuntu aherereye: < 0.002 mm

    Intera yo gutema: 310 mm

    Umurongo wa X

    Intera y'umuvuduko w'ibiryo: 0.1–600 mm/s

    Umurongo wa Z1 / Z2

     

    Intambwe imwe yo kwiyongera: 0.0001 mm

    Uburyo bwo gushyiramo neza: ≤ 0.001 mm

    θ Axis

    Uburyo bwo gushyiramo neza: ± 15"

    Aho gusukura

     

    Umuvuduko wo kuzenguruka: 100–3000 rpm

    Uburyo bwo gusukura: Koza no kumutsa mu buryo bwikora

    Voltage yo gukoresha

    Ibyiciro bitatu bya 380V 50Hz

    Ingano (Ubwinshi × Ubwinshi × Ubwinshi)

    1550×1255×1880 mm

    Uburemere

    ibiro 2100

    Ihame ry'imikorere

    Ibikoresho bitunganya neza cyane binyuze mu ikoranabuhanga rikurikira:
    1. Sisitemu yo gusimbuka ifite imbaraga nyinshi: Umuvuduko wo kuzenguruka ugera ku 60.000 RPM, ifite ibyuma bya diyama cyangwa imitwe yo gukata ya laser kugira ngo ihuze n'imiterere itandukanye y'ibikoresho.

    2. Igenzura ry'Ingendo mu Murongo Utandukanye: Ubuziranenge bwo gushyiramo X/Y/Z bwa ±1μm, bufatanye n'ibipimo byo gukata neza cyane kugira ngo inzira zo gukata zitagira aho zinyura.

    3. Kuboneza imiterere mu buryo bw'ubwenge: CCD ifite ubushobozi bwo hejuru (megapixels 5) ihita imenya imihanda ikata kandi igakemura ikibazo cyo guhindagurika cyangwa kutumvikana neza kw'ibintu.

    4. Gukonjesha no Gukuraho Umukungugu: Uburyo bwo gukonjesha amazi meza hamwe no gukuraho umukungugu uva mu cyuma gikonjesha kugira ngo bigabanye ingaruka z'ubushyuhe n'ubwandu bw'udukoko.

    Uburyo bwo Gukata

    1. Gukata icyuma: Bikwiriye ibikoresho gakondo bya semiconductor nka Si na GaAs, bifite ubugari bwa kerf bwa ​​50–100μm.

    2. Gukata uduce tw’icyuma gikozwe muri laser: Bikoreshwa ku duce tw’icyuma duto cyane (<100μm) cyangwa ibikoresho byoroshye (urugero, LT/LN), bigatuma habaho gutandukanya ibintu mu buryo butagira stress.

    Porogaramu zisanzwe

    Ibikoresho Bihuye Ahantu ho Gusaba Ibisabwa mu gutunganya
    Silikoni (Si) Ibyuma bya IC, MEMS Gukata neza cyane, gukata ibice <10μm
    Karubide ya Silicone (SiC) Ibikoresho by'amashanyarazi (MOSFET/diode) Gukata ibintu byangiritse bike, kunoza imicungire y'ubushyuhe
    Gallium Arsenide (GaAs) Ibikoresho bya RF, utumashini twa optoelectronic Kurinda uduce duto tw’isuku, kurwanya isuku
    Ibice bya LT/LN Akayunguruzo ka SAW, modulators z'urumuri Gukata nta stress, kubungabunga imiterere ya piezoelectric
    Ibikoresho bya Ceramic Modules z'amashanyarazi, gupakira LED Gutunganya ibikoresho bikomeye cyane, ubugari bw'inkombe
    Amakadiri ya QFN/DFN Gupakira bigezweho Gukata ama-chip menshi icyarimwe, kunoza imikorere
    WLCSP Wafers Gupfunyika ku rwego rwa wafer Gukata uduce tw'udupira tworoheje cyane (50μm) nta kwangirika kwabyo

     

    Ibyiza

    1. Gusuzuma amakaseti yihuta cyane hamwe n'imyanzuro yo gukumira impanuka, gushyira mu mwanya wihuse wo kohereza amakuru, hamwe n'ubushobozi bukomeye bwo gukosora amakosa.

    2. Uburyo bwo gukata imigozi ibiri bwarakozwe neza, bunongera imikorere ku kigero cya 80% ugereranije na sisitemu imwe.

    3. Utugozi tw'umupira twinjijwe mu mahanga neza, ubuyobozi bw'umurongo, n'igenzura rya Y-axis grating scale closed-loop control, biha umutekano mu gihe kirekire mu gutunganya neza.

    4. Gupakira/gupakurura byuzuye ikoranabuhanga, gushyira aho kohereza ibintu biherereye, gukata aho bihurira, no kugenzura aho biherereye, bigabanya cyane akazi k'umukoresha (OP).

    5. Imiterere yo gushyiraho spindle mu buryo bwa Gantry, ifite nibura intera ya mm 24, ituma habaho kwihutisha inzira zo gukata spindle ebyiri.

    Ibiranga

    1. Gupima uburebure butarimo uburebure buhanitse cyane.

    2. Gukata uduce dutatu tw'amacupa ku isahani imwe.

    3. Gupima icyuma mu buryo bwikora, kugenzura icyuma, no kumenya aho icyuma cyacitse.

    4. Ishyigikira inzira zitandukanye hamwe na algorithms zo guhuza zikora ku buryo bwikora.

    5. Imikorere yo kwikosora amakosa no kugenzura ahantu henshi mu buryo nyabwo.

    6. Ubushobozi bwo kugenzura bwa mbere nyuma yo gukata ibice.

    7. Moduli zishobora guhindurwa mu buryo bwikora n'izindi nshingano zidakenewe.

    Ibikoresho bihuye

    Ibikoresho byo gukata neza byikora byikora 4

    Serivisi z'ibikoresho

    Dutanga ubufasha bwuzuye kuva ku guhitamo ibikoresho kugeza ku kubungabunga igihe kirekire:

    (1) Iterambere ryihariye
    · Saba imiti yo gukata icyuma/lazeri ishingiye ku miterere y'ibikoresho (urugero, ubukana bwa SiC, ububobere bwa GaAs).

    · Tanga ikizamini cy'ingero ku buntu kugira ngo urebe ko ari cyiza (harimo gukata, ubugari bw'inkengero, ubugari bw'ubuso, nibindi).

    (2) Amahugurwa ya tekiniki
    · Amahugurwa y'ibanze: Imikoreshereze y'ibikoresho, guhindura ibipimo, kubungabunga buri gihe.
    · Amasomo agezweho: Gutunganya uburyo bwo gukoresha ibikoresho bigoye (urugero, guca ibice bya LT mu buryo budafite stress).

    (3) Inkunga nyuma yo kugurisha
    · Igisubizo cya saa 24/7: Gusuzuma indwara hakoreshejwe ikoranabuhanga cyangwa ubufasha aho umuntu akorera.
    · Ibikoresho bisimbura ibindi: Imashini zikozwe mu byuma, ibyuma, n'ibikoresho by'urumuri kugira ngo bisimburwe vuba.
    · Kubungabunga impanuka: Gupima buri gihe kugira ngo bikomeze kuba byiza no kongera igihe cyo gukora.

    90bf3f9d-353c-408a-a804-56eb276dea24_ 副本

    Ibyiza byacu

    ✔ Ubunararibonye mu nganda: Gukorera inganda zikora ibikoresho bya semiconductor n'ibikoresho by'ikoranabuhanga zirenga 300 ku isi.
    ✔ Ikoranabuhanga Rigezweho: Amabwiriza agezweho hamwe na sisitemu za servo bitanga umutekano ukomeye mu nganda.
    ✔ Urusobe rw'imirimo ku isi: Ubufasha muri Aziya, i Burayi, na Amerika ya Ruguru butangwa mu rwego rwo gufasha abaturage bo mu gace runaka.
    Ku bijyanye n'ibizamini cyangwa ibibazo, twandikire!

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